Principle Duties / Responsibilities:

In this role, you will lead manufacturing and production optimisation initiatives for several high-profile products from early-stage development through mass production and sustaining engineering phases. As a leader within our development team, you will build and maintain positive working relationships between technical teams, contract manufacturing partners and business/product owners to deliver on strategic product development and sustaining initiatives.

A successful Senior Manufacturing Engineer is energetic, detail oriented, motivated and an excellent communicator. They should be familiar with the different stages of product development, manufacturing, project management methodologies and working with contract manufacturing partners to create best-in-class consumer electronic devices.

The successful applicant is:

• Able to analyse production processes, schedules, methods and other data to provide management with justified recommendations for improving various manufacturing process.
• Focused on continuous production improvement opportunities
• Able to review and calculate labor, material and other production costs to identify areas of cost reduction and improve manufacturing efficiencies
• Well versed in quality control processes identifies areas for improvements in quality control.
• Excited to champion colour variation, limited edition and sustaining engineering related efforts to further promote and improve our growing line of PlayStation products
• Experienced in manufacturing, process engineering, logistics, strategic component sourcing, risk mitigation and/or supply chain management.
• Results oriented with attention to detail and a strategic long-term planning perspective
• Proficient at addressing various partners from individual contributors, up through senior leadership.
• Technically proficient and has prior contract manufacturing partner management experience.
• A liaison to vendors and technical teams to design, develop and deliver products on time and within budget
• Familiar with product lifecycle management methodologies and tools such as Arena

Required Knowledge / Skills:

• Self-motivated with incredible attention to detail
• Deep understanding of manufacturing methodologies related to consumer electronic device production
• Excellent written and verbal communication skills
• Must be inventive and seek solutions through information gathering, partner discussions, and/or judgment calls
• Experience in the video game industry is not required, but interest and passion for gaming, digital entertainment, consumer electronics, and technology is a plus

Qualifications:

Required Experience / Education:

• Bachelor’s degree or equivalent in engineering related fields preferred.
• 7+ years of validated experience in product development or manufacturing related roles with a strong background of supporting the development of new consumer electronic devices
• Led overseas manufacturing partners in planning and performing development builds and new product development stages
• Capable of leading development schedules, production planning and materials readiness efforts to meet product development landmarks.
• Coordinating production readiness with engineering, operations, and internal/external teams
• Optimise production and throughput
• Proficient with multiple software platforms such as MS Office, Confluence, Jira

Working Conditions:

• Strategically located in Taiwan to better support our Asia manufacturing supply chain and Tokyo team member interactions
• International travel required. Estimated 15 - 20%
• Individual Contributor: Does not have direct supervisory responsibilities nor budgetary or hiring accountabilities

ASM is recruiting for Senior Engineer , Field Process in our ALD/EPI/PEALD/CVD business function located in Taichung. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
 

Responsibilities:

• Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
• Drive and manage new product penetration & installation and subsequent process development.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Drive continuous improvement of the customer experience through team, process and support tool development.
• Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.

Qualifications:

• PhD is preferred; Master/PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical engineering or a related discipline.
• Minimum of 3-5 years’ experience as process engineer, or a combination of academic and industry experience with relevant expertise in PEALD, PECVD, and thin films deposition techniques
• Strong foundational knowledge and hands on experience with semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and thin film ALD deposition processes and equipment.
• Candidates with a track record of optimizing film deposition and process development, especially with ALD, PEALD, PECVD, Epitaxy, will be given preference
• Strong industry experience managing teams that support complex instrumentation, applications and informatics by phone and at customer locations
• Clear and concise both English/Mandarin verbal and written communications

Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet packaging to join Tenstorrent’s Packaging team. You will drive advanced package technology and reliability in close partnership with foundries and OSATs, helping push performance and manufacturability for next‑generation AI/ML products.

This role is hybrid, based out of Santa Clara, CA or Taipei City, TW.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are 

• Advanced packaging engineer with hands-on 2.5D/3D experience (CoWoS-R/L, FOCoS, EMIB, FCBGA, organic substrates, silicon interposers, embedded Si/eCB, micro-bumps, BGAs).
• Strong in reliability and failure analysis for advanced packaging, including qualification, root cause analysis, and corrective actions.
• Deep understanding of process flows and materials (polyimide, ABF, core, underfill, mold compound) and their interactions (warpage, stress, delamination, mechanical risk).
• Proven track record working with foundries/OSATs on NPI, design rules, excursions, yield/cost optimization, and production ramp, with clear communication and cross-functional collaboration.

What we need 

• Own advanced package technology implementation for 2.5D/3D chiplet products, including technology choices, process integration, and manufacturability.
• Act as primary technical interface to foundries/OSATs: align capabilities and design rules, manage excursions, drive yield, define/track test vehicles, and coordinate FA.
• Partner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs.
• MS/PhD in a relevant field (Materials, Mechanical, Electrical, Physics, or related) and 5+ years in advanced packaging for high-performance semiconductors from NPI through production (2.5D/3D flows such as CoWoS, FOCoS, EMIB, FCBGA or equivalent).

What you will learn 

• Deeper exposure to leading-edge 2.5D/3D packaging for high-performance AI/ML and chiplet-based architectures.
• How to balance performance-driven architecture with mechanical and reliability constraints to make robust package technology decisions.
• Ways to use AI- and automation-driven methods to accelerate risk assessment, qualification planning, and technical documentation.
• Best practices for building strategic OSAT and foundry partnerships that enable new capabilities while scaling reliable high-volume production.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Job's mission

Introduction to the job. Example:

As a Field Service Engineer (FSE) at ASM, you’ll be at the heart of our customer operations. This role is your chance to gain hands-on experience with our advanced semiconductor equipment and contribute to our customers’ success by ensuring our technology performs flawlessly. Join a supportive team and grow your technical skills in a fast-moving, innovative environment.

What you will be working on

• Order Management & Fulfillment & Setup targets according to agreed SLAs and drive for achievements
• Lookahead Prevention on operation and escalations.
• Foresee demand and plan material delivery to support customer demand and propose / lead long term solution.
• Drive material readiness to deliver against Customer requirements
• Lead discussion /Proactive manage Internal /external customer, attend customer meetings as required by customer needs.
• Lead, present and drive customer interactions with effective outcomes in difficult customer situations.
• Spares Ordering/Processing
  • Urgent customer order expedites.
  • Consignment replenishment.
  • Verifies and tracks customer backorders.
  • Follow all ASM and Customer processes, e.g. RMA, FA, etc.
  • Ensures 100% accuracy on the mutually aligned and agreed upon billing amount to be invoiced, including processing of credits/debits.
• Generates and provides weekly/monthly reports for customer on time delivery.
• Work with Global Planners to ensure any stocking level adjustments that may be required to support customer demand.
• Other duties as assigned.

What we are looking for

• 5~10 years of customer service within a high-tech environment is preferrable or an equivalent combination of education and experience from which comparable knowledge, skills and ability has been achieved.
• Strong interpersonal communication (internal/ external), presentation skills and stakeholder management.
• Intermediate skills in SAP, Microsoft Excel, e.g. VLOOKUP, Pivot Tables, Macros, etc.
• Demonstrated experience in Sales & Distribution and/or Materials Management.
• Comprehension of Customer Service processes, e.g. order management, inventory reconciliations, and invoicing.
• Must have high “sense of urgency” and “know how” for escalation to proper stakeholders.
• Ability to prioritize, manage time effectively and work autonomously.
• Open-minded and remain flexible (approach/work schedule).

What sets you apart

• Bachelor's degree in business administration, supply chain or accounting preferred.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.

ASM is recruiting for Field Process Engineer in our ALD/ CVD/ CMP business function located in North Taiwan. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
 

Responsibilities:

• Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
• Drive and manage new product penetration & installation and subsequent process development.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Drive continuous improvement of the customer experience through team, process and support tool development.
• Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.

Qualifications:

• PhD is preferred; Master/PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical engineering or a related discipline.
• 3+ years experience in thin-film/CVD/ALD/CMP
• Strong understanding of engineering principles related to process operations.
• Basic knowledge of process control systems and equipment.
• Strong analytical and problem-solving skills.
• Excellent communication and teamwork abilities.
• Ability to work in dynamic, fast-paced environments.
• Willingness to travel from 25% up to 50% to field sites as required.

In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly & test process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with silicon and system architects to define package architectures by incorporating manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly, test and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities: 

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry, OSATs and Test vendors.
• Develop package architectures that prioritize Design for Test (DFT), Design for Manufacturing (DFM), and Design for Reliability (DFR). This is critical for achieving product landing zones while simultaneously meeting performance and cost targets.
• Define test chip requirements and manage test chip design required for 3D package assembly and test process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications:

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• Minimum of 10 years' hands-on experience in package assembly and test process development, specifically working with Outsourced Semiconductor Assembly and Test (OSAT) providers.
• Knowledge of Chip-on-wafer process flow, materials, and equipment requirements.
• Experience in test chip and assembly test vehicle design.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.
• Must be based in Taiwan.
• Fluent in both English and Mandarin Chinese, with the ability to confidently lead high-stakes meetings in either language.

Preferred Qualifications:

• Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong project ownership, with a history of driving results independently and with minimal supervision.
• Proven track record of developing creative solutions for complex technical challenges.