In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly & test process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with silicon and system architects to define package architectures by incorporating manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly, test and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities: 

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry, OSATs and Test vendors.
• Develop package architectures that prioritize Design for Test (DFT), Design for Manufacturing (DFM), and Design for Reliability (DFR). This is critical for achieving product landing zones while simultaneously meeting performance and cost targets.
• Define test chip requirements and manage test chip design required for 3D package assembly and test process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications:

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• Minimum of 10 years' hands-on experience in package assembly and test process development, specifically working with Outsourced Semiconductor Assembly and Test (OSAT) providers.
• Knowledge of Chip-on-wafer process flow, materials, and equipment requirements.
• Experience in test chip and assembly test vehicle design.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.
• Must be based in Taiwan.
• Fluent in both English and Mandarin Chinese, with the ability to confidently lead high-stakes meetings in either language.

Preferred Qualifications:

• Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong project ownership, with a history of driving results independently and with minimal supervision.
• Proven track record of developing creative solutions for complex technical challenges.

Lead Package Assembly Integrator

In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with package and system architects to incorporate manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities: 

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry and OSAT partners.
• Develop and execute package architectures and designs, ensuring they meet rigorous product performance standards while optimizing for manufacturability and long-term reliability.
• Define test chip requirements and manage test chip design required for 3D package process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications:

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• 10-12 years of experience in wafer scale packaging assembly process development.
• Knowledge of 2D/3D packaging technologies, materials, and equipment requirements.
• Proven ability to define requirements for test chip and assembly test vehicles.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Experience with advanced packaging technologies, including thermal, mechanical, and reliability factors.

Preferred Qualifications:

• Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong project ownership, with a history of driving results independently and with minimal supervision.
• Proven track record of developing creative solutions for complex technical challenges.
• Experience in thermal and mechanical modeling and coding for data analysis.

Job Summary

We are seeking an Optical Packaging Engineer to lead the development of next-generation connectivity solutions. In this role, you will be the bridge between chip design and high-volume manufacturing, driving the optical architecture for Photonic Integrated Circuit (PIC) coupling. You will take ownership of the entire lifecycle from designing custom lenses and detachable Fiber Array Unit (FAU) connectors to managing global OSAT partners for mass production.

If you thrive at the intersection of precision simulation and real-world scalability, this is the role for you.

Responsibilities

• Lead the optical design for PIC-to-PIC and PIC-to-FAU coupling. Design and optimize critical components including Micro-Lens Arrays (MLAs), FAU arrays, and detachable connectors.
• Collaborate on PIC layouts to ensure the chip architecture is optimized for high-efficiency coupling and alignment tolerances.
• Drive the strategy for sub-micron precision alignment both in internal R&D lab and at scale with OSAT partners.
• Establish workflow for Structural, Thermal, and Optical (STOP) analysis. Use these multi-physics insights to predict performance shifts across operating temperatures and mechanical stresses.
• Develop and validate novel optical isolator integration approaches to protect laser sources from back-reflection in high-density PIC environments.
• Lead technical collaboration with OSATs from initial prototyping through validation and into high-volume production (HVM).
• Provide expert guidance on assembly processes to improve throughput, reduce coupling loss, and minimize per-unit costs.
• Partner with electrical, mechanical, and systems teams to ensure seamless product integration and timely delivery of complex modules.
• Distill complex technical findings into clear design concepts and status updates for executive stakeholders and partners.

Required Qualifications

• BS or MS in Optical Engineering, Physics, Mechanical Engineering, or a related field.
• 8-10+ years of hands-on experience in optical or opto-mechanical design, specifically within the photonics or semiconductor industries.
• Proven track record in the design of micro-lenses and FAU arrays in Zemax for PIC-to-PIC and PIC-to-FAU coupling. 
• Hands-on experience with optical alignment and hardware validation.
• Demonstrated experience managing OSATs and suppliers through the full product lifecycle (NPI to high-volume).

Preferred Qualifications

• PhD in Optical Engineering, Physics, Mechanical Engineering, or a related field.
• Familiarity in Lumerical (FDTD/MODE) or similar tools for wave-guide level simulation.
• Hands-on experience with SolidWorks for mechanical integration and connector design.
• Experience with using FEA tools for STOP analysis.
• Expertise in Datacom optical modules and emerging silicon photonics standards.