Tenstorrent is looking  for a STA methodology engineer who owns timing across advanced-node, high-performance, low-power designs, bringing deep expertise with PrimeTime, noise/crosstalk/OCV analysis, and strong scripting skills. They will lead the development and optimization of end-to-end STA methodologies and flows, drive data- and ML-assisted timing automation, and partner closely with logic, physical design, DFT, and EDA vendors to solve complex timing challenges across multiple IPs and products. 

This role is hybrid, based out of Santa Clara, CA, Austin, TX, or Fort Collins, CO.

We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting

Who you are

• An experienced Static Timing Analysis (STA) / timing methodology engineer with a BS/M in Electrical or Computer Engineering (or equivalent experience) 5+ years in industry, focused on high-performance and low-power designs at advanced technology nodes. As well as a deep knowledge of STA tools and techniques, including noise, crosstalk, and OCV analysis.
• You are fluent with PrimeTime and related signoff tools (e.g., PT-SI, PTPX, PT-ECO) and have extensive hands-on experience driving signoff correlation, advanced static timing analysis, and signoff closure.
• You are strong at debugging timing constraints, resolving timing correlation issues, and developing effective timing closure strategies.
• You write robust, production-quality scripts in Tcl, Python, and/or Perl and are comfortable building and maintaining CAD utilities and flow components.

What we need

• A senior methodology owner to lead cross-functional efforts to solve complex timing challenges across multiple IPs, projects, and technology nodes. Experience developing and enhancing STA methodologies across the full RTL-to-GDS flow, including: Early timing estimation and timing feasibility checks. Timing optimization techniques in synthesis and place-and-route. Timing signoff methodologies and criteria. Post-route timing ECO strategies and execution.
• A technical leader to architect, optimize, and maintain production STA flows using industry-standard EDA tools, continuously improving PPA (Power, Performance, Area) and runtime efficiency.
• A methodology engineer who can explore and deploy data-driven and ML-assisted techniques to: Improve STA automation. Predict and prioritize timing risk. Guide optimization strategies across blocks and full-chip. Design, implement, and maintain scalable CAD utilities and STA flow components that improve PPA, robustness, and team productivity.
• A methodology owner who continuously refines workflows and introduces new technologies to ensure robust, PPA-optimized timing solutions across all product lines.

What you will learn

• How to scale STA methodologies across a diverse portfolio of IP and SoC programs, balancing aggressive performance targets with strict power and area constraints.
• Best practices for integrating data-driven and ML-assisted approaches into timing flows to improve automation, predictability, and decision-making.
• How to influence tool roadmaps by partnering closely with leading EDA vendors on advanced-node timing, noise, and variability challenges.
• How to operate within and help shape a rapidly evolving startup design environment, including tradeoffs between quick solutions and long-term methodology investments.
• Deeper cross-functional insight into how logic design, physical design, and DFT interact with STA methodology, and how to build flows that serve all of these stakeholders effectively.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. 

Team Description:

The Brain Interfaces Soc Department delivers chip architecture and silicon implementation of neural recording and stimulation system-on-chip (SoC) for high-bandwidth brain-machine interface applications. We have crafted a team of exceptional engineers whose mission is to push the frontiers of what is possible today and define the future. 

Job Responsibilities and Description: 

The Physical Design and Verification Engineer will be responsible for RTL to GDSII Physical Design Implementation, including Synthesis, Placement, Clock Tree Synthesis, Detailed Routing and Optimization, in addition to Physical Signoff Verification. 

Required Qualifications: 

• Bachelor of Science (B.S.) degree in Electrical Engineering and/or Computer Science or a related field, or equivalent experience.
• Minimum 5 years of experience in digital physical design and verification.
• Excellence in complete RTL to GDSII flow with strong experience in the usage of industry-standard Electronic Design Automation (EDA) tools for both physical design and timing signoff.
• Deep knowledge on industry standards and practices in physical design including physically-aware synthesis flow, floor-planning, and place & route, metal fill, chip finishing, signal integrity checks, and dynamic EMIR-Drop analysis, and formal ESD verification.
• Experience in Signoff ECO flow to fix timing, noise, IR-Drop and EMIR violations.
• Experience in physical design verification to debug LVS/DRC/PERC issues at the chip/block level using industry standard tools.
• Experience in developing automation flow and scripts using Python, Perl, Makefile, Tcl and UNIX shell.

Preferred Qualifications: 

• Master of Science (M.S.) degree in Electrical Engineering and/or Computer Science or a related field, or equivalent experience.
• Experience working on physical design and implementation of complex ASIC systems at advanced technology nodes, preferably 16nm and below. 
• Experience in DFT (Design For Test) flows and ATPG.
• Experience in I/O design flow in multi-voltage power domain.
• Experience in building chip floor-plan including pin placement, partitions and power grid.
• Experience in hierarchical synthesis, place-and-route and design closure to meet timing, area, and UPF-driven low power constraints.
• Experience with build tools such as CMake and Bazel.
• Experience with code coverage and regression setup.

Join a team shaping the performance of next-gen CPUs and AI/ML chips. As a Physical Design Intern, you'll work hands-on from synthesis through tapeout, collaborating with top engineers to optimize some of the most advanced silicon in the world. 

This role is onsite, based out of Austin, TX or Santa Clara, CA.

Who You Are

• Currently pursuing a BS, MS, or PhD in EE, ECE, CE, or CS
• Solid understanding of logic design, VLSI, and transistor-level concepts
• Familiar with PnR tools, timing analysis, and power optimization techniques
• Comfortable scripting in Tcl, Perl, Shell, or Python

What We Need

• Support key physical design tasks—synthesis, floorplanning, PnR, clocking, timing closure
• Analyze and improve design PPA (Power, Performance, Area)
• Collaborate with front-end, PD, and architecture teams to influence early design decisions
• Explore and implement new flows, tools, or RTL experiments to optimize designs

What You Will Learn

• End-to-end physical design flow—from RTL handoff to final tapeout
• Deep dive into timing, power, EM/IR, and area trade-offs
• Industry-standard tools and techniques for modern chip development
• How top-tier silicon teams operate at scale

Join the team building high-performance RISC-V CPU cores at Tenstorrent. As a Performance Verification Intern, you will work alongside CPU architects, micro-architects, and performance engineers to ensure our designs meet real-world performance demands. This is a hands-on role that spans simulation, emulation, debug, and analysis.

This role is on-site, full-time (40 hours/week) in Santa Clara, CA or Austin, TX.

Who You Are

• Pursuing a BS, MS, or PhD in EE, ECE, CE, or CS with strong academic performance.
• Experienced with assembly, C/C++, and scripting in Python or Perl.
• Familiar with CPU architecture and performance concepts, including pipelines, memory systems, and branch prediction.
• Comfortable working through complex debug problems in a methodical, detail-oriented way.
  
  

What We Need

• Interns who can create performance test plans and write stimulus to stress real CPU scenarios.
• Engineers who can run simulations and emulations to validate performance metrics.
• Contributors who can bring up and debug workloads ranging from open-source benchmarks to industry-standard suites.
• Teammates who can investigate mismatches between RTL and performance models and help root-cause bottlenecks.
  
  

What You Will Learn

• How CPU performance is measured, validated, and optimized before silicon.
• How performance models, RTL implementations, and debug tools come together in a real chip development workflow.
• Techniques for balancing tradeoffs in microarchitecture to hit performance targets.
• What it takes to collaborate across architecture, design, and post-silicon teams in a high-performance CPU project.

We’re looking for a Physical Design Engineer – EMIR to join our silicon team. In this role, you’ll lead EM and IR-drop simulations to ensure robust power delivery, signal integrity, and long-term reliability for high-performance ICs. You’ll work with RTL, physical design, and analysis teams to implement power grid strategies that optimize performance, power, and area (PPA), particularly at advanced nodes like 7nm and below. You’ll also support EMIR sign-off and waiver methodologies across the chip hierarchy.

This role is hybrid, based out of Austin, TX or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A physical design specialist with deep experience in EMIR analysis and signoff.
• Comfortable navigating advanced technology nodes and power integrity challenges.
• Proactive and detail-oriented, with a passion for pushing performance and reliability boundaries.
• Collaborative and effective across teams working on RTL, physical design, packaging, and reliability.

What We Need

• 7+ years of experience in physical design or signoff, with a focus on EMIR.
• Hands-on with RedHawk, Voltus, or equivalent industry-standard EMIR tools.
  Strong understanding of IR-drop mitigation, EM compliance, and power grid design.
• Proficiency with layout extraction flows, RC modeling, and metal density checks.
• Experience working in advanced nodes (7nm, 5nm, 3nm), and with scripting languages like TCL, Python, Perl, or Shell.
• Knowledge of floorplanning, bump/RDL design, and sign-off flows (DRC/LVS, timing closure).

What You Will Learn

• How to architect and analyze robust power delivery for Tenstorrent’s RISC-V CPUs and AI chips.
• How to integrate EMIR signoff into fast-paced, high-performance chip design cycles.
• Best practices for hierarchical analysis and EMIR methodology across pre- and post-layout flows.
• Cross-functional collaboration for optimizing PPA while meeting stringent reliability goals.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is looking for a Staff Product Development Engineer - ATE Content Developer, who will be focused on core content development for high-performance AI/ML silicon. They  will be responsible for developing production test programs on ATE test platforms, translating DFT/ATPG content into optimized ATE solutions, and implementing Streaming Scan Network (SSN) architectures for efficient test data delivery. High level challenges include reducing test cost while maintaining coverage targets, optimizing test time for chiplet and multi-die architectures, and enabling rapid yield learning through robust test methodologies. The work is done collaboratively with a group of highly experienced engineers across DFT, design, product, and manufacturing domains.

This role is hybrid, based out of Austin, TX or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• An experienced semiconductor test engineer with 7 years and a BS/MS in EE/ECE/CE and a track record testing complex digital devices on advanced nodes.
• Hands-on with Advantest V93K and/or Teradyne UltraFlex+ platforms, comfortable owning production test programs end‑to‑end.
• Deeply familiar with DFT/ATPG flows and test architectures: scan chains, MBIST, compression, JTAG/IEEE 1149.1, and common fault models (stuck‑at, transition, path delay, cell‑aware).
• Proficient in C/C++ or Java, with strong scripting skills in Python, Perl, or TCL to automate flows, pattern handling, and data analysis.
• Skilled at debugging across ATE hardware, test programs, and silicon, and at using data to drive root‑cause analysis and yield improvement.

What We Need

• Develop and optimize production test programs on Advantest V93K using the SmarTest 8 environment, from bring‑up through high‑volume manufacturing.
• Translate ATPG patterns (STIL/WGL) into production‑ready test content, balancing test time, coverage, and cost for chiplet and multi‑die AI/ML devices.
• Implement and debug Streaming Scan Network (SSN) based content for high‑speed scan delivery, ensuring robust and scalable scan test infrastructure.
• Own test content for scan, BIST, and memory test structures, collaborating with DFT teams on pattern debug, fault diagnosis, and coverage improvement.
• Support silicon bring‑up and debug in the lab and at manufacturing sites, including correlation, corner characterization, and PVT studies.
• Build and maintain automation scripts and test methods that improve productivity, repeatability, and quality across the test lifecycle.
• Document test architectures, flows, and debug procedures so they can be scaled across products, sites, and engineering teams.

What You Will Learn

• How to test and scale cutting‑edge AI/ML silicon with chiplet and multi‑die architectures, including exposure to 2.5D/3D packaging and HBM integration.
• Deeper expertise in SSN architectures, high‑speed scan delivery, and next‑generation DFT/test methodologies for complex HPC/AI devices.
• How to drive end‑to‑end yield learning: from ATE data and STDF analytics through to design, DFT, and manufacturing process feedback.
• How a fast‑growing AI hardware startup coordinates DFT, design, product, and manufacturing to bring new silicon from first silicon to high‑volume production.
• Opportunities to influence test strategy, infrastructure, and automation roadmaps for future products and platforms as Tenstorrent’s portfolio scales.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

We’re looking for a Timing Engineer to join our silicon team. In this role, you’ll drive static timing analysis and closure for complex, high-performance designs. You’ll collaborate closely with logic, DFT, and physical design teams to debug constraints, optimize paths, and ensure our chips meet performance targets across corners and modes.

This role is hybrid, based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• Experienced in STA and passionate about enabling silicon to meet aggressive performance goals.
• Analytical and detail-oriented, with a strong understanding of timing paths, constraints, and optimization strategies.
• A collaborative team player who works well across logic, DFT, and physical design boundaries.
• Resourceful and self-driven, capable of developing scripts and methodologies that improve timing closure workflows.

What We Need

• 7+ years of industry experience and a proven record of successful tapeouts.
• Deep knowledge of STA tools and techniques, including noise, crosstalk, and OCV analysis.
• Proficiency in writing and debugging SDC constraints, creating ECOs, and developing closure strategies.
• Strong scripting skills in Python, Perl, and TCL to support automation and flow development.
• Familiarity with SPICE modeling and worst-case corner analysis.

What You Will Learn

• How to close timing on Tenstorrent’s high-performance RISC-V CPUs and AI SoCs.
• Advanced STA methodologies tailored to modern sub-micron process technologies.
• How to collaborate with world-class engineers across RTL, DFT, and physical design teams.
• How to influence chip performance through timing methodology innovation and automation.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.

This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts.
• Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration.
• Strong problem solver who excels at debugging complex issues across design hierarchies.
• Collaborative team player who thrives in fast-paced, technically challenging environments.

What We Need

• BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs.
• Expertise with industry-standard tools (FusionCompiler, PrimeTime, RedHawk) and scripting languages (Tcl, Perl, Python).
• Deep understanding of advanced node challenges and low-power design techniques (power gating, multi-Vt, voltage scaling).
• Experience driving physical design requirements from early architecture through final signoff.

What You Will Learn

• How to implement cutting-edge AI accelerators, high-performance CPUs and the SOCs that host them on the most advanced process nodes.
• Innovative PPA optimization techniques and methodologies for next-generation chiplet architectures.
• End-to-end ownership from flow development to signoff in collaboration with architecture and IP teams.
• Direct impact on products that are redefining the landscape of AI and high-performance computing.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking a highly skilled and experienced Engineer to lead post-silicon power characterization and correlation activities for cutting-edge semiconductor products. In this role, you will be responsible for developing and executing detailed power measurement strategies on silicon, correlating results with pre-silicon models, and driving improvements across power architecture, design, and modeling methodologies. You will serve as a key technical leader, interfacing across design, architecture, validation, and systems teams to ensure silicon meets power and performance specifications under all operating conditions.

This role is hybrid, based out of Toronto, ON or Austin, TX or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• A Principal-level engineer with 8+ years in silicon power analysis and characterization, and a Master’s or PhD in EE, CE, or related field.
• Deep understanding of digital and mixed-signal power domains, including DVFS, leakage vs. dynamic power, and power gating.
• Highly proficient in lab-based power measurement using oscilloscopes, current probes, power analyzers, and SMUs, plus Python/Perl/MATLAB for automation and analytics.
• A strong debugger and collaborator, comfortable driving cross-functional investigations and clearly communicating technical findings.

What we need

• Own the post-silicon power measurement strategy end-to-end across operating modes, voltages, frequencies, and workloads.
• Build and maintain lab infrastructure, automated workflows, and data analysis pipelines for high-fidelity, repeatable power characterization.
• Correlate silicon power data to pre-silicon models (RTL, gate-level, sign-off), drive root-cause analysis, and refine power estimation methodologies with design and modeling teams.
• Characterize power across PVT corners and work with bring-up/validation teams to develop test content, debug power anomalies, and ensure products meet power and performance specs.

What you will learn

• How state-of-the-art SoCs behave in real silicon across diverse workloads, system configurations, and operating conditions.
• How to influence power architecture, RTL design, and modeling flows by feeding silicon insights directly back into early design phases.
• Best practices for building scalable, automated post-silicon power infrastructures that support multiple products and generations.
• Advanced correlation, margining, and variability analysis techniques that deepen your expertise in both SoC-level power and system-level behavior.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.

This role is hybrid, based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. 

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts.
• Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration.
• Strong problem solver who excels at debugging complex issues across design hierarchies.
• Collaborative team player who thrives in fast-paced, technically challenging environments.