Tenstorrent is seeking an Physical Design Engineer to lead  cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. 

This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes.
• Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs.
• Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows.
• Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independently.

What we need

• Lead and contribute to cross-functional efforts solving complex physical design challenges across IPs, projects, and advanced technology nodes.
• Develop and enhance RTL-to-GDS methodologies, including floorplanning, synthesis, P&R, STA, signoff, and assembly.
• Architect and deploy AI/ML-driven solutions in production flows to improve engineering efficiency, turnaround time, and QoR.
• Optimize EDA tools and custom CAD flows using data-driven and ML-based techniques, in close collaboration with verification, extraction, timing, DFT, and EDA vendors.

What you will learn

• How to scale AI/ML-driven methodologies across diverse products and advanced technology nodes in real production flows.
• New ways to blend classical EDA algorithms with modern ML techniques to push PPA and runtime limits.
• Best practices for deploying, validating, and monitoring ML models in production CAD environments.
• How to influence next-generation ML-enabled EDA tools and collaborate deeply with cross-functional teams (PV, extraction, timing, DFT).

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. 

Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.

This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts.
• Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration.
• Strong problem solver who excels at debugging complex issues across design hierarchies.
• Collaborative team player who thrives in fast-paced, technically challenging environments.

What We Need

• BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs.
• Expertise with industry-standard tools (FusionCompiler, PrimeTime, RedHawk) and scripting languages (Tcl, Perl, Python).
• Deep understanding of advanced node challenges and low-power design techniques (power gating, multi-Vt, voltage scaling).
• Experience driving physical design requirements from early architecture through final signoff.

What You Will Learn

• How to implement cutting-edge AI accelerators, high-performance CPUs and the SOCs that host them on the most advanced process nodes.
• Innovative PPA optimization techniques and methodologies for next-generation chiplet architectures.
• End-to-end ownership from flow development to signoff in collaboration with architecture and IP teams.
• Direct impact on products that are redefining the landscape of AI and high-performance computing.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking talented Physical Design Engineers to implement high-performance partitions for an industry-leading AI SOC. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.

This role is hybrid, based out of Austin,TX or Santa Clara, CA or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• Experienced with synthesis and place-and-route flows, especially using Synopsys Design Compiler / Fusion Compiler and IC Compiler II.
• Comfortable in a small, cross-functional physical design team, owning a block or subsystem and partnering on tapeout milestones with clear communication and accountability.
• Ideally bring extra depth in areas such as UPF/multi-voltage power domains, SoC interface IP integration (e.g. I3C, UART), signoff breadth (DRC/LVS, EM/IR, LEC/Formality), multi-clock/CDC-aware implementation, PLL/DLL integration, and DFT-aware physical implementation (OCC/MBIST).

What we need

• Execute synthesis, PNR, and STA for assigned partitions of a complex AI SoC.
• Help close EM/IR, ensure UPF power intent is consistent with implementation, and drive LEC and physical verification signoff for your partitions in coordination with methodology owners.
• Work closely with architects, RTL designers, and DFT engineers to resolve implementation and signoff issues across your blocks.

What you will learn

• How to implement and close AI SoC partitions end-to-end, including power intent, timing, and physical signoff in a modern Synopsys-based flow.
• Deeper expertise across signoff domains: EM/IR, DRC/LVS, logical equivalence (LEC/Formality), and CDC-aware implementation on meaningful production blocks.
• Practical integration of analog/mixed-signal macros (PLL/DLL), DFT features (OCC/MBIST), and SoC interface IP within advanced physical design flows and collaborative tapeout environments.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. 

Tenstorrent is seeking an experienced EDA/PDK CAD Engineer to build and maintain world-class design infrastructure that accelerates our silicon innovation. In this role, you'll install and optimize PDKs, manage EDA tool flows, and partner with analog, digital, and software teams to continuously improve design efficiency. If you're passionate about solving complex CAD challenges and enabling cutting-edge chip design, we want you on our team.

This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A self-driven problem solver with deep knowledge of PDKs, EDA tools, and IC design flows.
• Experienced in troubleshooting complex CAD issues and developing creative work-around solutions.
• Collaborative communicator who actively seeks feedback to improve team productivity.
• Passionate about challenging industry-leading tools and methodologies to drive continuous improvement.

What We Need

• BS, MS, or Ph.D. in Electrical Engineering and/or Computer Science with 5+ years of industry experience.
• Hands-on expertise installing, configuring, and maintaining PDKs and EDA environments.
• Strong background supporting physical verification flows (DRC, LVS, EM/IR, extraction) and mixed-signal simulation.
• Proven ability to work with vendors, foundries, and cross-functional teams to resolve technical issues.

What You Will Learn

• How to architect and scale design infrastructure for state-of-the-art AI silicon development.
• Advanced techniques for optimizing EDA flows across analog, digital, and mixed-signal domains.
• Direct collaboration with world-class engineers to shape tools and methodologies that define industry standards.
• Best practices for proactive CAD support and continuous flow improvement in a fast-paced innovation environment.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

We’re looking for a Physical Design Engineer – EMIR to join our silicon team. In this role, you’ll lead EM and IR-drop simulations to ensure robust power delivery, signal integrity, and long-term reliability for high-performance ICs. You’ll work with RTL, physical design, and analysis teams to implement power grid strategies that optimize performance, power, and area (PPA), particularly at advanced nodes like 7nm and below. You’ll also support EMIR sign-off and waiver methodologies across the chip hierarchy.

This role is hybrid, based out of Austin, TX or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A physical design specialist with deep experience in EMIR analysis and signoff.
• Comfortable navigating advanced technology nodes and power integrity challenges.
• Proactive and detail-oriented, with a passion for pushing performance and reliability boundaries.
• Collaborative and effective across teams working on RTL, physical design, packaging, and reliability.

What We Need

• 7+ years of experience in physical design or signoff, with a focus on EMIR.
• Hands-on with RedHawk, Voltus, or equivalent industry-standard EMIR tools.
  Strong understanding of IR-drop mitigation, EM compliance, and power grid design.
• Proficiency with layout extraction flows, RC modeling, and metal density checks.
• Experience working in advanced nodes (7nm, 5nm, 3nm), and with scripting languages like TCL, Python, Perl, or Shell.
• Knowledge of floorplanning, bump/RDL design, and sign-off flows (DRC/LVS, timing closure).

What You Will Learn

• How to architect and analyze robust power delivery for Tenstorrent’s RISC-V CPUs and AI chips.
• How to integrate EMIR signoff into fast-paced, high-performance chip design cycles.
• Best practices for hierarchical analysis and EMIR methodology across pre- and post-layout flows.
• Cross-functional collaboration for optimizing PPA while meeting stringent reliability goals.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you.

This role is hybrid, based out of Santa Clara, CA; Austin, TX; or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure.
• A hands-on problem solver who excels at debugging and driving signoff through complex verification flows.
• A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces.
• A mentor and technical leader passionate about building efficient, manufacturable silicon.
  
  

What We Need

• BS or MS in Engineering (Electrical, Electronics, or related field).
• 7–14 years of hands-on experience in CPU/IP/SoC physical verification.
• Strong command of industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.).
• Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification.
• Solid understanding of advanced node challenges (7nm, 5nm, 3nm) and FinFET design considerations.
• Scripting proficiency (Python, TCL) for automation and flow optimization.
• Familiarity with ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM).
  
  

What You Will Learn

• Advanced physical verification methodologies and flow optimization for next-generation SoCs.
• Integration and verification strategies for full-chip signoff across advanced process technologies.
• Cross-functional collaboration across design, CAD, and foundry teams to ensure flawless tapeouts.
• Leadership and mentoring opportunities in building scalable PV methodologies and automation.
  
  

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you.

This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure.
• A hands-on problem solver who excels at debugging and driving signoff through complex verification flows.
• A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces.
• A mentor and technical leader passionate about building efficient, manufacturable silicon.
  
  

What We Need

• BS/MS in Electrical/Electronics Engineering (or related) with 7–14 years of hands-on CPU/IP/SoC physical verification experience.
• Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification using industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.).
• Strong background in ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM), with solid understanding of advanced nodes (7nm, 5nm, 3nm) and FinFET design challenges.
• Scripting proficiency in Python and TCL for automation and flow optimization.

What You Will Learn

• Advanced physical verification methodologies and flow optimization for next-generation SoCs.
• Integration and verification strategies for full-chip signoff across advanced process technologies.
• Cross-functional collaboration across design, CAD, and foundry teams to ensure flawless tapeouts.
• Leadership and mentoring opportunities in building scalable PV methodologies and automation.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. 

Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise.

This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A seasoned physical design engineer who thrives on complex, full-chip implementation challenges.
• Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams.
• Passionate about optimizing chip-level implementations for power, performance, and area.
• Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules.

What We Need

• 8+ years of top-level SOC physical design experience on complex, multi-million gate designs.
• Deep expertise in hierarchical floorplanning, fabric implementation, power grid design, and global clock distribution.
• Proven track record with bump planning, RDL implementation, and multi-voltage domain designs.
• Mastery of timing closure, EM/IR analysis, and physical verification at the chip level.

What You Will Learn

• How to implement cutting-edge AI accelerators and high-performance CPUs at the SOC level.
• Advanced techniques for chiplet integration and next-generation packaging co-design.
• Strategies for optimizing massive designs with complex power domains and clock architectures.
• Methods for driving successful chip-level closure through effective cross-functional collaboration.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. 

We’re looking for a Timing Engineer to join our silicon team. In this role, you’ll drive static timing analysis and closure for complex, high-performance designs. You’ll collaborate closely with logic, DFT, and physical design teams to debug constraints, optimize paths, and ensure our chips meet performance targets across corners and modes.

This role is hybrid, based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• Experienced in STA and passionate about enabling silicon to meet aggressive performance goals.
• Analytical and detail-oriented, with a strong understanding of timing paths, constraints, and optimization strategies.
• A collaborative team player who works well across logic, DFT, and physical design boundaries.
• Resourceful and self-driven, capable of developing scripts and methodologies that improve timing closure workflows.

What We Need

• 7+ years of industry experience and a proven record of successful tapeouts.
• Deep knowledge of STA tools and techniques, including noise, crosstalk, and OCV analysis.
• Proficiency in writing and debugging SDC constraints, creating ECOs, and developing closure strategies.
• Strong scripting skills in Python, Perl, and TCL to support automation and flow development.
• Familiarity with SPICE modeling and worst-case corner analysis.

What You Will Learn

• How to close timing on Tenstorrent’s high-performance RISC-V CPUs and AI SoCs.
• Advanced STA methodologies tailored to modern sub-micron process technologies.
• How to collaborate with world-class engineers across RTL, DFT, and physical design teams.
• How to influence chip performance through timing methodology innovation and automation.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking an exceptional Senior-level SoC Physical Design Engineer to drive top-level implementation of our complex AI and CPU SoC designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise.

This role is hybrid, based out of Santa Clara, CA; Austin, TX; or Ft. Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A seasoned physical design engineer who thrives on complex, full-chip implementation challenges.
• Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams.
• Passionate about optimizing chip-level implementations for power, performance, and area.
• Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules

What We Need

• 8+ years of top-level SOC physical design experience on complex, multi-million gate designs.
• Deep expertise in hierarchical floorplanning, fabric implementation, power grid design, and global clock distribution.
• Proven track record with bump planning, RDL implementation, and multi-voltage domain designs.
• Mastery of timing closure, EM/IR analysis, and physical verification at the chip level.

What You Will Learn

• How to implement cutting-edge AI accelerators and high-performance CPUs at the SOC level.
• Advanced techniques for chiplet integration and next-generation packaging co-design.
• Strategies for optimizing massive designs with complex power domains and clock architectures.
• Methods for driving successful chip-level closure through effective cross-functional collaboration.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking an experienced Field Application Engineer to champion our revolutionary RISC-V CPU and AI accelerator IP products with customers worldwide. You will own end-to-end technical engagements, translating complex architectural advantages into customer wins while shaping our product roadmap through direct market feedback. If you combine deep technical expertise with exceptional customer engagement skills and want to drive the adoption of next-generation compute IP, join our team.

This role is hybrid, based out of the United States or Canada near one of our main office locations.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A customer-focused engineer with proven success in CPU/GPU/NPU IP sales engagements.
• Technical expert who can articulate complex architectural benefits and conduct deep-dive analyses.
• Self-driven professional who independently manages multiple customer relationships from discovery to win.
• Strategic thinker who identifies customer pain points and positions solutions effectively.

What We Need

• 7+ years in the semiconductor industry with a degree in EE or related field including customer-facing roles in CPU IP.
• Hands-on expertise with ASIC design flows, IP integration, and relevant design views (.lib, LEF, ICL, PDL).
• Deep technical knowledge of CPU architectures, semiconductor technologies, and system-level design.
• Exceptional presentation and communication skills with ability to engage all organizational levels.
• Proven track record of technical wins and managing multiple simultaneous accounts.

What You Will Learn

• How to position cutting-edge RISC-V and AI accelerator IP against industry incumbents.
• Advanced customer engagement strategies for complex technical sales in the semiconductor industry.
• Direct influence on product development through customer feedback and market insights.
• The complete IP business cycle from evaluation through design win and production success.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.