Role Overview

Astera Labs is seeking a Physical Design Engineering Manager to lead a team of physical design engineers at our Toronto site, driving the implementation of connectivity ASICs within our Signal Connectivity Group. This group is responsible for products that enable high-speed serial connectivity including PCIe retimers, Ethernet retimers, and signal conditioning solutions—deployed across the world's largest AI clusters and hyperscale data centers.

As an Physical Design Manager Engineering Manager, you will combine hands-on technical leadership with people management, owning physical design execution from RTL to GDSII while building and mentoring a high-performing team. You will drive floorplanning, place-and-route, timing closure, and sign-off for complex designs requiring deep understanding of high-speed physical layer interfaces and SerDes integration at TSMC advanced nodes. This role is fully on-site at our Toronto location.

Basic Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field; Master's preferred.
• 12+ years of experience in physical design implementation of complex SoCs at advanced nodes (7nm and below).
• 2+ years of experience leading teams or projects with demonstrated ability to mentor and develop engineers.
• Hands-on expertise across the physical design flow: synthesis, place-and-route, CTS, extraction, timing closure, EM-IR, DRC/LVS, and equivalence checking.
• Proficiency with Cadence Innovus and/or Synopsys Fusion Compiler/ICC2 and supporting toolchains.
• Strong scripting ability in Tcl, Python, and/or Perl.
• Professional attitude with the ability to prioritize a dynamic list of tasks, plan and prepare for customer meetings in advance, and work with minimal guidance.
• Entrepreneurial, open-minded behavior and can-do attitude. Think and act fast with the customer in mind! 

Required Experience

• Build, lead, and mentor a physical design team, owning Physical Design execution and team development for Signal Connectivity Group products.
• Drive block and top-level physical design implementation from floorplan through tapeout for retimer and signal conditioning ASICs.
• Own floorplanning, macro placement, power grid design, clock tree synthesis, and place-and-route for complex blocks and full-chip designs.
• Drive timing closure at both block and full-chip levels, developing and maintaining timing constraints and signoff methodology.
• Ensure DRC/LVS/EM-IR closure and physical verification sign-off to foundry requirements.
• Integrate hard macros, high-speed SerDes, analog IP, and third-party IP blocks, ensuring seamless physical integration at block boundaries.
• Collaborate with RTL, DFT, STA, EMIR, and verification teams to drive design convergence from synthesis through sign-off.
• Work with IP vendors for both RTL and hard-macro integration, ensuring placement constraints and routing guidelines are met.
• Drive team execution, hiring, career development, and sprint planning for the Toronto PD team.
• Establish physical design best practices, flow improvements, and quality checks to scale execution across multiple concurrent programs.
• Coordinate with global PD teams (San Jose, Irvine, Bangalore) to ensure consistent methodology and design quality.
• Experience with Cadence and/or Synopsys physical design tools/flows.
• Familiarity and working knowledge of SystemVerilog/Verilog.

Preferred Experience

• Deep understanding of high-speed SerDes physical layer, including equalization, CDR, and signal integrity considerations impacting physical design.
• Experience with PCIe, Ethernet, or retimer/signal conditioning ASIC implementation.
• Knowledge of physical layer timing challenges specific to high-speed serial interfaces.
• Hands-on experience with UPF-based multi-voltage/multi-power-domain implementations.
• Familiarity with advanced packaging or multi-die integration and its impact on physical design.
• Experience with ECO methodologies and DFT-aware physical design.
• Knowledge of EMIR-aware implementation techniques and early-stage IR drop mitigation.
• Track record of building and scaling physical design teams through multiple tapeouts.
• Knowledge of agentic AI solutions for EDA automation.

Salary range is CAD $180,000 to $220,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives, and benefits.

We are looking for a Staff Digital Design Engineer to help define, build, and optimize high-performance IP and SoC architectures for next-gen AI and compute workloads. This role is ideal for engineers who thrive at the intersection of microarchitecture, RTL implementation, and performance-aware design.

This role is hybrid, based out of Toronto, Ottawa, Boston, or Austin. 

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A digital design expert with a deep understanding of computer architecture and IP microarchitecture.
• Skilled in RTL development (Verilog/VHDL) and familiar with full ASIC flows.
• Comfortable optimizing for power, performance, and area (PPA) under aggressive design goals.
• A naturally collaborative and technical engineer — you thrive in spec definition, peer reviews, and team-wide planning.

What We Need

• Architecture and RTL implementation of Tenstorrent’s custom IP blocks and SoC components.
• Performance-aware design decisions for compute, interconnect, or memory-heavy blocks.
• Occasional contributions to validation using emulation, FPGA prototyping, or UVM flows.
• Strong synthesis and timing closure awareness to support backend teams.
• Prior experience in on-chip fabric and interconnect designs is an asset.

What You Will Learn

• How cutting-edge AI chips are built, from spec to silicon.
• What it takes to collaborate with teams designing novel processor and memory architectures.
• How to blend custom logic with standard SoC elements for power and scale.
• How cross-functional workflows come together across design, DV, physical, and firmware teams.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Our Tensix Team is building the next generation of high-performance AI compute systems. We’re looking for a Power Architect to drive architectural strategy, modeling, and design decisions that shape how power is understood and optimized across our products. This is a hands-on role with massive influence over how we build power-aware systems from the ground up.

This role is hybrid, based out of Toronto, ON or Austin, TX.

We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• 10+ years experience with power estimation tools like PowerArtist, PtPX, RTL Architect, and PrimePower.
• Skilled in modeling and optimizing power at the architectural level, with deep knowledge of power-gating, voltage domains, and leakage control.
• Track record of influencing architectural and micro-architectural changes that meaningfully reduced design power.
• Proficient in Verilog HDL, Design Compiler, C/C++ and Python.
• Background in power-optimization of compute datapath  and/or interconnects.

What We Need

• Predict power consumption early in architecture and track it through RTL evolution.
• Propose architectural changes for power optimization across server and non-server markets.
• Build workloads that stress real-world use cases and guide thermal and power-delivery solutions.
• Correlate pre-silicon estimates to silicon measurements and drive power efficiency improvements.

What You Will Learn

• How AI workloads impact power at every layer of the stack — from circuit to software.
• Challenges in building accurate, CI-integrated power modeling infrastructure.
• Techniques for aligning design tradeoffs to the realities of AI model execution.
• How Tenstorrent approaches full-stack power optimization across chiplet-based systems.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Job Description

We are seeking a Technical Lead Digital Design Engineer with deep expertise in high-performance PCIE controller and bridge design, micro-architecture, RTL implementation, and IP integration. The ideal candidate will play a critical role in the development of cutting-edge connectivity solutions.

Key Responsibilities:

• Design and implement high-performance digital solutions, including RTL development and synthesis.
• Collaborate with cross-functional teams on IP integration for Serdes and Controller IPS, processor and peripherals
• Own block-level and full-chip designs from architecture to GDS, focusing on designs at nodes ≤ 16nm.
• Ensure timing closure, assess verification completeness, CDC, lint etc.
• Utilize tools from Synopsys/Cadence for design and emulation.

Basic Qualifications:

• Bachelor’s in Electronics/Electrical engineering (Master's preferred).
• 5+ years of digital design experience, with 4+ years focused on PCIE controller, PCS or PHY implementation.
• Proven expertise in RTL development, synthesis, and timing closure.
• Experience with front-end design, gate-level simulations, and design verification.
• Strong work ethic, ability to handle multiple tasks, and a proactive, customer-focused attitude.

Required Expertise:

• Hands-on experience with PCIE Controller or Serdes/PHY IP.
• Hands-on pre-silicon and post-silicon design implementation.
• Hands-on experience  FW interaction and embedded design.
• Strong proficiency in System Verilog/Verilog and scripting (Python/Perl).
• Experience with block-level and full-chip design at advanced nodes (≤ 16nm).
• Top level integration and DFT knowledge.

Preferred Experience:

• PCIE SerDes controller or IP level experience.
• Understanding of PAD design, DFT, and floor planning.
• Experience with NIC, switch, or storage product development including embedded FW.
• Familiarity with working in design and verification workflows in a CI/CD environment.

Job Description:

As an Analog/Mixed-Signal IC Design Engineer, you will be part of a key team designing sophisticated advanced node CMOS products. Your responsibilities will include developing and verifying circuits such as PLL, DLL, ADC, regulators, amplifiers, TX, RX, and CDRs to meet performance targets. You will also work on analog and clocking blocks for connectivity applications, using industry-standard tools like Spectre and MATLAB. The company seeks a highly motivated designer for this role

Basic Qualifications:

• Strong academic and technical background in electrical engineering. A Master’s or PhD degree in EE is required, preferably from a top-tier university.
• 2+ years of experience supporting or developing complex analog IC designs.

Required Experience:

• Hands-on experience in designing high-speed mixed-signal circuits including ADC/DAC data converters, RX front-end, TX driver/serializer, low-jitter PLLs, TX/RX calibration, low-jitter CLK distribution are other high-speed analog circuits is a must
• Have a deep understanding of biasing, band-gaps, reference circuits, opamps, comparators and other analog circuits
• Solid track-record for implementation of analog circuits high-speed data transmission.
• Design and tapeout experience in advanced CMOS nodes (ex. 20nm or newer) is a must
• Solid fundamentals in detailed transistor-level design, feedback/stability analysis, and noise/jitter analysis.
• Knowledge of TIA design and drivers for optical applications is highly desirable
• Experience in RFIC design for wireless or wireline communication systems is highly desirable.
• Strong technical independent contributor with a proven ability to drive results.
• Excellent teamwork, presentation, and documentation skills.
• Ability to collaborate with global teams across multiple time zones and deliver under pressure with strict deadlines.
• Strong experience in lab chip bring-up and debugging efforts.

Preferred Experience:

• Relevant research publications and/or patents in analog or RF IC design.
• Familiarity in programming/scripting languages such as Python, Matlab, or C.
• Experience with PCB design.
• Familiarity with Verilog RTL or DSP design concepts.
• Knowledge of optical transceivers.
• Expertise in ESD protection techniques and IC packaging methodologies.

The base salary range is $150,000.00 USD – $200,000.00 USD.

The base salary range for this role in Canada is $110,000 CAD - $130,000 CAD

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.  

Job Description:

As an Analog/Mixed-Signal IC Design Engineer, you will be part of a key team designing sophisticated advanced node CMOS products. Your responsibilities will include developing and verifying circuits such as PLL, DLL, ADC, regulators, amplifiers, TX, RX, and CDRs to meet performance targets. You will also work on analog and clocking blocks for connectivity applications, using industry-standard tools like Spectre and MATLAB. The company seeks a highly motivated designer for this role

Basic Qualifications:

• Strong academic and technical background in electrical engineering. A Master’s or PhD degree in EE is required, preferably from a top-tier university.
• 8+ years of experience supporting or developing complex analog IC designs.

Required Experience:

• Hands-on experience in designing high-speed mixed-signal circuits including ADC/DAC data converters, RX front-end, TX driver/serializer, low-jitter PLLs, TX/RX calibration, low-jitter CLK distribution are other high-speed analog circuits is a must
• Have a deep understanding of biasing, band-gaps, reference circuits, opamps, comparators and other analog circuits
• Solid track-record for implementation of analog circuits high-speed data transmission.
• Design and tape out experience in advanced CMOS nodes (ex. 7nm, 5nm 3nmFinFET) is a must.
• Solid fundamentals in detailed transistor-level design, feedback/stability analysis, and noise/jitter analysis.
• Knowledge of TIA design and drivers for optical applications is highly desirable
• Experience in RFIC design for wireless or wireline communication systems is highly desirable.
• Strong technical independent contributor with a proven ability to drive results.
• Excellent teamwork, presentation, and documentation skills.
• Ability to collaborate with global teams across multiple time zones and deliver under pressure with strict deadlines.
• Strong experience in lab chip bring-up and debugging efforts.

Preferred Experience:

• Relevant research publications and/or patents in analog or RF IC design.
• Familiarity in programming/scripting languages such as Python, Matlab, or C.
• Experience with PCB design.
• Familiarity with Verilog RTL or DSP design concepts.
• Knowledge of optical transceivers.
• Expertise in ESD protection techniques and IC packaging methodologies.

 Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

The Role:
In this exciting role, you will be responsible for bring up and optimizations of Cerebras’s Wafer Scale Engine (WSE). Suitable candidate will have experience delivering end to end solutions working closely with teams across chip design, system performance, software development and productization.

Responsibilities:

• On Wafer Scale Engines, develop and debug flows that embed well tested and deployable optimizations in production processes to reduce time and costs 
• Work on refining AI Systems across H/W-S/W design constraints such as di/dt, V-F characterization space, current and temperature limits in relation to optimizations for performance.
• Develop/Enhance infrastructure to enable silicon for real world workload testing
• Develop self-checking metrics, as well as instrumentation for debug and coverage
• Work with the silicon architects/designers, performance engineers and software engineers to enhance performance of Wafer Scale Engines.
• Work across domains such as, Software, Design, Verification, Emulation & Validation to refine and optimize performance and process.
• Work with CI/CD tools, git repositories, github, git actions/Jenkins, merge and release flows to streamline test and release.

Skills & Qualifications:

• BS/BE/B.Tech or MS/M.Tech in EE, ECE, CS or equivalent work experience
• 7-10+ years of industry experience
• 3-5 years of experience in Pre-silicon & Post Silicon ASIC hardware
• Good understanding of computer architecture and networking
• Excellent Coding in languages such as Python/Verilog/System Verilog and C
• Proficient in hardware/software codesign and layered architectures.
• Excellent debugging, analytical, and problem-solving skills
• Proficient in large scale testing and automation using pytest and python
• Good presentation skills to refine diverse information and put forth optimization strategies and results.
• Good interpersonal skills, ability & desire to work as a standout colleague
• Proven track record of working cross-functionally learning fast and driving issues to closure 

Preferred:

• Previous work in AI-ML with 100+ CPU core & communication fabric-based design.
• Familiarity with in-line testing and diagnostics using CPU memory and execution with self-checking.
• Knowledge of chip defect profiles and mitigation strategies across the hardware and software stack
• Familiarity in creating test and s/w infrastructure at large scale
• Working across global time zones 

Location:
Bangalore, India

Toronto, Canada

Sunnyvale, California.

For Sunnyvale: The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

The Role:
In this exciting role, you will be responsible for bring up and optimizations of Cerebras’s Wafer Scale Engine (WSE). Suitable candidate will have experience delivering end to end solutions working closely with teams across chip design, system performance, software development and productization.

Responsibilities:

• On Wafer Scale Engines, develop and debug flows that embed well tested and deployable optimizations in production processes to reduce time and costs 
• Work on refining AI Systems across H/W-S/W design constraints such as di/dt, V-F characterization space, current and temperature limits in relation to optimizations for performance.
• Develop/Enhance infrastructure to enable silicon for real world workload testing
• Develop self-checking metrics, as well as instrumentation for debug and coverage
• Work with the silicon architects/designers, performance engineers and software engineers to enhance performance of Wafer Scale Engines.
• Work across domains such as, Software, Design, Verification, Emulation & Validation to refine and optimize performance and process.
• Work with CI/CD tools, git repositories, github, git actions/Jenkins, merge and release flows to streamline test and release.

Skills & Qualifications:

• BS/BE/B.Tech or MS/M.Tech in EE, ECE, CS or equivalent work experience
• 7-10+ years of industry experience
• 3-5 years of experience in Pre-silicon & Post Silicon ASIC hardware
• Good understanding of computer architecture and networking
• Excellent Coding in languages such as Python/Verilog/System Verilog and C
• Proficient in hardware/software codesign and layered architectures.
• Excellent debugging, analytical, and problem-solving skills
• Proficient in large scale testing and automation using pytest and python
• Good presentation skills to refine diverse information and put forth optimization strategies and results.
• Good interpersonal skills, ability & desire to work as a standout colleague
• Proven track record of working cross-functionally learning fast and driving issues to closure 

Preferred:

• Previous work in AI-ML with 100+ CPU core & communication fabric-based design.
• Familiarity with in-line testing and diagnostics using CPU memory and execution with self-checking.
• Knowledge of chip defect profiles and mitigation strategies across the hardware and software stack
• Familiarity in creating test and s/w infrastructure at large scale
• Working across global time zones 

Location:

Sunnyvale, California.

Bangalore, India

Toronto, Canada 

The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Senior ASIC (Front End) Design Engineer

Summary:

• As a Senior ASIC (Front End) Design Engineer, you will be responsible for all aspects of digital SoC design, from micro-architecture specification, RTL, verification, synthesis, lint, CDC, LEC, and static timing analysis to deliver a design meeting target power, performance, and area goals.
• Work with system architects, software, hardware, and verification engineers to plan, architect, design, implement, and deliver advanced automotive communication semiconductors and systems.
• You will be on the leading edge of the development and definition of advanced, high-performance custom silicon that embodies functions from a wide range of protocols, algorithms, and applications.
• Expected to flesh out product definitions with precise specifications of: an ASIC's internal and external interactions, data flow, processing algorithms across a number of disciplines, resource management, and software interfaces.
• You will be a trusted self-starter who can work with very little guidance or oversight.
• This position is located in: Toronto, Canada - Hybrid

Key Qualifications:

• BS and/or MS in Electrical Engineering, Computer Science, or related field
• Minimum 10+ years of ASIC RTL design and/or architecture experience
• Proven track record with the development of complex SoCs
• Strong understanding of digital design fundamentals and methodologies
• In-depth knowledge of Verilog/System Verilog and simulation tools.
• Self-motivated and able to work effectively both independently and in a team

Additional Success Factors:

Experience in any of the following areas:

• Networking (Ethernet MAC, PHY/PCS, Switching, TCP/IP, PCIe and other industry standard protocols)
• Digital signal processing filters
• Digital Mixed-Signal modeling, design, and integration
• IP integration (SerDes, controllers, processors, etc.)
• Video standards, protocols, processing
• Perl, TCL, C/C++, Make

Personal Skills:

• Excellent communication/documentation skills.
• Attention to details.
• Collaboration across multidisciplinary and international teams.

What You Can Expect from Ethernovia:

• Technology depth and breadth expansion that can’t be found in a large company
• Opportunity to grow your career as the company grows
• Pre IPO stock options
• Cutting edge technology
• World class team
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance for employees

#LI-Hybrid

As an Analog Architect, you will spearhead pathfinding efforts and work on early prototypes of innovative analog and mixed-signal solutions for Lighmatter’s next-generation optical-engine products. You will then work closely with the engineering team to take your ideas to high-volume production. This role requires a deep understanding of high-frequency systems-on-chip (SoCs), high-speed (100+ Gbaud) serial and electro-optic interfaces. The role also requires creativity, analytical skills, and clear communication skills. You may represent the company at technical conferences as an example of our technical leadership. 

Join a tight-knit team where each individual’s contributions directly influence the success of the company and product. You'll have the opportunity to build a new kind of computer from the ground up and to solve groundbreaking challenges along the way. Work with people who love to build and who thrive in technically diverse environments where great ideas are prioritized.

Responsibilities

• Architect high-speed (200Gbaud and beyond) electro-optical interfaces for Lightmatter’s next-generation co-packaged optics (CPO) solutions.
• Design next-generation high-speed DACs, linear drivers and TIAs in the latest FinFET process nodes.
• Actively collaborate across disciplines—with electronics, photonics, and mechanical engineering teams—to specify the requirements and solutions for circuit blocks, SoCs, debug, and validation.
• Collaborate with the product team to develop our future technological and product roadmap in the context of industry trends.
• Work closely with test and validation engineers to validate hardware against simulation prediction to ensure high performance and high yield.
• Publish and present novel ideas and participate in premier technical conferences.
  
  

Qualifications

• A Ph.D. degree in Electrical Engineering or similar discipline with at least 5+ years of experience of designing high-speed analog circuits in TSMC N3/N5/N7.
• Hands-on experience in high-speed SERDES design in advanced process nodes (7nm and below).
• Deep technical background and a proven track record of innovation in their area of expertise.
• Strong understanding of how the layout impacts the SERDES performance.
• Familiarity with analyzing the impact of package and PCB on SERDES performance.
• Familiarity with UCIe, PAM4, and other high-speed SerDes.
• Strong background with using circuit and electromagnetic simulation tools needed for high-speed mixed-signal circuit design: Cadence virtuoso, Verilog-A, EMX or equivalent tools.

#LI-FM1

As an Analog Architect, you will spearhead pathfinding efforts and work on early prototypes of innovative analog and mixed-signal solutions for Lighmatter’s next-generation optical-engine products. You will then work closely with the engineering team to take your ideas to high-volume production. This role requires a deep understanding of high-frequency systems-on-chip (SoCs), high-speed (100+ Gbaud) serial and electro-optic interfaces. The role also requires creativity, analytical skills, and clear communication skills. You may represent the company at technical conferences as an example of our technical leadership. 

Join a tight-knit team where each individual’s contributions directly influence the success of the company and product. You'll have the opportunity to build a new kind of computer from the ground up and to solve groundbreaking challenges along the way. Work with people who love to build and who thrive in technically diverse environments where great ideas are prioritized.

Responsibilities

• Architect high-speed (200Gbaud and beyond) electro-optical interfaces for Lightmatter’s next-generation co-packaged optics (CPO) solutions.
• Design next-generation high-speed DACs, linear drivers and TIAs in the latest FinFET process nodes.
• Actively collaborate across disciplines—with electronics, photonics, and mechanical engineering teams—to specify the requirements and solutions for circuit blocks, SoCs, debug, and validation.
• Collaborate with the product team to develop our future technological and product roadmap in the context of industry trends.
• Work closely with test and validation engineers to validate hardware against simulation prediction to ensure high performance and high yield.
• Publish and present novel ideas and participate in premier technical conferences.
  
  

Qualifications

• A Ph.D. degree in Electrical Engineering or similar discipline with at least 5+ years of experience of designing high-speed analog circuits in TSMC N3/N5/N7.
• Hands-on experience in high-speed SERDES design in advanced process nodes (7nm and below).
• Deep technical background and a proven track record of innovation in their area of expertise.
• Strong understanding of how the layout impacts the SERDES performance.
• Familiarity with analyzing the impact of package and PCB on SERDES performance.
• Familiarity with UCIe, PAM4, and other high-speed SerDes.
• Strong background with using circuit and electromagnetic simulation tools needed for high-speed mixed-signal circuit design: Cadence virtuoso, Verilog-A, EMX or equivalent tools.

#LI-FM1