Job Description: 

As an Astera Labs Principal Product Application Engineer, you will need to provide technical guidance to ODMs to overcome design challenges, generate collateral for existing and new products, and drive innovation by providing insightful feedback to other internal teams to continuously improve products and processes. We need experience supporting the development and designing-in of semiconductor products for PCIe/CXL. There are opportunities to support key ODMs directly, and also to dive deep in the lab to address the challenges associated with leading edge semiconductor products. 

Basic Qualifications 

• Strong academic and technical background in electrical engineering. At minimum, a Bachelor’s in EE is required, Master’s is preferred. 
• Minimum of 10 years’ experience designing in complex SoC/silicon products with a high speed (preferably PCIe) interface. 
• Entrepreneurial, open-minded behavior and can-do attitude. Think and act with the customer in mind!  

Required Experience 

• Strong working knowledge of PCIe LTSSM at a physical layer level, associated standards, and debug. Most recent experience with PCIe 4.0 at a minimum, some experience with 5.0/CXL preferred. 
• Silicon/System bring-up and debug experience in customer systems.  
• Technical ownership of issue resolution: Driving and directing internal teams, and driving communication to customers through FAE and sales teams. 
• Firsthand experience with lab equipment such as protocol analyzers/exercisers, high-speed oscilloscopes, or BERTs.  
• Technical writing skills to generate clear, precise documentation including application notes and similar guides for internal and customer-facing audiences. 
• Global customer engagement support, with travel as required for on-site activities, reviews, and system bring-up.

Preferred experience 

• Triaging complex customer reported issues which require taking into account multiple layers of conditions; for instance, silicon, firmware, hardware board design, and system environment. 
• Development/support for PCIe or Ethernet Switch or Retimer products. 
• PCIe compliance testing methodology and troubleshooting. 
• Comfort working with software/firmware associated with semiconductor products, such as; Firmware development with C-language, scripting with Python or other equivalent programming languages. 
• Understanding of Data Center systems like Servers, JBOGs/JBODs, Networking switches/routers/interconnects etc. 

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Job Description:

We are seeking an experienced leader to drive Supplier / Manufacturing Quality Engineering to anchor our global supplier quality efforts across both Astera Lab’s semiconductor and board-level products. In this role, candidates will drive leading supplier quality across key manufacturing partners including IC fabs, OSAT’s, and PCB/PCBA vendors. A strong foundation in supplier quality engineering, uniquely paired with experience in advanced data analytics (including AI and machine learning) for predictive quality, risk assessments, and product quality analytics will be highly valuable to this role.

Responsibilities:

Supplier Quality Management

· Nurture winning partnerships across all our strategic manufacturing suppliers: semiconductor wafer fabs, advanced packaging & test (OSAT), boards & assemblies (PCB / PCBA / SMT), substrates / interposers, probe cards, and passive components.

· Develop robust supplier selection and onboarding processes in collaboration with Design, Procurement, Business & Engineering Operations teams.

· Define, build, and manage the systems to collect the data (KPI’s) needed to track supplier performance and drive continuous improvement.

· Audit to assess the effectiveness of supplier process controls, manufacturing capabilities, and overall quality management system.

· Coach suppliers by sharing your deep manufacturing experience and knowledge.

· International travel as needed, potentially on short notice. There is no minimum amount but prepare to accommodate up to 20%.

Advanced Data Analytics & AI/ML

· Create data collection methods to enable product and supplier advanced data analytics needed for monolithic, chiplet, and board products. Data sources will include manufacturing inline controls, production test (including data collection from advanced embedded agents), and failure analysis activities.

· Leverage data into quality models & methods to predict product quality issues and supply chain risks.

· Integrate AI/ML tools into quality systems and dashboards (e.g., outlier screening, automated defect detection, trend analysis, real-time alerts).

· Experience with AI/ML tools is a plus but not required; ability to work with technical partners on model development is key.

Cross-functional Collaboration

· Interface with R&D, NPI, product engineering, ops and other engineering teams to provide supplier input into product design and DFX.

· Support early supplier involvement and ensure quality requirements needed for manufacturability & testability are achieved, and learnings are propagated appropriately to other products in production & development.

· Represent supplier quality as needed in line failure reviews, excursion management, material reviews (MRB), and CAPA processes.

· Partner with engineering and manufacturing teams to conduct quarterly engineering reviews, evaluate supplier changes (PCN), and assess supplier risks.

· With engineering engagement, lead quality audits, and corrective action activities using tools such as 8D, 5-why, and FMEA.

Education & Experience

· Bachelor’s or Master’s degree in Engineering or equivalent experience.

· 8+ years of career progression in supplier quality engineering in the semiconductor and/or board-level electronics industry.

· 3+ years direct experience working embedded within a high-volume advanced manufacturing operation in an engineering role.

· Experience with supplier development in Asia with global manufacturing supply chains.

· Six Sigma or ASQ certification a plus

Technical Skills

· Strong knowledge of IC fabrication, packaging (including chiplet), board assembly (SMT), and test processes.

· Familiarity with reliability qualification methodologies in the application of IPC, Telcordia, JEDEC requirements.

· Proficiency with quality engineering tools (FMEA, APQP, PPAP, SPC, OE, etc.).

· Experience using analytics tools (e.g., JMP, SQL, Excel) to support quality insights. Exposure to AI/ML frameworks is a plus, but not required.

· Fluent in English and Mandarin

As an Astera Labs Principal Field Applications Engineer, you will support the world’s leading cloud service providers, server and network OEMs by working with them to design solutions that use Astera Labs’ portfolio of connectivity products. In this role, you will need to identify and understand customer requirements, propose Astera Labs solutions that provide clear value to the customer and provide hands-on design-in support. You will drive innovation by listening to the customer requirements, working with our engineering teams to implement into the product roadmap and delivering the results back to the customer.

 Basic qualifications:

• BS in electrical engineering. Master’s degree in engineering is preferred.
• Minimum of 8 years’ experience working with Cloud service providers and server OEM customers to design in complex SoC/silicon products for Server, Storage, and/or Networking applications. 
• Customer-oriented, Goal-driven, Self-motivated, be able to work independently and be able to travel frequently to customer sites
• Fluent in Mandarin and English
• Entrepreneurial, open-mind behavior and can-do attitude. Think and act with the customer in mind!

Required experience:

• Hands-on, thorough knowledge of high-speed protocols like PCIe & Ethernet
• Silicon/System bring-up and debug experience in customer systems.
• Experience with lab equipment including protocol analyzers and oscilloscopes.
• A strong background in high-speed board design techniques, and understanding of Data Center systems like Servers, JBOGs/JBODs, Networking switches/routers etc.
• Intermediate level of proficiency in Python for automating system validation and link optimization.
• Able to step through embedded firmware at the SerDes (SoC) or MCU level for debugging.
• Firsthand experience with lab equipment including traffic generators, analyzers, and high-speed oscilloscopes.
• Business travel to Asia and the North America region may be required as needed.

Preferred experience:

• Strong working knowledge of a high speed interface at a physical layer level, associated standards, and debug. Most recent experience with 12G NRZ signaling at a minimum, some experience with 25G NRZ/56G PAM4 preferred.
• Development, support, and experience with PCIe ICs.
• Experience in embedded SW debug or development with firmware, drivers, and BIOS using PCIe technology.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.

In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly & test process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with silicon and system architects to define package architectures by incorporating manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly, test and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities: 

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry, OSATs and Test vendors.
• Develop package architectures that prioritize Design for Test (DFT), Design for Manufacturing (DFM), and Design for Reliability (DFR). This is critical for achieving product landing zones while simultaneously meeting performance and cost targets.
• Define test chip requirements and manage test chip design required for 3D package assembly and test process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications:

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• Minimum of 10 years' hands-on experience in package assembly and test process development, specifically working with Outsourced Semiconductor Assembly and Test (OSAT) providers.
• Knowledge of Chip-on-wafer process flow, materials, and equipment requirements.
• Experience in test chip and assembly test vehicle design.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.
• Must be based in Taiwan.
• Fluent in both English and Mandarin Chinese, with the ability to confidently lead high-stakes meetings in either language.

Preferred Qualifications:

• Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong project ownership, with a history of driving results independently and with minimal supervision.
• Proven track record of developing creative solutions for complex technical challenges.

About the role

In this role you will help to lead a team to develop the Netskope AI Gateway, our industry-leading platform that empowers global enterprises to securely unlock the transformative power of Generative AI. You will conduct technical research, collaborate with other internal engineering and product management teams to design, develop and integrate innovative security capabilities into our platform. Join us to drive the next frontier in AI/LLM security ensuring robust defense against emerging threats.

What you will be doing

• Design, architect and develop high performance, scalable cloud based security systems to detect and mitigate attacks on generative AI applications and LLMs
• Define and drive best practices around scalable microservices, distributed systems, APIs and secure data flows
• Lead and inspire a world-class engineering organization, fostering a culture of innovation, collaboration and continuous improvements
• Partner with product management to understand customer requirements, lead the team and collaborate with other engineering teams to design and implement high-quality solutions
• Perform architectural reviews, code reviews and mentor junior engineers
• Stay abreast of emerging GenAI and cybersecurity technologies and proactively propose innovative solutions

Required skills and experience

• 10 to 12+ years of experience in software engineering, with 5+ years in architectural or technical leadership role
• Deep expertise in backend engineering using Golang, Python, C++ or Java
• Proven experience designing large-scale, secure and cloud-native systems
• Hands-on experience with Docker and Kubernetes, specifically debugging workloads, networking, and storage in on-prem or hybrid environments
• Excellent communication skills, be able to collaborate, influence and lead
• Willingness to work with a globally distributed team in different time zones
• Startup experience in a fast paced environment is a plus

Education

• BS in Computer Science or equivalent required; MS strongly preferred.

#LI-AW1

We are seeking skilled professional to reside in ODM/EMS, closely monitor manufacturing operations to ensure products are of highest quality and reliability.

Responsibilities

• Identify manufacturing quality issues including IQC, SMT, DIP, Assembly, OQC, RMA and work closely with supplier in analysis and corrective actions.
• Analyze key quality performance indicators, identify areas of improvement (product design, manufacturing process, equipment and/or the QMS), lead continuous improvement by applying relevant methods.
• Manage RMA issues, perform failure analyses in depth; coordinate with design team and suppliers to implement resolutions.
• Maintain/augment on-going quality mechanisms such as OOBA (Out of Box Audit), AQL, KPI.
• Conduct supplier audits and score board process.
• Establish/drive quality initiatives to achieve continuous reduction in defect rate and RMA cost.

Requirements:

• BS/MS in Engineering
• 8 years of related experience in industry grade product system manufacturing process such as PCB, PCBA, SMT, DIP, Design for Manufacturing.
• 5 years of failure analysis experience with sound knowledge of failure investigation process
• Knowledge of quality process such as DVT (Design Verification Testing), ORT (On-Going Reliability Testing), demonstrated MTBF.
• Working knowledge of x86, embedded CPU architecture, or networking systems
• ECR/ECN process, BOM structure in Agile or equivalent document control system.
• Quality Engineering: IQC, OQC, Lean Six Sigma, Kaizen, statistical methods
• Certificate or working knowledge of Quality Systems

 #LI-Taiwan

#LI-Onsite

#LI-NR5

Job Overview 

We are seeking a self-driven Principal Site Reliability Engineer with a strong technical background and excellent communication skills. This individual will lead the development, construction, and management of reliable and distributed systems that support our business operations. 
 
In this role, you will play a vital part in supporting the following businesses: 

• Requirements

• 8+ years technical experience in software engineering, network engineering, or systems administration 

• 6+ years of experience running large scale cloud services. 

• 2+ years of SRE team leadership role. 

• Fluent in English at a business level or higher. 

• Capable of planning infrastructure upgrades and optimizations. 

• Skilled in budget planning and ensuring cloud expenses remain within the allocated budget. 

• Skilled in OKR planning and ensuring the key results meet with company objectives. 

• Advanced knowledge of monitoring solutions like Prometheus, Grafana, ELK (Elasticsearch, Logstash, Kibana). 

• Experience in the complete software development life cycle (SDLC). 

• In-depth understanding of network concepts, particularly with a focus on security. 

• Hands-on experience implementing GitLab CI/CD processes. 

• Proficiency in automation platforms like Ansible and Terraform. 

• Knowledge of orchestration tools like Kubernetes. 

• Familiarity with container technologies like Docker. 

• Experience with Git source code version control systems. 

• Experience with AI pair programming like OpenAI. 

• Proficiency in programming languages such as Bash, Python, or Go. 

• Team player and good interpersonal skills.