Materials Engineer Jobs in Taipei.
All active Materials Engineer roles based in Taipei.
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Senior Manufacturing Engineer
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Why Sony Interactive Entertainment?
Sony Interactive Entertainment isn’t just the Best Place to Play — it’s also the Best Place to Work. Sony Interactive Entertainment (SIE) is the company behind the PlayStation brand. As a subsidiary of Sony Group Corporation, we’re part of a proud legacy of innovation and excellence. SIE is a dynamic technology company, delivering cutting-edge hardware and network services to more than 100 million people and an entertainment leader, home to some of the most beloved and recognizable intellectual properties (IP) in the world. Our role at SIE is to create and nurture the experiences under the PlayStation brand, a name synonymous with entertainment excellence and creativity.
Principle Duties / Responsibilities:
In this role, you will lead manufacturing and production optimisation initiatives for several high-profile products from early-stage development through mass production and sustaining engineering phases. As a leader within our development team, you will build and maintain positive working relationships between technical teams, contract manufacturing partners and business/product owners to deliver on strategic product development and sustaining initiatives.
A successful Senior Manufacturing Engineer is energetic, detail oriented, motivated and an excellent communicator. They should be familiar with the different stages of product development, manufacturing, project management methodologies and working with contract manufacturing partners to create best-in-class consumer electronic devices.
The successful applicant is:
- Able to analyse production processes, schedules, methods and other data to provide management with justified recommendations for improving various manufacturing process.
- Focused on continuous production improvement opportunities
- Able to review and calculate labor, material and other production costs to identify areas of cost reduction and improve manufacturing efficiencies
- Well versed in quality control processes identifies areas for improvements in quality control.
- Excited to champion colour variation, limited edition and sustaining engineering related efforts to further promote and improve our growing line of PlayStation products
- Experienced in manufacturing, process engineering, logistics, strategic component sourcing, risk mitigation and/or supply chain management.
- Results oriented with attention to detail and a strategic long-term planning perspective
- Proficient at addressing various partners from individual contributors, up through senior leadership.
- Technically proficient and has prior contract manufacturing partner management experience.
- A liaison to vendors and technical teams to design, develop and deliver products on time and within budget
- Familiar with product lifecycle management methodologies and tools such as Arena
Required Knowledge / Skills:
- Self-motivated with incredible attention to detail
- Deep understanding of manufacturing methodologies related to consumer electronic device production
- Excellent written and verbal communication skills
- Must be inventive and seek solutions through information gathering, partner discussions, and/or judgment calls
- Experience in the video game industry is not required, but interest and passion for gaming, digital entertainment, consumer electronics, and technology is a plus
Qualifications:
Required Experience / Education:
- Bachelor’s degree or equivalent in engineering related fields preferred.
- 7+ years of validated experience in product development or manufacturing related roles with a strong background of supporting the development of new consumer electronic devices
- Led overseas manufacturing partners in planning and performing development builds and new product development stages
- Capable of leading development schedules, production planning and materials readiness efforts to meet product development landmarks.
- Coordinating production readiness with engineering, operations, and internal/external teams
- Optimise production and throughput
- Proficient with multiple software platforms such as MS Office, Confluence, Jira
Working Conditions:
- Strategically located in Taiwan to better support our Asia manufacturing supply chain and Tokyo team member interactions
- International travel required. Estimated 15 - 20%
- Individual Contributor: Does not have direct supervisory responsibilities nor budgetary or hiring accountabilities
Please note, Sony Interactive Entertainment conducts background checks at the offer stage for all new employees (which may include criminal background checks for some roles) and will need to process personal information to support these checks.
Please refer to our Candidate Privacy Notice for more information about what personal information we collect, how we use it, who we share it with, and your data protection rights.
Equal Opportunity Statement:
Sony is an Equal Opportunity Employer. All persons will receive consideration for employment without regard to gender (including gender identity, gender expression and gender reassignment), race (including colour, nationality, ethnic or national origin), religion or belief, marital or civil partnership status, disability, age, sexual orientation, pregnancy, maternity or parental status, trade union membership or membership in any other legally protected category.
We strive to create an inclusive environment, empower employees and embrace diversity. We encourage everyone to respond.
Sony Interactive Entertainment is a Fair Chance employer and qualified applicants with arrest and conviction records will be considered for employment.
Ready to apply?
Apply to PlayStation Global
Layout Engineer
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We are seeking an experienced Layout Engineer specializing in automotive powertrain systems. This role focuses on PCB design for high-voltage and high-current applications, ensuring full compliance with automotive electronics standards and reliability requirements.
You will work closely with hardware engineers, mechanical engineers, manufacturers, and component suppliers to support a smooth transition from design through mass production.
The Role
- Perform high-voltage and high-current PCB layout design for automotive powertrain systems using tools such as Cadence Allegro 24.1.
- Independently define and manage electrical and physical constraints (Design Rules & Constraints), including component placement, impedance matching, and creepage distance / isolation slot design.
- Independently plan and apply layer stack-up architectures, addressing signal routing requirements, reference layer distribution, and power isolation needs.
- Select and evaluate PCB materials and high-Tg laminates suitable for high-voltage and high-current applications, ensuring compliance with automotive reliability standards.
- Independently collaborate with mechanical and signal integrity teams to meet thermal management, mechanical structure, and EMI/EMC requirements.
- Build and maintain component libraries (including 3D model mapping) to ensure data accuracy and consistency throughout the design flow.
- Independently generate manufacturing deliverables (Gerber / ODB++), completing design release while meeting quality and schedule targets.
- Work closely with PCB manufacturers to ensure DFM/DFA compliance, reduce manufacturing cost, shorten production cycles, and improve overall product reliability.
- Independently participate in design reviews, provide technical recommendations, and support issue resolution during design and manufacturing phases.
- Continuously research and adopt new technologies to improve design efficiency and reduce cost.
Requirements
- Bachelor’s degree in Electrical Engineering or a related field.
- 6-10+ years of experience in automotive electronics or high-voltage/high-current PCB design, with solid multi-layer PCB capabilities.
- Strong understanding of PCB / PCBA manufacturing processes.
- Familiarity with automotive electronics standards, such as IPC Class 3.
- Proficiency with Cadence Allegro 24.1, Valor, Campro, Capture CIS 24.1, and related PCB design tools.
- Strong communication and teamwork skills; ability to work effectively in a fast-paced environment.
- Fluent in Mandarin and working level proficiency in English.
Preferred
- Experience with high-reliability or automotive mass production designs.
- Familiarity with Rigid-Flex PCB design.
- Experience leading or mentoring junior layout engineers.
- Experience with design automation scripting (e.g., SKILL or other scripts) to support design workflows.
- Familiarity with ODBC / CIP / EDM / Campro Checklist Rules Manager.
- Experience with mechanical tools such as eDrawings Viewer is a plus.
Additional Compensation and Benefits: Lucid offers a wide range of competitive benefits, including medical, dental, vision, life insurance, disability insurance, vacation, and 401k. The successful candidate may also be eligible to participate in Lucid’s equity program and/or a discretionary annual incentive program, subject to the rules governing such programs. (Cash or equity incentive awards, if any, will depend on various factors, including, without limitation, individual and company performance.)
By Submitting your application, you understand and agree that your personal data will be processed in accordance with our Candidate Privacy Notice. If you are a California resident, please refer to our California Candidate Privacy Notice.
Ready to apply?
Apply to Lucid Motors
Advanced Packaging Process Engineer
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Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet packaging to join Tenstorrent’s Packaging team. You will drive advanced package technology and reliability in close partnership with foundries and OSATs, helping push performance and manufacturability for next‑generation AI/ML products.
This role is hybrid, based out of Santa Clara, CA or Taipei City, TW.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who you are
- Advanced packaging engineer with hands-on 2.5D/3D experience (CoWoS-R/L, FOCoS, EMIB, FCBGA, organic substrates, silicon interposers, embedded Si/eCB, micro-bumps, BGAs).
- Strong in reliability and failure analysis for advanced packaging, including qualification, root cause analysis, and corrective actions.
- Deep understanding of process flows and materials (polyimide, ABF, core, underfill, mold compound) and their interactions (warpage, stress, delamination, mechanical risk).
- Proven track record working with foundries/OSATs on NPI, design rules, excursions, yield/cost optimization, and production ramp, with clear communication and cross-functional collaboration.
What we need
- Own advanced package technology implementation for 2.5D/3D chiplet products, including technology choices, process integration, and manufacturability.
- Act as primary technical interface to foundries/OSATs: align capabilities and design rules, manage excursions, drive yield, define/track test vehicles, and coordinate FA.
- Partner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs.
- MS/PhD in a relevant field (Materials, Mechanical, Electrical, Physics, or related) and 5+ years in advanced packaging for high-performance semiconductors from NPI through production (2.5D/3D flows such as CoWoS, FOCoS, EMIB, FCBGA or equivalent).
What you will learn
- Deeper exposure to leading-edge 2.5D/3D packaging for high-performance AI/ML and chiplet-based architectures.
- How to balance performance-driven architecture with mechanical and reliability constraints to make robust package technology decisions.
- Ways to use AI- and automation-driven methods to accelerate risk assessment, qualification planning, and technical documentation.
- Best practices for building strategic OSAT and foundry partnerships that enable new capabilities while scaling reliable high-volume production.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
Ready to apply?
Apply to Tenstorrent
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
ASM is recruiting for Field Process Engineer in our ALD/ CVD/ CMP business function located in North Taiwan. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
Responsibilities:
- Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
- Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
- Drive and manage new product penetration & installation and subsequent process development.
- Define project scope and resource planning together with BU, escalate to Manager for resource gap.
- Drive continuous improvement of the customer experience through team, process and support tool development.
- Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.
Qualifications:
- PhD is preferred; Master/PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical engineering or a related discipline.
- 3+ years experience in thin-film/CVD/ALD/CMP
- Strong understanding of engineering principles related to process operations.
- Basic knowledge of process control systems and equipment.
- Strong analytical and problem-solving skills.
- Excellent communication and teamwork abilities.
- Ability to work in dynamic, fast-paced environments.
- Willingness to travel from 25% up to 50% to field sites as required.
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
Ready to apply?
Apply to ASM