À propos de ce poste APEC Application Development Engineer – Tyvek® Consumer & Industrial chez DuPont
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INTRODUCTION
This position is based in one the APEC offices of DuPont, a global leader in protective materials.
As Application Development Engineer, you will play a pivotal role in supporting customer needs by driving the development of new applications, by leading the development of new products and providing expert technical guidance on the use, handling, and management of DuPont Tyvek® products.
ROLE & RESPONSIBILITIES
In this role, you will:
Industry & Customer Engagement:
Act as the primary technical interface between DuPont and semiconductor customers across Taiwan and the broader APAC region.
Develop strong relationships with wafer manufacturers, OSATs, advanced packaging companies, IC substrate producers, packaging material converters, and equipment suppliers.
Lead technical discussions, application reviews, product evaluations, and qualification activities with customers.
Application Development
Drive the development of new Tyvek® applications in interleafing & active packaging.
Identify unmet customer needs and translate them into application concepts, product requirements, and commercialization opportunities.
Technical Leadership
Serve as the internal subject matter expert (SME) for semiconductor packaging, contamination control, ESD management, moisture protection, and interleafing applications.
Lead root-cause investigations and problem-solving activities related to particle contamination, ionic contamination, ESD performance, material handling, automation compatibility, and product performance.
Collaborate closely with global R&D, Product Management, Manufacturing, and Quality teams to develop and optimize solutions.
Product Qualification & Commercialization
Support customer qualification activities through test planning, data analysis, and performance validation.
Generate technical evidence supporting key customer requirements
Drive specification-in activities and support commercial adoption.
QUALIFICATIONS
Education & Experience:
Required
Master’s degree in Electronic Engineering, Physics, Material Science, Chemical Engineering, or a related field.
Minimum 5 years of experience in semiconductor materials, packaging materials, wafer handling, contamination control, semiconductor packaging, substrate manufacturing, or related applications.
Proven experience working directly with semiconductor customers in technical development, process engineering, application engineering, or product development roles.
Experience supporting cleanroom manufacturing environments.
Experience leading customer-facing technical projects from concept through commercialization.
Preferred
Experience with semiconductor interleafing, wafer separators, IC substrate packaging, desiccants, cleanroom packaging, ESD packaging, or contamination-control materials.
Familiarity with semiconductor ecosystem companies such as foundries, memory makers, OSATs, substrate manufacturers, and packaging converters.
Knowledge of wafer fabrication, advanced packaging, chiplet architectures, AI/HPC supply chains, or semiconductor logistics.
Experience with material qualification and semiconductor quality requirements.
Skills & Competencies:
Strong analytical, creative, and conceptual thinking skills; results-driven mindset.
Excellent communication skills (written and oral) in English;
Self-starter with proactive attitude and ability to work independently.
Strong presentation and stakeholder engagement skills.
Proficiency in MS Office (Word, Excel, PowerPoint, Outlook).
Willingness to learn and continuously develop technical expertise.
Ability to travel up to 20%-30%.
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DuPont offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.
