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Sobre este puesto de Tech Lead, STA en Astera Labs

Astera Labs · Presencial · Hyderabad, Telangana, India

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Tech Lead STA Engineer

Location - Hyderabad

Experience - 6-14 years

 

Role Overview

Astera Labs is hiring a Principal Engineer, Static Timing Analysis to own top-level timing closure and signoff for our next-generation connectivity silicon powering rack-scale AI infrastructure. In this role, you'll drive full-chip STA strategy across advanced process nodes, partner with physical design, RTL, DFT, and CAD teams, and ensure first-pass timing success on some of the most complex SoCs in the industry.

This is a high-impact technical leadership role at a hyper-growth company purpose-built for AI connectivity. Your work directly enables the PCIe, CXL, UALink, and Ethernet platforms that hyperscalers depend on — and you'll have the ownership, influence, and tooling to do the best work of your career.

Key Responsibilities

  • Full-Chip STA Signoff & Timing Closure
    • Own end-to-end top-level STA signoff across multiple modes, corners, and operating conditions (MMMC) for complex AI connectivity SoCs
    • Drive timing convergence on advanced process nodes (5nm/4nm/3nm and below) from early floorplan through tapeout
    • Analyze and resolve setup, hold, recovery/removal, and clock-domain crossing (CDC) timing violations at the chip level
  • Methodology & Flow Development
    • Define and evolve STA methodology, constraints (SDC) strategy, and signoff criteria across the organization
    • Develop and automate flows using PrimeTime, PrimeTime SI, and related signoff tools for crosstalk, noise, and IR-aware timing
    • Establish best practices for hierarchical STA, ETM/IPXACT model generation, and budgeting across blocks
  • Cross-Functional Technical Leadership
    • Partner with Physical Design, RTL, DFT, CAD, and Package teams to drive timing-aware design decisions from architecture through tapeout
    • Review and sign off on block-level timing handoffs, ensuring consistency between block and top-level closure
    • Collaborate with low-power design teams on UPF/CPF, multi-voltage, and clock-gating timing implications
  • Mentorship & Technical Strategy
    • Mentor STA engineers and review timing reports, ECOs, and signoff collateral
    • Drive root-cause analysis of silicon timing issues and feed learnings back into methodology
    • Influence tool selection, EDA vendor engagements, and STA roadmap for future products

Basic Qualifications

  • Bachelor's degree in Electrical Engineering, Electronics Engineering, or related field
  • 6+ years of hands-on experience in Static Timing Analysis on complex ASIC/SoC designs
  • Proven track record of full-chip top-level STA signoff on at least one tapeout at advanced nodes (7nm or below)
  • Deep expertise with PrimeTime, PrimeTime SI, and SDC constraint development
  • Strong understanding of clocking architectures, CDC, OCV/AOCV/POCV, crosstalk, and IR-aware timing
  • Proficiency in scripting (Tcl, Python, Perl) for STA flow automation and report analysis

Preferred Qualifications

  • Master's degree in Electrical Engineering or related field
  • Experience with high-speed connectivity SoCs (PCIe Gen 6/7, CXL, UALink, or Ethernet)
  • Familiarity with hierarchical STA, ETM/ILM models, and timing budgeting across large partitions
  • Experience with low-power signoff (UPF/CPF), multi-voltage domains, and DVFS timing implications
  • Strong cross-functional collaboration and mentorship skills in a fast-paced product environment

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

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