Sobre este puesto de Embedded SW & Firmware Leader en GE Vernova
GE Vernova · Presencial · Hyderabad
Job Description Summary
We are looking for an Embedded SW & Firmware Leader to manage our team for the HVDC SL - Product Care business. You will lead the day-to-day execution of our software products, define our technical roadmap, and ensure the delivery of high-quality, innovative solutions. You will also play a key role in growing our engineering team in Hyderabad and collaborating across the company to achieve our business goals.Job Description
Key Responsibilities
- Leadership: Manage and mentor a high-performing engineering team while fostering a culture of professional growth.
- Strategy: Develop and implement the roadmap for embedded software tools.
- Collaboration: Work with NPI and program teams to ensure projects are delivered on time.
- Technical Guidance: Act as a technical expert to solve complex challenges and improve overall engineering standards.
Required Qualifications
- Education: Bachelor’s or master’s degree in engineering, Computer Science, or a related field (or equivalent experience).
- Experience: 10+ years of experience in embedded systems, including hands-on work with hardware/software and multicore performance optimization.
- Technical Skills:
- Proficiency in C/C++.
- Experience with RTOS (task management, interrupts).
- Knowledge of Linux, microservices, container technologies (Docker, Kubernetes), and virtualization.
- Expertise in communication protocols (DNP3, Modbus, IEC 60870, IEC 61850).
- Leadership: Proven track record of managing teams and leading complex projects to completion.
- Problem-Solving: Strong analytical skills for troubleshooting and system optimization.
Desired Characteristics
- Communication: Excellent verbal and written communication skills.
- Strategic Thinking: Ability to influence stakeholders and build consensus.
- Project Management: Skilled in planning and executing complex programs.
- Adaptability: Comfortable working in a fast-paced environment with evolving technologies.
Additional Information
Relocation Assistance Provided: Yes
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