The Role:

Radio Frequency (RF) Engineer at ASM will provide solutions for difficult RF technical issues associated with specific projects, contribute to the timely completion of specific programs and projects, possess the ability to work on complex assignments with some guidance and direction from the Engineering Manager.

Responsibilities:

• Develop RF module and reactor of ASM products.
• Using conventional RF source and antennas provide reliable structure to provide stable performance in extreme and harsh conditions.

• Troubleshooting and modification of RF generator and matching network
• Understanding plasma characterization and troubleshooting the Plasma/RF related issues

• Coding FPGA chips to control modules and parts to maximize plasma performance of ASM Products

Education & Experience:

• Master's or Ph. D Degree in Electronics, Physics, or relevant disciplines.
• 3+ year experience in RF plasma field which including modules and parts is preferred.
• Have a broad-based background in analysis, design and debug of complex RF systems.
• Design, implement, maintain, and improve electrical instruments, equipment, facilities, components, products, and systems for the semiconductor equipment industry.
• Well versed with the requirements of CE, NEC, IEC, NFPA, VDE, SEMI S2-95 and other relevant standards as applicable to semiconductor manufacturing equipment.
• Experience with modularizing semiconductor equipment designs for offline assembly.
• Experienced using Microsoft applications such as Excel, Word, PowerPoint, and Project; Manufacturing Requirements Planning (MRP); AutoCAD; OrCAD or Altium schematic capture.
• Business level English

Functional Knowledge

• Plasma Deposition product knowledge a plus (CVD, ALD, EPI, PECVD, PEALD)

Job's mission

Join a team that transforms ideas into real-world solutions. As a System Engineer at ASM, you’ll contribute to the development and integration of advanced technologies that power the semiconductor industry. Your work will ensure our systems are designed, tested, and delivered with precision and purpose.

What you will be working on

• Apply design engineering principles, product specifications and research data to create designs for systems and products for semiconductor industry.
• Develop fail safe, cost effective designs for lower level sub-assemblies used in microprocessor controlled semiconductor equipment.
• Integrate lower level assemblies to obtain a desired system level configuration.
• Adapt digital and analog I/O requirements to achieve customer specific configurations.
• Provide technical support for capital orders, expense projects, retrofits and development projects.
• Evaluate engineering change requests and implement changes as necessary following established procedures and schedules.
• Participate in design reviews prior to releasing new designs to production.
• Support testing of hardware for cost reduction and product improvement projects to verify performance objectives. Design and build test equipment, support basic instrumentation with hardware, create test procedures, perform electro-mechanical tests as required and maintain reliability data and records of all evaluations performed.
• Assess feasibility of product proposals, resolve technical issues, develop new systems, tools, and units while adhering to product design safety criteria.
• Report generation, schedule creation and maintenance, and inter-team coordination.

Key Requirements

• Master’s or PhD in Electrical and Electronics Engineering.
• Ast least 5 years of work experience as a System Engineer in a semiconductor equipment manufacturing company, with expertise in equipment electrical hardware design or development of units/systems like Reactor or Plasma Source, etc.
• Proficiency in Auto CAD technique and also in JMP
• Ability to thrive in a fast-paced, team-oriented environment supporting a global customer base.
• Clear communication skills in English (Dongtan and Tama both) and Korea (Dongtan) or Japanese (Tama).
• A person with fundamental knowledge that enables learning about future processes and mechanisms.
• A person with basic knowledge and aptitude to grow into a system engineer in the future.
• A person who has the motivation to develop into a system engineer in the future.

We are seeking a motivated intern to support advanced metrology development activities focused on improving measurement accuracy and modeling robustness across key characterization techniques. This role is ideal for candidates interested in semiconductor process characterization, data analysis, and design of experiments (DOE) methodology.

What you will be working on

The intern will work with the Process Engineering and Metrology teams to:

1. Transmission Electron Microscopy (TEM) Variability & Error Modeling
•    Characterize sample to sample and region to region variability in TEM measurements.
•    Quantify measurement uncertainty and establish statistically meaningful error bars.
•    Translate TEM measurement error into corresponding DOE model error.
•    Assess how measurement uncertainty impacts p values, model significance, and predictive validity.
•    Propose methods to reduce overall model noise—either through measurement improvements or smarter experimental design.

2. Ellipsometry Modeling and Material Optical Properties (n, k)
•    Support extraction and optimization of refractive index (n) and extinction coefficient (k) for new films.
•    Analyze how ellipsometry model assumptions impact derived film thickness and composition.
•    Investigate thickness dependent behavior: identify thresholds where goodness of fit (GoF) degrades as thickness increases.
•    Evaluate breakdown mechanisms (e.g., over simplified dispersion models, depolarization effects, parameter cross correlation).

3. DOE Data Integration & Improvement
•    Combine metrology data streams (TEM, ellipsometry) to build more realistic input distributions for DOE.
•    Quantify how measurement error propagates into model confidence levels and sensitivity indices.
•    Recommend approaches to improve DOE outcomes (e.g., reduced uncertainty, alternative sampling plans, model weighting).

4. Deliverables
By the end of the internship, the student is expected to deliver:
•    A quantified error propagation framework linking key metrology tools to DOE output quality.
•    A statistical report detailing major sources of measurement uncertainty and recommended mitigation paths.
•    Updated ellipsometry models (n, k, dispersion) or parameter sets that improve GoF for thick films.
•    A final technical presentation summarizing findings, insights, and process improvement opportunities.

What we are looking for

•   Working towards his doctoral degree with focus on Physics, chemistry or material science. Other engineering disciplines might be considered.

The primary responsibility of this role is to manage and drive the process engineering function for a key product group in the ASM’s Atomic Layer Deposition (ALD) technology with a focus on results. This will require a strong leader that is highly skilled in people, process and technology across ASM’s ALD operations. Further, the role requires someone who is not only skilled in R&D/Innovation, development, engineering and design for manufacturability, but also someone who is adept at process and organization, continuous improvement and working with and managing people across cultural dimensions in developing and delivering the ALD technology roadmap. A persistent approach to Product Life Cycle (PLC) will be required to achieve strong engagement with the team, develop and implement new processes and organization, and manage the team to achieve PLC deliverables and drive projects to completion, exceeding timelines and budgetary objectives. This position facilitates getting ASM products to market as quickly as possible by directly influencing and communicating with key customers to solve their high value problems. The successful candidate will have a track record of recruiting and developing industry leading process engineering teams. 

Specific Responsibilities:  

• Run the day-to-day management of the key product process engineering teams with an emphasis on results. 

• Set, evangelize, and implement ASM processes. 

• Collaborate with the KPU head to set the vision for the technology and roadmap. 

• Embody ASM’s mission and values, and consistently reinforce them with the team through everyday actions. 

• Develop and deliver the technology roadmap and execute on the product roadmap in collaboration with GPM and KPU Head. 

• Lead Product Lifecycle Cycle (PLC) team in developing and delivering next generation systems to the market. 

• Responsible for managing development execution (performance, cost, schedule, etc.). 

• Provide support for existing products and drive continuous improvement efforts. 

• Must be able to work across organizations, particularly hardware and software engineering, to define success criteria of products and drive new product development 

• Develop and maintain relationships with key customers. Work closely with the key account technology (KAT) organization to ensure that customer needs are met and qualification of new products and processes is done on time and to specifications 

• Contribute to product roadmap by working with Product Marketing and key customers. 

• Support annual strategic planning process to drive future business direction. 

• Successfully drive projects and recruit premier engineering talent. 

Qualifications:  

• Bachelor’s degree in Chemical Engineering, Material Science, Physics or Mechanical Engineering or related field, required. Master or PhD preferred. 

• At least 10 years of experience in semiconductor equipment development. 

• A track record of successfully building semiconductor equipment products under cost and ahead of schedule. 

• Proven ability to lead and drive process engineering teams  through product development and market introduction with an ability to develop process engineering managers 

• A track record of successfully managing, recruiting, developing, and scaling extraordinary teams. 

• Proven ability to drive continuous improvement across operations. 
• Business level English and Japanese

Job Summary:​

We are looking for a Technical Program Manager (TPM) to lead and drive complex hardware-focusedproduct programs through the full product lifecycle from concept and feasibility to high-volumemanufacturing (HVM).​

The TPM will work cross-functionally with product management, process development, engineering,manufacturing, supply chain, and global product support teams to ensure programs are delivered ontime, within cost targets, and in alignment with customer and business requirements.​

This role requires strong program execution skills, technical understanding of hardware development,and the ability to manage multiple stakeholders across global teams.​

Responsibilities:​

Own and manage the NPI (new product introduction) program through the PLM development process from concept and feasibility to release.​

1. Drive tollgate-based product life cycle (PLC) management by reviewing stage-specific development tasks with functional owners, tracking milestones, managing risks, and ensuring schedule adherence.​
2. Coordinate with stakeholders on NPI products to meet required specifications, including SEMI standards and hardware requirements.​
3. Track NPI builds and assist with demo lab procurement of new chambers or major retrofits.​
4. Analyze and manage new product costs against ROI targets.​
5. Lead cross-functional teams and act as a communication bridge among R&D, manufacturing, quality, Marketing and sales.​
6. Ensure resource allocation aligns with divisional priorities to meet project timelines for assigned programs.​
7. Define product specifications and identify key hardware changes with stakeholders during the C&F stage.

   Experience & education:​

   1. BS degree in material science, electrical, mechanical, chemical, or industrial engineering, orequivalent technical education.​
   2. More than 3 years of experience in semiconductor marketing, supply chain management, or sales;experience in project management is a strong plus.​
   3. Working knowledge of project management and semiconductor equipment commercialization, withexperience supporting MRS, ROI analysis, cost tracking, and milestone management activities.​
   4. Proficient in learning complex technical subjects.​
   5. Effective communication, negotiation, and written skills; English and Japanese required.​
   6. Demonstrated ability to support effective internal and external collaboration and contribute toresource planning and execution.​
   7. Positive, energetic attitude with a strong work ethic.
   ​

The intern will review PEALD SiN gap-fill process and figure out the mechanism of specific recipe. In parallel, they will review process results and analyze effective deposition parameters for performance improvement. Finally, they will summarize their findings to build the mechanism with physical/chemical model and experimental data.

What you will be working on

The intern will go through process responses by the single parameter skew. Deposition recipe consists of a lot of parameters. Referring to the typical recipe, it will be to start with suspected effective parameters. Then, they will analyze the process sensitivity in each parameter to figure out what parameter is effective and how effective process improvement is, especially on gap-fill capability (GPC profile) and throughput. There should be some trade-off relationships. The analysis can clarify the effective parameter(s) to have good gap-fill capability and throughput. They will propose what recipe should be good to achieve the target or to maximize throughput, if they have simulation capability, they can collaborate with the team and validate the model of the mechanism by the simulation. The final goal is to show the direction of gapfill performance improvement based on experimental data and theoretical models.

What we are looking for

For this project, an intern with Materials Engineering, Applied Chemistry, Chemical Engineering and Electronic Engineering or other types of Engineering (Plasma related is preferred) would be ideal. Considering the scope of this project, doctoral degree level is preferred, although a master’s degree level with specific experience would also be acceptable.

Job's mission

Development of gapfill process on our D-lab tool. Conducting DOE experiments and collect data (dep rate, WiW uniformity, Stress, WER, conformality) to optimize our process and accumulate process knowhow.

Project Details

1. New inhibitor development like CH4 type gas and liquid chemical
Tool Operation and Wafer Preparation:
Operate specialized equipment to prepare wafers and Front-Opening Unified Pods (FOUPs).
Ensure precise handling and processing of materials to maintain high-quality standards.

2. Measurement and Data Analysis:Utilize advanced measurement tools to gather data on wafer conformality.
Analyze Transmission Electron Microscopy (TEM) images to assess conformality and other critical parameters.
Interpret data to identify trends and anomalies, providing insights for process optimization.

3. Hardware Involvement:
Participate in hardware-related tasks aimed at expanding our process window.

What we are looking for

• PhD student majoring in Materials Science, Chemical Engineering, Applied Physics, or a related field.
• Strong academic background and hands-on lab or research experience preferred.
• If the candidate is successful and demonstrates both technical competence and cultural fit, a conversion offer may be considered.

Top 3 Skillsets

1. Electrical measurement (I–V testing)
2. Materials analysis (FTIR, XPS)
3. Data analysis and problem-solving

(11465)

Job's Mission 

As a R&D Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position.

What you will be working on 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via PEALD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.

What we are looking for

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Fresh PhD graduates OR MS degree holder with 2+ years of work experience with: PEALD, ALD, PECVD, CVD, Epitaxy, and/or other thin film deposition.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.
• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills in both English and Japanese, with ability to clearly communicate advanced technical constructs in direct and concise manner.

Job's mission

The intern will analyze leakage mechanisms in flowable low-k SiOCH films using I–V measurements and structural analysis (FTIR/XPS). The project focuses on correlating material structure with leakage behavior, using only generalized or literature-based conditions to ensure compliance with ASM’s IP protection policy.

The intern will work with dummy samples simulating typical low-k films (SiOCH-based). They will perform I–V/C-V testing to identify leakage models (e.g., Poole-Frenkel, tunneling) and use FTIR/XPS to evaluate bonding states and composition. The experimental design would use a two-factor DOE (e.g., temperature × cure time). Data analysis will focus on model fitting and correlation between structural and electrical properties. All deliverables will be reviewed and masked to avoid IP-sensitive content.

What we are looking for

• A student with a background in Materials Science, Chemical Engineering, Applied Physics, or a related field. Experience with electrical measurements or materials characterization is preferred. Master’s or PhD’s level students are eligible.

Top 3 Skillsets:

1. Electrical measurement (I–V testing)
2. Materials analysis (FTIR, XPS)
3. Data analysis and problem-solving

Project:

• LEAS, TiN THK NU/Conformality improvement

What you will be working on

• Based on blanket study, process characterization and relationship to deposition conditions
• Understand the fundamentals of Plasma-based deposition and the interaction between HW and process (plasma power, pressure, etc.) through DOE evaluation
• Training in XPS, AFM, XRR, Ellipsometry, Nanoindentation fundamentals and characterization analysis
• Conduct regular SPC monitoring & improve process stability
• Understand sensitive/key parameters and reflect to HW start up procedure
• Present the key achievement in a large audience forum

What we are looking for

• Ph.D. student in Materials Science and Engineering, Chemical Engineering, Physics, Plasma Engineering, or a related field with hands-on experience with plasma reactors
• Knowledge of fundamental principles of deposition and fundamental limits of thin film characterization
• Strong interest toward operating ASM chambers and developing process conditions based on mechanistic understanding
• Understands the importance of safety and working culture in Lab
• Comfortable in presenting and sharing results in a scientific and collaborative way

(12116)

Job's mission

Development of gapfill process on our D-lab tool. Conducting DOE experiments and collect data (dep rate, WiW uniformity, Stress, WER, conformality) to optimize our process and accumulate process knowhow.

What you will be working on

1. Tool Operation and Wafer Preparation:
lOperate specialized equipment to prepare wafers and Front-Opening Unified Pods (FOUPs).
lEnsure precise handling and processing of materials to maintain high-quality standards.

2. Measurement and Data Analysis:
lUtilize advanced measurement tools to gather data on wafer conformality.
lAnalyze Transmission Electron Microscopy (TEM) images to assess conformality and other critical parameters.
lInterpret data to identify trends and anomalies, providing insights for process optimization.

3. Hardware Involvement:
lParticipate in hardware-related tasks aimed at expanding our process window.

What we are looking for

• Master’s or PhD student majoring in Materials Science, Chemical Engineering, Applied Physics, or a related field.
• Strong academic background and hands-on lab or research experience preferred.
• If the candidate is successful and demonstrates both technical competence and cultural fit, a conversion offer may be considered.

We are seeking a highly skilled Mechanical Design Engineer to join our team in the development and improvement of semiconductor manufacturing equipment, specifically focusing on chambers, gas/vacuum units, and other critical components and mechanisms.

Key Responsibilities:

• Design chambers, gas parts, vacuum parts, RF parts, control parts and etc. for the tool.
• Develop new tools and functionalities, as well as improve existing tool.
• Evaluate new tools and newly designed parts.
• Troubleshoot problems occurred on lab tool and customer tool.
• Interact with other teams and also customers to develop new tool and/or resolve issues.
• Analize failed part to find the root cause.
• Simulate part’s strength, gas flow, plasma and etc.
• Prepare instruction manuals and documentation.

Key Requirements:

A university graduate with a degree in mechanical engineering or above in relevant field.

• More than three years of 3D CAD experience.
• More than five years of experience in mechanical design.
• Strong logical thinking skills and the ability to communicate concisely.
• Ability to communicate effectively in English.
• Available for oversees business travel approximately five times per year (Around two weeks each).

Work Location : Tama, Tokyo Japan

Job's mission

The intern will support the planning and execution of Design of Experiments (DOEs) aimed at improving the material properties of key PECVD films.

What you will be working on

The intern will run baseline deposition recipes and assist senior process engineers in optimizing PECVD processes to enhance film quality, and productivity like defectivity, and film non uniformity.
The role involves hands on work in the cleanroom using state of the art deposition equipment and characterization tools. The intern will develop DOE plans and execute experiments under the supervision of ASM process engineers. Experimental results will be analyzed using in house metrology and characterization tools such as VASE ellipsometry, SP5, EDX, Hg probe, FTIR, AFM, XRR, and nano indentation.

What we are looking for

An ideal candidate will have a background in materials science and/or plasma physics with experience or coursework in thin film deposition techniques. It is preference of clean room working experience and vacuum chamber handling experience. Due to the technical depth of the project, candidates pursuing or holding a Master’s or PhD degree are preferred.

Job's mission

Each product line of XP8 DCM and JQCM has a complex building‑block structure that supports advanced process technologies. The intern will involve a cross‑functional review of the electrical wiring diagrams and building‑block structures for both product lines, analyzing and identifying design redundancies and common elements. Through this activity, the intern will aim to gain a deep understanding of the process module configuration of DCM and JQCM. Finally, based on the elements identified as candidates for commonality, the intern will propose standardization ideas that can contribute to improved design efficiency, cost reduction, and shorter development lead time.

What you will be working on

XP8 DCM and JQCM are composed of complex building‑block structures (BOMs). In this internship, the intern will systematically break down these complex BOMs and electrical wiring diagrams, reviewing and learning the commonalities and differences across product lines. The analysis approach begins with the high‑cost layers that are widely used across the XP8 DCM and JQCM product portfolios. Next, as part of the compatibility assessment, the intern will examine component‑level differences and determine whether functionally compatible alternatives exist. All components will be categorized into “Common” and “Functional Equivalent” groups, and the intern will redefine the component structure from this perspective. As part of design and development validation, the intern will work with related departments to reassess the technical rationale for the current differences. For manufacturing and procurement optimization, the intern will collaborate with FEMS ME to explore improvements to kit structures. The ultimate objective is to identify concrete and actionable cost‑reduction measures through standardization that can be applied across the entire XP8 DCM and JQCM product lines.

What we are looking fo

The ideal candidates for this internship are students in electrical engineering, manufacturing engineering, or other related engineering fields. A bachelor’s‑level academic background provides sufficient technical preparation to carry out the responsibilities associated with this project.

The intern will undertake a comprehensive evaluation of the Building Block Structure associated with the XP8 DCM product line, with the objective of attaining an in‑depth understanding of the configuration framework governing DCM process modules. Following this evaluation, the intern will delineate the common components and the specification variances across the various applications. Ultimately, the intern will conduct a structural analysis of each application and develop a detailed report outlining the principal design considerations.

What you will be working on

The intern will perform a structured review of the multi‑tiered Bill of Materials (BOM) for the DCM tool. The analysis will commence with the identification of components that are universally employed across the DCM product portfolio. Subsequently, the intern will assess component‑level differences to determine whether functionally interchangeable alternatives exist.
Upon completion of the classification of components into common, functionally equivalent, and application‑specific categories, the intern will collaborate with relevant stakeholder groups (including, but not limited to, the Process Development Team) to evaluate the rationale for such variations and to consider the implications of applying these variations uniformly across all applications.
The overarching objective of this project is to formulate viable recommendations for standardization.

What we are looking for

This project is ideally suited for interns majoring in Mechanical Engineering, Manufacturing Engineering, or other engineering disciplines.  A bachelor’s‑level academic background provides adequate technical preparation to execute the responsibilities associated with this project.

This intern will work on new metal films development for advanced nodes.

What you will be working on

• Based on blanket study, process characterization and relatioship to deposition conditions
• Training on different deposition methods (PEALD, PECVD, ALD) to understand the fundamentals of Plasma-based deposition and the interaction between HW and process (plasma power, pressure, etc.)
• Training on XPS, AFM, XRR, Ellipsometry, Nanoindentation fundamentals and characterization analysis
• Develop HW health check methodology and improve any current HW start up procedure
• Document the learning and apply it to process start up procedures to enhance our tool productivity & stability
• Present the key achievement in a large audience forum

What we are looking for

• Ph.D degree for Material Science Engineering, Chemical Engineering, Physics, Plasma Engineering or similar majors with hands-on experience with plasma reactors

Job's mission

You will work on mechanical design for PECVD tool and its evaluation.

What you will be working on

• Learn entire process chamber configurations including gas parts, vacuum parts, RF parts, control part and etc.
• Design particular portion mentioned above to improve performance. (Current problem and success criteria will be shared before designing it. And discuss how to improve it.)
• Install the parts to the lab tool.
• Evaluate the performance.

What we are looking for

• A student majoring in mechanical engineering who hopes to work in the semiconductor industry in the future.
• General mechanical engineering knowledge.
• Mechanical design knowledge.
• 3D CAD skill.

ASM is recruiting a Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PEALD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education: PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics. 

• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.
• English business level

Work Location : Tama, Tokyo Japan

[Responsibilities]

• Customer Support & Escalation Management
  • Act as the single point of contact (POC) for customer technical issues and requests
  • Own customer escalations from problem identification through root cause analysis and final closure
  • Lead cross‑functional task forces and interface with BU Engineering and global support teams to resolve critical issues
• Tool Performance & Availability Improvement
  • Drive continuous improvement of system uptime, availability, and performance at customer sites
  • Analyze top issues using Pareto and data‑driven methodologies and prioritize corrective actions
  • Ensure implementation of corrective and preventive actions to avoid repeat issues
• Quality, NC, and Retrofit Management
  • Manage Non‑Conformances (NCs) and lead completion of 8D reports for critical issues
  • Support FCO, retrofit, and TSB activities for released products
  • Oversee IQ and warranty management to meet cycle time, cost, and quality targets
• NPI / CIP Support
  • Support NPI and CIP activities from a customer and field implementation perspective
  • Act as the product expert for assigned tools, ensuring knowledge transfer and best practice deployment
  • Collaborate with internal teams to feedback customer issues and drive design and process improvements
• Communication & Stakeholder Management
  • Provide clear and timely communication of issue status, risks, and action plans
  • Align internally with management and engineering on priorities and customer commitments
  • Maintain strong, trust‑based relationships with customers through professional and effective communication

[Requirements]

• Bachelor’s degree or higher in Engineering or a related technical field
• Business level of Japanese and English ability
• Strong system‑level understanding of hardware, software, and process integration
• Experience in semiconductor equipment support, product support, or field engineering roles
• Proven ability to manage customer escalations and work in high‑pressure environments
• Willingness to travel frequently to customer sites (travel percentage varies by assignment)

[Competencies]

• Strong customer focus and ownership mindset
• Structured problem‑solving and root cause analysis skills
• Excellent communication and stakeholder management skills
• Ability to lead cross‑functional teams and drive issues to closure

ASM is recruiting a Senior Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PEALD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education:

PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics.

Or

Masters with at least 10 years of relevant industry experience and some leadership experience (ex. Team leader)

• At least 3 years of experience as a Process Engineer in the Semiconductor Equipment Industry, preferably in ALD, PEALD, PECVD, Etch, and/or Process Integration.
• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.

Highly Desirable Skills:

• Experience in troubleshooting and/or good understanding Process Integration challenges.
• Experience in measuring and improving device fabrication yield in Pilot lines or High Volume Manufacturing.

Work Location : Tama, Tokyo Japan

The Key Account Technology Engineer is the ASM product expert who supports extensive customer and internal company contacts for coordinating the introduction of new products, product improvements, and non-conformances/escalations at the customer. This includes leading projects/programs supporting these activities. The focus of this job is on managing all the technical account aspects of the customers in the assigned region. Responsibilities

· Drive NPI & evaluations by leading the project including hands-on work at the customer location, implement BU developed BKMs or CIPs at customer and execute necessary actions and modifications.

· Provide answers to our customers by identifying problems, researching answers and guiding customer through corrective steps to resolve high value problems at customer sites.

· Understand customer timelines for film development / roadmaps for current and future technology nodes and transfers the information to product management, business development and R&D.

· Identify technical inflections points and work with R&D to ensure customer requirements and learnings are implemented into product development.

· Responsible for the performance of our equipment at the customer. Customer specifications which are non-ASM standard are signed by the KAT.

· Recognize early non-conformance of our product and takes the necessary steps for corrective actions, including analyzing data, involving hardware and process exports.

· Take responsibility to solve any escalation as efficient as possible problems, for NPI and installed base.

· Support process team in demo lab execution of customer specific DOEs and processes.

· Own execution of customer demos for new processes and NPIs.

Qualification

· Masters in chemical engineering, electrical engineering, physics, or material science.

· 5-10 years in the semiconductor wafer processing or capital equipment industry with experience in process engineering and/or technical marketing. Direct experience with silicon wafer processing preferred.

Skills

· Strong problem-solving skills

· Ability to collaborate and partner with key stakeholders and customers

· Demonstrated ability to communicate effectively in verbal and written form. Present advanced technical constructs in direct and concise manner.

· Travel up to 10% - 25%, domestically and internationally (Ability to travel internationally)

· Fluent in Chinese (as the role support the customer in Taiwan) and business level of English.

Job's mission

As a Process Integration Engineer (Mechanical focus), you’ll be at the heart of innovation, designing and refining the mechanical systems that power our advanced semiconductor equipment. From chambers to gas and vacuum units, your work will directly impact the performance and reliability of the tools used by leading tech companies around the world. This is a hands-on role where your expertise will shape the future of semiconductor manufacturing.

What you will be working on

• Lead R&D for mechanical components and systems, including concept creation, feasibility analysis, and hands-on testing.
• Design and develop new equipment and functionalities and enhance existing systems from specification review through implementation. Perform engineering calculations including structural, thermal and fluid dynamics problems.
• Create and revise Creo Parametric CAD models and detail drawings, ranging in complexity from simple piece parts to large assemblies
• Select parts and control devices, performing technical evaluations to ensure compliance with design and performance standards.
• Prepare detailed documentation including instruction manuals, technical specifications, and design reports.
• Project management duties include report generation, schedule creation and maintenance, design reviews and interdepartmental coordination.

What we are looking for

• Master’s degree or above in Mechanical engineering or related degree.
• 3+ years of experience with 3D CAD software / 5+ years of hands-on experience in mechanical engineering.
• Experience in engineering, design, and development of complex mechanical systems including reactors, vacuum chambers, gas delivery systems, pneumatics, water cooling circuits, and vacuum systems required.
• Prior experience in the semiconductor manufacturing equipment industry. Deposition product knowledge a plus (CVD, ALD, EPI, PVD).
• Excellent verbal and written communication; ability to present design concepts to peers and management in a professional and effective manner.
• Strong cross-functional communication and project execution skills.
• Good command of written and spoken English (Korea is a plus), able to read technical documents.
• Experience in customer technical support or project management is a plus.
• Willingness to travel frequently, both domestically and internationally.

Job's mission

You will play a key role in ensuring the performance, reliability, and success of our advanced plasma-based semiconductor equipment.
This role places you at the center of customer-facing technical support, working closely with key global customers, while partnering with engineering teams in Tama and collaborating with global colleagues across Japan, Korea, and the United States. Through deep technical expertise, strong ownership, and clear communication, you will directly contribute to ASM’s ability to deliver world-class support in a fast-moving, innovative environment.

What you will be working on

• Provide expert-level technical support for advanced PECVD and plasma-based equipment
• Diagnose, troubleshoot, and resolve complex electro-mechanical, plasma, and software-related issues escalated beyond first-line support
• Lead root cause analysis and clearly communicate issues, countermeasures, and expectations to customers and internal teams
• Work closely with engineering teams in Tama on design feedback, reliability improvements, and maintenance enhancements
• Support system installations, upgrades, engineering change implementations, and customer technical training
• Coordinate technical and administrative support activities including installation, repair, preventive maintenance, and upgrades at customer sites
• Report design, reliability, and maintenance issues to design and software engineering teams
• Communicate directly with customers (engineers through management-level stakeholders such as Directors and VPs)
• Collaborate with a global support team across Japan, Korea, and Arizona
• Travel globally up to 50% of the time (up to approximately six months per year)

What we are looking for

• Bachelor’s degree in Mechanical, Electrical, Aeronautical Engineering, or related science (practical experience is considered more important than formal education)
• At least 5 years of hands-on experience with PECVD / plasma technologies preferred
• Strong background in troubleshooting semiconductor manufacturing equipment
• Experience with plasma-related processes (e.g., PECVD, etching); experience at semiconductor companies preferred
• Ability to communicate effectively in English and Japanese for internal and external discussions, including U.S.-based customers
• Proven customer-facing experience with the ability to explain issues, root causes, and manage expectations
• Strong sense of ownership with the ability to drive issues end to end and follow through to resolution
• Willingness and ability to travel globally (up to 50%)
• Eligible to work in Japan (working visa acceptable)

What sets you apart

• Mandarin proficiency, beneficial for supporting our largest customer
• Experience working with senior stakeholders 
• Strong presentation and expectation-management skills
• Experience collaborating in cross-functional, global teams
• A mindset driven by teamwork, clear communication, accountability, perseverance, and problem-solving ownership

ASM is recruiting a Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PECVD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education: PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics.

• At least 2 years of experience as a Process Engineer in the Semiconductor Equipment Industry, preferably in ALD, PEALD, PECVD, or Etch.
• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.

Work Location : Tama, Tokyo Japan