[Responsibilities]

• Customer Support & Escalation Management
  • Act as the single point of contact (POC) for customer technical issues and requests
  • Own customer escalations from problem identification through root cause analysis and final closure
  • Lead cross‑functional task forces and interface with BU Engineering and global support teams to resolve critical issues
• Tool Performance & Availability Improvement
  • Drive continuous improvement of system uptime, availability, and performance at customer sites
  • Analyze top issues using Pareto and data‑driven methodologies and prioritize corrective actions
  • Ensure implementation of corrective and preventive actions to avoid repeat issues
• Quality, NC, and Retrofit Management
  • Manage Non‑Conformances (NCs) and lead completion of 8D reports for critical issues
  • Support FCO, retrofit, and TSB activities for released products
  • Oversee IQ and warranty management to meet cycle time, cost, and quality targets
• NPI / CIP Support
  • Support NPI and CIP activities from a customer and field implementation perspective
  • Act as the product expert for assigned tools, ensuring knowledge transfer and best practice deployment
  • Collaborate with internal teams to feedback customer issues and drive design and process improvements
• Communication & Stakeholder Management
  • Provide clear and timely communication of issue status, risks, and action plans
  • Align internally with management and engineering on priorities and customer commitments
  • Maintain strong, trust‑based relationships with customers through professional and effective communication

[Requirements]

• Bachelor’s degree or higher in Engineering or a related technical field
• Strong system‑level understanding of hardware, software, and process integration
• Experience in semiconductor equipment support, product support, or field engineering roles
• Proven ability to manage customer escalations and work in high‑pressure environments
• Willingness to travel frequently to customer sites (travel percentage varies by assignment)

[Competencies]

• Strong customer focus and ownership mindset
• Structured problem‑solving and root cause analysis skills
• Excellent communication and stakeholder management skills
• Ability to lead cross‑functional teams and drive issues to closure

The Role:

Radio Frequency (RF) Engineer at ASM will provide solutions for difficult RF technical issues associated with specific projects, contribute to the timely completion of specific programs and projects, possess the ability to work on complex assignments with some guidance and direction from the Engineering Manager.

Responsibilities:

• Develop RF module and reactor of ASM products.
• Using conventional RF source and antennas provide reliable structure to provide stable performance in extreme and harsh conditions.

• Troubleshooting and modification of RF generator and matching network
• Understanding plasma characterization and troubleshooting the Plasma/RF related issues

• Coding FPGA chips to control modules and parts to maximize plasma performance of ASM Products

Education & Experience:

• Master's or Ph. D Degree in Electronics, Physics, or relevant disciplines.
• 3+ year experience in RF plasma field which including modules and parts is preferred.
• Have a broad-based background in analysis, design and debug of complex RF systems.
• Design, implement, maintain, and improve electrical instruments, equipment, facilities, components, products, and systems for the semiconductor equipment industry.
• Well versed with the requirements of CE, NEC, IEC, NFPA, VDE, SEMI S2-95 and other relevant standards as applicable to semiconductor manufacturing equipment.
• Experience with modularizing semiconductor equipment designs for offline assembly.
• Experienced using Microsoft applications such as Excel, Word, PowerPoint, and Project; Manufacturing Requirements Planning (MRP); AutoCAD; OrCAD or Altium schematic capture.
• Business level English

Functional Knowledge

• Plasma Deposition product knowledge a plus (CVD, ALD, EPI, PECVD, PEALD)

We are seeking a motivated intern to support advanced metrology development activities focused on improving measurement accuracy and modeling robustness across key characterization techniques. This role is ideal for candidates interested in semiconductor process characterization, data analysis, and design of experiments (DOE) methodology.

What you will be working on

The intern will work with the Process Engineering and Metrology teams to:

1. Transmission Electron Microscopy (TEM) Variability & Error Modeling
•    Characterize sample to sample and region to region variability in TEM measurements.
•    Quantify measurement uncertainty and establish statistically meaningful error bars.
•    Translate TEM measurement error into corresponding DOE model error.
•    Assess how measurement uncertainty impacts p values, model significance, and predictive validity.
•    Propose methods to reduce overall model noise—either through measurement improvements or smarter experimental design.

2. Ellipsometry Modeling and Material Optical Properties (n, k)
•    Support extraction and optimization of refractive index (n) and extinction coefficient (k) for new films.
•    Analyze how ellipsometry model assumptions impact derived film thickness and composition.
•    Investigate thickness dependent behavior: identify thresholds where goodness of fit (GoF) degrades as thickness increases.
•    Evaluate breakdown mechanisms (e.g., over simplified dispersion models, depolarization effects, parameter cross correlation).

3. DOE Data Integration & Improvement
•    Combine metrology data streams (TEM, ellipsometry) to build more realistic input distributions for DOE.
•    Quantify how measurement error propagates into model confidence levels and sensitivity indices.
•    Recommend approaches to improve DOE outcomes (e.g., reduced uncertainty, alternative sampling plans, model weighting).

4. Deliverables
By the end of the internship, the student is expected to deliver:
•    A quantified error propagation framework linking key metrology tools to DOE output quality.
•    A statistical report detailing major sources of measurement uncertainty and recommended mitigation paths.
•    Updated ellipsometry models (n, k, dispersion) or parameter sets that improve GoF for thick films.
•    A final technical presentation summarizing findings, insights, and process improvement opportunities.

What we are looking for

•   Working towards his doctoral degree with focus on Physics, chemistry or material science. Other engineering disciplines might be considered.

The primary responsibility of this role is to manage and drive the process engineering function for a key product group in the ASM’s Atomic Layer Deposition (ALD) technology with a focus on results. This will require a strong leader that is highly skilled in people, process and technology across ASM’s ALD operations. Further, the role requires someone who is not only skilled in R&D/Innovation, development, engineering and design for manufacturability, but also someone who is adept at process and organization, continuous improvement and working with and managing people across cultural dimensions in developing and delivering the ALD technology roadmap. A persistent approach to Product Life Cycle (PLC) will be required to achieve strong engagement with the team, develop and implement new processes and organization, and manage the team to achieve PLC deliverables and drive projects to completion, exceeding timelines and budgetary objectives. This position facilitates getting ASM products to market as quickly as possible by directly influencing and communicating with key customers to solve their high value problems. The successful candidate will have a track record of recruiting and developing industry leading process engineering teams. 

Specific Responsibilities:  

• Run the day-to-day management of the key product process engineering teams with an emphasis on results. 

• Set, evangelize, and implement ASM processes. 

• Collaborate with the KPU head to set the vision for the technology and roadmap. 

• Embody ASM’s mission and values, and consistently reinforce them with the team through everyday actions. 

• Develop and deliver the technology roadmap and execute on the product roadmap in collaboration with GPM and KPU Head. 

• Lead Product Lifecycle Cycle (PLC) team in developing and delivering next generation systems to the market. 

• Responsible for managing development execution (performance, cost, schedule, etc.). 

• Provide support for existing products and drive continuous improvement efforts. 

• Must be able to work across organizations, particularly hardware and software engineering, to define success criteria of products and drive new product development 

• Develop and maintain relationships with key customers. Work closely with the key account technology (KAT) organization to ensure that customer needs are met and qualification of new products and processes is done on time and to specifications 

• Contribute to product roadmap by working with Product Marketing and key customers. 

• Support annual strategic planning process to drive future business direction. 

• Successfully drive projects and recruit premier engineering talent. 

Qualifications:  

• Bachelor’s degree in Chemical Engineering, Material Science, Physics or Mechanical Engineering or related field, required. Master or PhD preferred. 

• At least 10 years of experience in semiconductor equipment development. 

• A track record of successfully building semiconductor equipment products under cost and ahead of schedule. 

• Proven ability to lead and drive process engineering teams  through product development and market introduction with an ability to develop process engineering managers 

• A track record of successfully managing, recruiting, developing, and scaling extraordinary teams. 

• Proven ability to drive continuous improvement across operations. 
• Business level English and Japanese

Job Summary:​

We are looking for a Technical Program Manager (TPM) to lead and drive complex hardware-focusedproduct programs through the full product lifecycle from concept and feasibility to high-volumemanufacturing (HVM).​

The TPM will work cross-functionally with product management, process development, engineering,manufacturing, supply chain, and global product support teams to ensure programs are delivered ontime, within cost targets, and in alignment with customer and business requirements.​

This role requires strong program execution skills, technical understanding of hardware development,and the ability to manage multiple stakeholders across global teams.​

Responsibilities:​

Own and manage the NPI (new product introduction) program through the PLM development process from concept and feasibility to release.​

1. Drive tollgate-based product life cycle (PLC) management by reviewing stage-specific development tasks with functional owners, tracking milestones, managing risks, and ensuring schedule adherence.​
2. Coordinate with stakeholders on NPI products to meet required specifications, including SEMI standards and hardware requirements.​
3. Track NPI builds and assist with demo lab procurement of new chambers or major retrofits.​
4. Analyze and manage new product costs against ROI targets.​
5. Lead cross-functional teams and act as a communication bridge among R&D, manufacturing, quality, Marketing and sales.​
6. Ensure resource allocation aligns with divisional priorities to meet project timelines for assigned programs.​
7. Define product specifications and identify key hardware changes with stakeholders during the C&F stage.

   Experience & education:​

   1. BS degree in material science, electrical, mechanical, chemical, or industrial engineering, orequivalent technical education.​
   2. More than 3 years of experience in semiconductor marketing, supply chain management, or sales;experience in project management is a strong plus.​
   3. Working knowledge of project management and semiconductor equipment commercialization, withexperience supporting MRS, ROI analysis, cost tracking, and milestone management activities.​
   4. Proficient in learning complex technical subjects.​
   5. Effective communication, negotiation, and written skills; English and Japanese required.​
   6. Demonstrated ability to support effective internal and external collaboration and contribute toresource planning and execution.​
   7. Positive, energetic attitude with a strong work ethic.
   ​

The intern will review PEALD SiN gap-fill process and figure out the mechanism of specific recipe. In parallel, they will review process results and analyze effective deposition parameters for performance improvement. Finally, they will summarize their findings to build the mechanism with physical/chemical model and experimental data.

What you will be working on

The intern will go through process responses by the single parameter skew. Deposition recipe consists of a lot of parameters. Referring to the typical recipe, it will be to start with suspected effective parameters. Then, they will analyze the process sensitivity in each parameter to figure out what parameter is effective and how effective process improvement is, especially on gap-fill capability (GPC profile) and throughput. There should be some trade-off relationships. The analysis can clarify the effective parameter(s) to have good gap-fill capability and throughput. They will propose what recipe should be good to achieve the target or to maximize throughput, if they have simulation capability, they can collaborate with the team and validate the model of the mechanism by the simulation. The final goal is to show the direction of gapfill performance improvement based on experimental data and theoretical models.

What we are looking for

For this project, an intern with Materials Engineering, Applied Chemistry, Chemical Engineering and Electronic Engineering or other types of Engineering (Plasma related is preferred) would be ideal. Considering the scope of this project, doctoral degree level is preferred, although a master’s degree level with specific experience would also be acceptable.

Job's mission

As Director, Process Engineering – PEALD, you will lead advanced process development activities for ASM’s PEALD technologies, enabling next-generation semiconductor devices for logic, foundry, and memory applications.

This role is a senior technical leadership position responsible for guiding a highly skilled team of process engineers, driving innovation in PEALD processes, materials, and applications, and delivering differentiated solutions aligned with customer technology roadmaps. You will work closely with customers, account technology leaders, product management, and global R&D teams to translate advanced device requirements into world-class process technologies.

What you will be working on

• Lead and develop a team of process development engineers focused on PEALD technologies, fostering innovation and technical excellence
• Drive development of next-generation PEALD processes, materials, and applications aligned with customer requirements and market needs
• Define and influence new hardware requirements to support advanced PEALD process specifications
• Identify, develop, and qualify new chemistries and materials for future device architectures
• Collaborate closely with customers, Account Technology Directors, Global Product Management, and Business Development teams to align on technical roadmaps
• Partner with corporate R&D organizations to deliver new applications and materials supporting customer technology inflections
• Ensure generation of intellectual property and technical publications as outcomes of advanced process development work
• Contribute creative and innovative ideas to process development, equipment design, and continuous improvement initiatives
• Stay at the forefront of state-of-the-art semiconductor processing technologies and maintain strong technical communication with industry peers
• Define critical skill requirements and staffing needs to support business objectives and long-term growth
• Build, motivate, and retain a high-performing team capable of driving sustained and profitable growth for ASM’s PEALD business
• Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve their most advanced device challenges

What we are looking for

• Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field
• 10–15+ years of experience in the semiconductor or semiconductor capital equipment industry, including senior-level technical leadership roles
• Proven track record of developing and delivering new semiconductor process technologies to customers
• Strong working knowledge of semiconductor device physics and manufacturing processes
• Experience leading and motivating teams of 10+ highly skilled engineers
• Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders
• Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment
• Excellent communication skills in English; ability to collaborate in a global R&D environment
• Willingness to travel approximately 10–20%

What sets you apart

• Deep expertise in PEALD or related thin-film deposition technologies
• Strong reputation for building high-performance, collaborative engineering cultures
• Experience influencing product direction through process innovation, materials engineering, and hardware collaboration
• Recognized thought leadership through patents, publications, or industry contributions
• Ability to balance technical innovation, customer satisfaction, and business priorities
• Strong executive presence with the ability to influence and inspire across organizational and cultural boundaries

Job's mission

What you will be working on

• Researching, developing, and optimizing thin film deposition processes, with a focus on metal and dielectric films using PEALD and related technologies.
• Designing and executing complex experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM), and interpreting experimental results.
• Developing new film materials and processes for emerging semiconductor applications based on strong chemistry and materials science fundamentals.
• Actively troubleshooting process and equipment issues through hands-on engagement.
• Participating in and driving structured technical problem-solving using scientific methodologies and industry tools.
• Collaborating with customers and central marketing to define requirements and execute customer demonstrations.
• Supporting product transfer to customers by delivering demonstrations, training field service teams, creating technical documentation, and traveling to customer sites (up to 10%).
• Authoring technical papers and contributing to intellectual property (IP) generation related to process and technology development.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field or MS degree with 2+ years of relevant industry experience.
• Hands-on experience with PEALD, ALD, PECVD, CVD, Epitaxy, or other thin film deposition technologies.
• Strong understanding of thin film deposition principles and semiconductor process development.
• Experience designing and characterizing deposition processes using first principles and experimental design techniques.
• Ability to independently manage complex process development activities.
• Excellent communication skills in English and Korean, with the ability to clearly explain complex technical concepts.

What sets you apart

• Knowledge of electrical characterization techniques for CMOS devices.
• Experience integrating metal and/or dielectric films into FEOL and BEOL process flows.
• Hands-on experience with materials characterization techniques such as XPS, SIMS, AFM, XRD, TEM, SEM, Raman, or ellipsometry.
• Experience authoring technical publications and/or patents in the semiconductor industry.
• Strong collaboration skills with customers, field teams, and cross-functional stakeholders.

About the internship

ASM’s internship program offers a hands-on opportunity to experience the fast-paced and innovative semiconductor industry. As an R&D Process Engineering Intern, you will work alongside experienced engineers on real-world development projects and gain exposure to ASM’s core technologies.

This program is designed to help develop the next generation of engineering talent by providing practical learning, technical mentorship, and insight into professional engineering roles within a global semiconductor equipment company.

What to expect

This is a paid, full-time, on-site internship based in Dongtan, Korea.
The internship is expected to start in September 2026 and run through December 2026 (approximately 16 weeks).

This program is intended for students who are currently enrolled in a full-time academic program. Candidates who have already graduated and are not returning to school should apply for ASM’s Early Career opportunities instead.

What you will be working on

As part of ASM’s R&D Process Engineering team, you will support the research, development, and optimization of advanced semiconductor processes and equipment, including:

• Semiconductor process development for oxidation, annealing, curing, ALD, PEALD, Epitaxy, and PECVD technologies
• Process development activities supporting logic, memory, analog, power, and MEMS applications
• Hands-on learning with advanced process tools, analytical equipment, and characterization techniques used in R&D environments

About your role

• Learn the fundamentals of ALD and PEALD technologies, contributing to thin film optimization aligned with customer requirements
• Support improvement of PEALD metal oxide and nitride film properties, gaining exposure to reactor design, process concepts, and characterization methods
• Assist in optimizing PEALD process parameters and correlating electrical characterization results with physical film properties
• Understand and help develop wafer uniformity control parameters for film thickness and composition
• Analyze experimental data and document correlations between on-wafer results and equipment or hardware parameters

What you will bring

• Strong self-motivation and a structured, problem-solving mindset
• Currently pursuing a Master’s or PhD degree in Chemistry, Chemical Engineering, Physics, Materials Science, or Electrical Engineering
• Basic knowledge of materials characterization techniques
• Interest in semiconductor device fabrication and process development
• Ability to work effectively in a team-oriented, R&D-focused environment

What sets you apart

• Prior exposure to semiconductor device fabrication
• Experience or coursework related to plasma reactors or plasma-based processes
• Curiosity and enthusiasm for hands-on experimentation and data-driven analysis

Why join ASM as an intern

• Hands-on industry experience through meaningful R&D projects
• Opportunity to learn directly from world-class engineers and technologists
• Exposure to cutting-edge semiconductor technologies shaping industries such as AI, 5G, automotive, and advanced computing
• Collaboration with a global, diverse engineering community
• A chance to build technical skills, professional networks, and a strong foundation for a future career in semiconductors

Project:

• LEAS, TiN THK NU/Conformality improvement

What you will be working on

• Based on blanket study, process characterization and relationship to deposition conditions
• Understand the fundamentals of Plasma-based deposition and the interaction between HW and process (plasma power, pressure, etc.) through DOE evaluation
• Training in XPS, AFM, XRR, Ellipsometry, Nanoindentation fundamentals and characterization analysis
• Conduct regular SPC monitoring & improve process stability
• Understand sensitive/key parameters and reflect to HW start up procedure
• Present the key achievement in a large audience forum

What we are looking for

• Ph.D. student in Materials Science and Engineering, Chemical Engineering, Physics, Plasma Engineering, or a related field with hands-on experience with plasma reactors
• Knowledge of fundamental principles of deposition and fundamental limits of thin film characterization
• Strong interest toward operating ASM chambers and developing process conditions based on mechanistic understanding
• Understands the importance of safety and working culture in Lab
• Comfortable in presenting and sharing results in a scientific and collaborative way

(12116)

Job's mission

Development of gapfill process on our D-lab tool. Conducting DOE experiments and collect data (dep rate, WiW uniformity, Stress, WER, conformality) to optimize our process and accumulate process knowhow.

What you will be working on

1. Tool Operation and Wafer Preparation:
lOperate specialized equipment to prepare wafers and Front-Opening Unified Pods (FOUPs).
lEnsure precise handling and processing of materials to maintain high-quality standards.

2. Measurement and Data Analysis:
lUtilize advanced measurement tools to gather data on wafer conformality.
lAnalyze Transmission Electron Microscopy (TEM) images to assess conformality and other critical parameters.
lInterpret data to identify trends and anomalies, providing insights for process optimization.

3. Hardware Involvement:
lParticipate in hardware-related tasks aimed at expanding our process window.

What we are looking for

• Master’s or PhD student majoring in Materials Science, Chemical Engineering, Applied Physics, or a related field.
• Strong academic background and hands-on lab or research experience preferred.
• If the candidate is successful and demonstrates both technical competence and cultural fit, a conversion offer may be considered.

Job's mission

Each product line of XP8 DCM and JQCM has a complex building‑block structure that supports advanced process technologies. The intern will involve a cross‑functional review of the electrical wiring diagrams and building‑block structures for both product lines, analyzing and identifying design redundancies and common elements. Through this activity, the intern will aim to gain a deep understanding of the process module configuration of DCM and JQCM. Finally, based on the elements identified as candidates for commonality, the intern will propose standardization ideas that can contribute to improved design efficiency, cost reduction, and shorter development lead time.

What you will be working on

XP8 DCM and JQCM are composed of complex building‑block structures (BOMs). In this internship, the intern will systematically break down these complex BOMs and electrical wiring diagrams, reviewing and learning the commonalities and differences across product lines. The analysis approach begins with the high‑cost layers that are widely used across the XP8 DCM and JQCM product portfolios. Next, as part of the compatibility assessment, the intern will examine component‑level differences and determine whether functionally compatible alternatives exist. All components will be categorized into “Common” and “Functional Equivalent” groups, and the intern will redefine the component structure from this perspective. As part of design and development validation, the intern will work with related departments to reassess the technical rationale for the current differences. For manufacturing and procurement optimization, the intern will collaborate with FEMS ME to explore improvements to kit structures. The ultimate objective is to identify concrete and actionable cost‑reduction measures through standardization that can be applied across the entire XP8 DCM and JQCM product lines.

What we are looking fo

The ideal candidates for this internship are students in electrical engineering, manufacturing engineering, or other related engineering fields. A bachelor’s‑level academic background provides sufficient technical preparation to carry out the responsibilities associated with this project.

The intern will undertake a comprehensive evaluation of the Building Block Structure associated with the XP8 DCM product line, with the objective of attaining an in‑depth understanding of the configuration framework governing DCM process modules. Following this evaluation, the intern will delineate the common components and the specification variances across the various applications. Ultimately, the intern will conduct a structural analysis of each application and develop a detailed report outlining the principal design considerations.

What you will be working on

The intern will perform a structured review of the multi‑tiered Bill of Materials (BOM) for the DCM tool. The analysis will commence with the identification of components that are universally employed across the DCM product portfolio. Subsequently, the intern will assess component‑level differences to determine whether functionally interchangeable alternatives exist.
Upon completion of the classification of components into common, functionally equivalent, and application‑specific categories, the intern will collaborate with relevant stakeholder groups (including, but not limited to, the Process Development Team) to evaluate the rationale for such variations and to consider the implications of applying these variations uniformly across all applications.
The overarching objective of this project is to formulate viable recommendations for standardization.

What we are looking for

This project is ideally suited for interns majoring in Mechanical Engineering, Manufacturing Engineering, or other engineering disciplines.  A bachelor’s‑level academic background provides adequate technical preparation to execute the responsibilities associated with this project.

This intern will work on new metal films development for advanced nodes.

What you will be working on

• Based on blanket study, process characterization and relatioship to deposition conditions
• Training on different deposition methods (PEALD, PECVD, ALD) to understand the fundamentals of Plasma-based deposition and the interaction between HW and process (plasma power, pressure, etc.)
• Training on XPS, AFM, XRR, Ellipsometry, Nanoindentation fundamentals and characterization analysis
• Develop HW health check methodology and improve any current HW start up procedure
• Document the learning and apply it to process start up procedures to enhance our tool productivity & stability
• Present the key achievement in a large audience forum

What we are looking for

• Ph.D degree for Material Science Engineering, Chemical Engineering, Physics, Plasma Engineering or similar majors with hands-on experience with plasma reactors

ASM is recruiting a Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PEALD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education: PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics. 

• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.
• English business level

Work Location : Tama, Tokyo Japan

Job's mission

As a Senior Engineer I, Global Product Support at ASM, you will serve as a senior, system‑level technical expert responsible for owning assigned products end‑to‑end, from early concept through alpha, beta, and release.

This role is critical to ensuring technical readiness, execution excellence, and smooth transition of new products into the field. You will work cross‑functionally with engineering, factory, FEMS, and field teams to resolve complex system‑level issues and enable scalable, customer‑ready solutions.

What you will be working on

• Own assigned products end‑to‑end, from concept through alpha, beta, and release, ensuring technical readiness and execution excellence
• Act as the system‑level product expert across hardware, software, electrical, and process domains
• Lead New Product Introduction (NPI) and Continuous Improvement Programs (CIPs), including test planning, demo‑lab execution, and field implementation readiness
• Drive Design for Service (DFS) and Design for Install (DFI) through design reviews to ensure serviceability and manufacturability
• Define, document, and deploy Best Known Methods (BKMs), NPI procedures, and installation guidelines to enable scalable global execution
• Interface with engineering, factory, FEMS, and field teams to resolve top product issues and ensure smooth alpha‑to‑beta transitions
• Lead cross‑functional taskforces for critical product issues, providing clear technical guidance, escalation support, and structured status communication

What we are looking for

• Bachelor’s degree or higher in Engineering or a related technical discipline
  (Master’s degree preferred)
• 8+ years of experience in semiconductor equipment engineering or product support
• Hands‑on experience with ALD equipment or related deposition technologies
• Proven track record of leading NPIs and driving complex, system‑level technical issues to closure
• Strong understanding of system integration across hardware, software, and process domains
• Demonstrated ability to lead cross‑functional teams, communicate clearly, and balance development priorities with field readiness

What sets you apart

• Strong product ownership mindset with disciplined execution
• Advanced problem‑solving and root cause analysis capability
• Ability to influence and lead without direct authority
• Clear, structured technical communication across global stakeholders
• Experience balancing development speed with field scalability and robustness

[Responsibilities]

• Customer Support & Escalation Management
  • Act as the single point of contact (POC) for customer technical issues and requests
  • Own customer escalations from problem identification through root cause analysis and final closure
  • Lead cross‑functional task forces and interface with BU Engineering and global support teams to resolve critical issues
• Tool Performance & Availability Improvement
  • Drive continuous improvement of system uptime, availability, and performance at customer sites
  • Analyze top issues using Pareto and data‑driven methodologies and prioritize corrective actions
  • Ensure implementation of corrective and preventive actions to avoid repeat issues
• Quality, NC, and Retrofit Management
  • Manage Non‑Conformances (NCs) and lead completion of 8D reports for critical issues
  • Support FCO, retrofit, and TSB activities for released products
  • Oversee IQ and warranty management to meet cycle time, cost, and quality targets
• NPI / CIP Support
  • Support NPI and CIP activities from a customer and field implementation perspective
  • Act as the product expert for assigned tools, ensuring knowledge transfer and best practice deployment
  • Collaborate with internal teams to feedback customer issues and drive design and process improvements
• Communication & Stakeholder Management
  • Provide clear and timely communication of issue status, risks, and action plans
  • Align internally with management and engineering on priorities and customer commitments
  • Maintain strong, trust‑based relationships with customers through professional and effective communication

[Requirements]

• Bachelor’s degree or higher in Engineering or a related technical field
• Business level of Japanese and English ability
• Strong system‑level understanding of hardware, software, and process integration
• Experience in semiconductor equipment support, product support, or field engineering roles
• Proven ability to manage customer escalations and work in high‑pressure environments
• Willingness to travel frequently to customer sites (travel percentage varies by assignment)

[Competencies]

• Strong customer focus and ownership mindset
• Structured problem‑solving and root cause analysis skills
• Excellent communication and stakeholder management skills
• Ability to lead cross‑functional teams and drive issues to closure

Job's mission

As an Engineer II, Equipment Engineering at ASM, you will support the development, installation, and stable operation of advanced R&D equipment in new product development.
This role is ideal for engineers who have a strong understanding of semiconductors equipment support and are ready to deepen their hands-on technical expertise within a collaborative R&D environment.

You will work closely with cross-functional engineering teams to ensure equipment reliability, safety, and performance, contributing directly to the successful execution of new product design and development activities

What you will be working on

• Support installation, upgrade, troubleshooting, and preventive maintenance of R&D equipment during new product development
• Assist with first builds, bring-up, and testing of new products in collaboration with R&D and facilities teams
• Perform hands-on troubleshooting and root cause analysis to restore and maintain equipment performance and uptime
• Support daily operation and monitoring of R&D lab equipment to ensure stable and reliable tool performance
• Collaborate with Hardware, Electrical, Process, and Software engineers during equipment development and integration phases
• Follow established best-known methods (BKM) and support documentation of service, preventive, and corrective maintenance procedures
• Adhere to safety standards and standard operating procedures in all equipment-related activities
• Escalate complex or recurring equipment issues to senior engineers as appropriate and support resolution efforts
• Participate in continuous improvement initiatives to enhance equipment reliability, efficiency, and usability

What we are looking for

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related engineering discipline
• 5-6+ years of relevant experience in the semiconductor industry supporting equipment in R&D, lab, or manufacturing environments
• Hands-on experience with semiconductor equipment installation, maintenance, or troubleshooting
• Basic understanding of wafer fab operations, gas and vacuum systems, and equipment control concepts
• Familiarity with cleanroom or laboratory environments and safe handling of chemicals, gases, or related systems
• Ability to communicate effectively in English and Korean and work collaboratively across engineering teams

What sets you apart

• Experience with deposition equipment such as PEALD, PECVD, or similar thin-film tools
• Expertise to RF-induced plasma systems, electro-pneumatic controls, robotics, or microprocessor-based controllers
• Experience supporting early-stage or first-of-kind equipment in an R&D environment
• Strong troubleshooting mindset with a proactive, hands-on approach to problem solving