Job's Mission 

As a R&D Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position.

What you will be working on 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via PEALD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.

What we are looking for

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Fresh PhD graduates OR MS degree holder with 2+ years of work experience with: PEALD, ALD, PECVD, CVD, Epitaxy, and/or other thin film deposition.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.
• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills in both English and Japanese, with ability to clearly communicate advanced technical constructs in direct and concise manner.

Job's mission

Development of gapfill process on our D-lab tool. Conducting DOE experiments and collect data (dep rate, WiW uniformity, Stress, WER, conformality) to optimize our process and accumulate process knowhow.

Project Details

1. New inhibitor development like CH4 type gas and liquid chemical
Tool Operation and Wafer Preparation:
Operate specialized equipment to prepare wafers and Front-Opening Unified Pods (FOUPs).
Ensure precise handling and processing of materials to maintain high-quality standards.

2. Measurement and Data Analysis:Utilize advanced measurement tools to gather data on wafer conformality.
Analyze Transmission Electron Microscopy (TEM) images to assess conformality and other critical parameters.
Interpret data to identify trends and anomalies, providing insights for process optimization.

3. Hardware Involvement:
Participate in hardware-related tasks aimed at expanding our process window.

What we are looking for

• PhD student majoring in Materials Science, Chemical Engineering, Applied Physics, or a related field.
• Strong academic background and hands-on lab or research experience preferred.
• If the candidate is successful and demonstrates both technical competence and cultural fit, a conversion offer may be considered.

Top 3 Skillsets

1. Electrical measurement (I–V testing)
2. Materials analysis (FTIR, XPS)
3. Data analysis and problem-solving

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Job's mission

The intern will analyze leakage mechanisms in flowable low-k SiOCH films using I–V measurements and structural analysis (FTIR/XPS). The project focuses on correlating material structure with leakage behavior, using only generalized or literature-based conditions to ensure compliance with ASM’s IP protection policy.

The intern will work with dummy samples simulating typical low-k films (SiOCH-based). They will perform I–V/C-V testing to identify leakage models (e.g., Poole-Frenkel, tunneling) and use FTIR/XPS to evaluate bonding states and composition. The experimental design would use a two-factor DOE (e.g., temperature × cure time). Data analysis will focus on model fitting and correlation between structural and electrical properties. All deliverables will be reviewed and masked to avoid IP-sensitive content.

What we are looking for

• A student with a background in Materials Science, Chemical Engineering, Applied Physics, or a related field. Experience with electrical measurements or materials characterization is preferred. Master’s or PhD’s level students are eligible.

Top 3 Skillsets:

1. Electrical measurement (I–V testing)
2. Materials analysis (FTIR, XPS)
3. Data analysis and problem-solving