Job Summary:​

We are looking for a Technical Program Manager (TPM) to lead and drive complex hardware-focusedproduct programs through the full product lifecycle from concept and feasibility to high-volumemanufacturing (HVM).​

The TPM will work cross-functionally with product management, process development, engineering,manufacturing, supply chain, and global product support teams to ensure programs are delivered ontime, within cost targets, and in alignment with customer and business requirements.​

This role requires strong program execution skills, technical understanding of hardware development,and the ability to manage multiple stakeholders across global teams.​

Responsibilities:​

Own and manage the NPI (new product introduction) program through the PLM development process from concept and feasibility to release.​

1. Drive tollgate-based product life cycle (PLC) management by reviewing stage-specific development tasks with functional owners, tracking milestones, managing risks, and ensuring schedule adherence.​
2. Coordinate with stakeholders on NPI products to meet required specifications, including SEMI standards and hardware requirements.​
3. Track NPI builds and assist with demo lab procurement of new chambers or major retrofits.​
4. Analyze and manage new product costs against ROI targets.​
5. Lead cross-functional teams and act as a communication bridge among R&D, manufacturing, quality, Marketing and sales.​
6. Ensure resource allocation aligns with divisional priorities to meet project timelines for assigned programs.​
7. Define product specifications and identify key hardware changes with stakeholders during the C&F stage.

   Experience & education:​

   1. BS degree in material science, electrical, mechanical, chemical, or industrial engineering, orequivalent technical education.​
   2. More than 3 years of experience in semiconductor marketing, supply chain management, or sales;experience in project management is a strong plus.​
   3. Working knowledge of project management and semiconductor equipment commercialization, withexperience supporting MRS, ROI analysis, cost tracking, and milestone management activities.​
   4. Proficient in learning complex technical subjects.​
   5. Effective communication, negotiation, and written skills; English and Japanese required.​
   6. Demonstrated ability to support effective internal and external collaboration and contribute toresource planning and execution.​
   7. Positive, energetic attitude with a strong work ethic.
   ​

Job's Mission 

As a R&D Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position.

What you will be working on 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via PEALD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.

What we are looking for

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Fresh PhD graduates OR MS degree holder with 2+ years of work experience with: PEALD, ALD, PECVD, CVD, Epitaxy, and/or other thin film deposition.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.
• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills in both English and Japanese, with ability to clearly communicate advanced technical constructs in direct and concise manner.

ASM is recruiting a Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PEALD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education: PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics. 

• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.
• English business level

Work Location : Tama, Tokyo Japan

ASM is recruiting a Senior Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PEALD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education:

PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics.

Or

Masters with at least 10 years of relevant industry experience and some leadership experience (ex. Team leader)

• At least 3 years of experience as a Process Engineer in the Semiconductor Equipment Industry, preferably in ALD, PEALD, PECVD, Etch, and/or Process Integration.
• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.

Highly Desirable Skills:

• Experience in troubleshooting and/or good understanding Process Integration challenges.
• Experience in measuring and improving device fabrication yield in Pilot lines or High Volume Manufacturing.

Work Location : Tama, Tokyo Japan

The Key Account Technology Engineer is the ASM product expert who supports extensive customer and internal company contacts for coordinating the introduction of new products, product improvements, and non-conformances/escalations at the customer. This includes leading projects/programs supporting these activities. The focus of this job is on managing all the technical account aspects of the customers in the assigned region. Responsibilities

· Drive NPI & evaluations by leading the project including hands-on work at the customer location, implement BU developed BKMs or CIPs at customer and execute necessary actions and modifications.

· Provide answers to our customers by identifying problems, researching answers and guiding customer through corrective steps to resolve high value problems at customer sites.

· Understand customer timelines for film development / roadmaps for current and future technology nodes and transfers the information to product management, business development and R&D.

· Identify technical inflections points and work with R&D to ensure customer requirements and learnings are implemented into product development.

· Responsible for the performance of our equipment at the customer. Customer specifications which are non-ASM standard are signed by the KAT.

· Recognize early non-conformance of our product and takes the necessary steps for corrective actions, including analyzing data, involving hardware and process exports.

· Take responsibility to solve any escalation as efficient as possible problems, for NPI and installed base.

· Support process team in demo lab execution of customer specific DOEs and processes.

· Own execution of customer demos for new processes and NPIs.

Qualification

· Masters in chemical engineering, electrical engineering, physics, or material science.

· 5-10 years in the semiconductor wafer processing or capital equipment industry with experience in process engineering and/or technical marketing. Direct experience with silicon wafer processing preferred.

Skills

· Strong problem-solving skills

· Ability to collaborate and partner with key stakeholders and customers

· Demonstrated ability to communicate effectively in verbal and written form. Present advanced technical constructs in direct and concise manner.

· Travel up to 10% - 25%, domestically and internationally (Ability to travel internationally)

· Fluent in Chinese (as the role support the customer in Taiwan) and business level of English.

ASM is recruiting a Process Engineer for our Global Key Product Unit in Tama, Japan.

The successful candidate will be part of the PECVD Process Development team, responsible for technological innovations and the development of new processes for semiconductor fabrication.

Key Responsibilities:

• Design experiments, collect data, analyze results, and compile reports on various process development experiments.
• Perform hardware characterization, define process window, and analyze process-hardware interaction.
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve difficult process engineering issues.
• Generate internal and external documentation, including product documentation, presentations, and technical reports.
• Interact with customers to resolve challenging process engineering issues with limited supervision.
• Promote team building and provide technical and theoretical communication leadership.

Key Requirements:

Education: PhD preferred in the following disciplines: Materials Science and Engineering (MSE), Chemical Engineering (Ch.E), Chemistry, or Physics.

• At least 2 years of experience as a Process Engineer in the Semiconductor Equipment Industry, preferably in ALD, PEALD, PECVD, or Etch.
• Demonstrates expertise in their own discipline and has a basic understanding of related disciplines.
• Knowledgeable about best practices and understands how their area integrates with others, recommending product and process improvements.
• Willingness to tackle new problems and develop strategies for project execution.
• Strong problem-solving skills, able to approach existing solutions from a fresh perspective and think innovatively.
• Preferably, knowledge of plasma physics, material chemistry, and vacuum chamber handling.

Work Location : Tama, Tokyo Japan