We are seeking an R&D Metrology Engineer to join our dynamic materials development labs. The ideal candidate will be self-motivated, hands-on, and a resourceful problem solver with a strong understanding of materials characterization equipment and methods. In this role, you will work closely with ALD and Epi process engineers to develop and optimize next-generation materials for advanced node semiconductor processing.

This position requires working the early morning shift (1^st shift), including weekend coverage, to ensure optimal utilization and uptime of metrology equipment in a fast-paced R&D environment

Key Responsibilities

• Apply advanced metrology techniques to support the company’s materials and process development roadmap.
• Troubleshoot metrology equipment issues and collaborate with vendors to resolve hardware/software malfunctions.
• Partner with process engineers to select appropriate characterization methods and assist in data interpretation.
• Acquire and analyze metrology data; summarize findings for engineering and management review.
• Maintain tool uptime by partnering with vendors and supporting lab operations during off-hours.
• Train engineers on metrology tools, develop SOPs, and create recovery procedures for tool-down scenarios.
• Monitor uptime data; contribute to tool efficiency and continuous improvement initiatives.
• Develop metrology recipes and applications to streamline operations and solve technical challenges.
• Provide on-call support and ensure smooth lab operations during night and weekend shifts.
• Maintain LEAN 6S standards and contribute to a clean, organized lab environment.
• Stay current with industry trends by attending conferences, seminars, and workshops.

Required Qualifications

• Ph.D. in Materials Science and Engineering (preferred), or other engineering fields, Chemistry, Physics, Engineering, or related field.
• Hands-on experience with TEM, STEM, EDS, EELS, SEM, and FIB.
• Familiarity with techniques such as XRR, XRD, XRF, TXRF, FTIR, SPV, four-point probe, Hall effect, and defect inspection tools.
• Solid understanding of semiconductor processing and device fabrication.
• Proficiency in MS Office and JMP; strong data analysis and reporting skills.
• Excellent communication skills and ability to work independently and collaboratively.
• Availability for night and weekend support as needed.

Preferred Qualifications

• Experience developing metrology recipes and turnkey solutions.
• Background in lab operations and equipment maintenance.
• Programming experience, particularly in scripting or automation for data acquisition, data analysis, and tool control.

Role overview

As a Senior Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position. 

Note: This role is intended for candidates who are graduating in Spring 2026 or have graduated within the past two years and have 0–2 years of professional work experience.

Responsibilities 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.
• You may be assigned supervisory duties over supporting process engineering technicians and aides. These supervisory duties could include direct input into employees’ performance evaluations, discipline, and discharge.

Minimum Qualifications

• We are looking for candidates who have graduated within the last 0-2 years or will graduate in Spring or Fall 2025 and are eager to begin or advance their career.
• Master’s or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• 0-7+ years of combined education, research, and work experience with:
• Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
• Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.
• Graduating in Fall 2025 or graduated within the past two years.
• 0–2 years of professional work experience.

Preferred Qualifications

• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Ability to be a process consultant to internal and external customers.
• An authority on interplay between hardware design (e.g., chemical reactor design) and operation and process outputs
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs in direct and concise manner.

ABOUT THE JOB

The Digital Marketing Specialist is a key member of the Marketing + Communications team at The MJ Companies. This role is responsible for executing and optimizing our digital marketing efforts across all channels to drive awareness, engagement, and conversions. The digital marketing specialist will collaborate across teams to ensure our digital presence supports our brand strategy, engages our audiences, and drives measurable results.

ESSENTIAL FUNCTIONS

Digital Campaign Management:

+ Plan, execute, and optimize digital advertising campaigns across Google Ads, social media platforms, and other paid digital channels to drive lead generation and conversion.

+ Manage SEO and SEM strategies to improve visibility, drive qualified traffic, and increase conversions.

+ Execute and analyze email marketing campaigns, including audience segmentation, A/B testing, automation workflows, and performance tracking.

+ Develop, schedule, and publish engaging content for social media channels; monitor performance and engagement.

Website & Conversion Optimization:

+ Optimize website performance; conduct landing page testing and implement conversion rate optimization (CRO) best practices.

+ Manage, update, and optimize website content for performance and user experience.

Analytics & Reporting:

+ Track and analyze performance across all digital channels using Google Analytics, SEMrush, and other measurement tools.

+ Develop dashboards and regular reports highlighting KPIs, ROI, and campaign performance.

+ Leverage data to make recommendations that improve campaign performance and marketing effectiveness.

Content & Brand Alignment:

+ Ensure all digital touchpoints reflect consistent brand voice, messaging, and visual identity.

+ Contribute to broader marketing initiatives, including integrated campaign planning and execution.

EDUCATION

+ Bachelor’s degree in marketing, communications, business, or a related field.

KNOWLEDGE & EXPERIENCE

+ 3-5 years of relevant experience in digital marketing, preferably in a B2B or professional services environment.

+ Demonstrable ability to analyze performance data, derive insights, and optimize campaigns accordingly.

+ Exceptional written and verbal communication skills, with strong attention to detail.

+ Ability to effectively prioritize tasks and employ critical thinking in problem solving.

+ Ability to meet deadlines in a fast-paced, quickly changing environment.

TECHNICAL FUNCTIONS

+ Proficiency with digital tools and platforms including Google Ads, Google Analytics, SEO/SEM tools (e.g. SEMrush), and social media ad managers.

+ Proficiency with marketing automation and CRM platforms (e.g. HubSpot, Marketo), including campaign setup, lead nurturing workflows, and reporting.

As a Principal Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will utilize your extensive technical domain expertise to deliver innovative solutions to our product teams. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position.

Key Responsibilities 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Provides mentorship to other Process Engineers within the team.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.
• You may be assigned supervisory duties over supporting process engineering technicians and aides. These supervisory duties could include direct input into employees’ performance evaluations, discipline, and discharge.

Qualifications

• Master’s or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
• 7+ years of combined education, research, and work experience with:
  • Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
  • Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.

Skills

• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Ability to be a process consultant to internal and external customers.
• An authority on interplay between hardware design (e.g., chemical reactor design) and operation and process outputs
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs in direct and concise manner.

As a Senior Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements and perform the interpretation of complex experimental output. While you deliver creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are an essential function of this position. This job posting is for applicants with 2+ years of industry work experience. 

Key Responsibilities 

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Works with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Bringing innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting and accountability including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Works with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customer base by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.
• You may be assigned supervisory duties over supporting process engineering technicians and aides. These supervisory duties could include direct input into employees’ performance evaluations, discipline, and discharge.

Qualifications

• Master’s or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• 2+ years of work experience with:
  • Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
  • Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.

  Skills

• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement and budgetary oversight.
• Ability to be a process consultant to internal and external customers.
• An authority on interplay between hardware design (e.g., chemical reactor design) and operation and process outputs
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs in direct and concise manner.

We are seeking R&D-oriented Engineers to join our team in the development and improvement of semiconductor manufacturing equipment, specifically focusing on plasma-based chambers.

Key Responsibilities:

· Conduct research and development of components and mechanisms, including concept creation, feasibility studies, and practical evaluation/testing.

· Perform hardware characterization, define process window, and analyze process-hardware interaction.

· Design experiments, collect data, analyze results, and compile reports on various process development experiments

· Develop new equipment and functionalities, as well as improve existing equipment, from specification to detailed design.

· Ability to function in multi-disciplined fields (Process development, Hardware development and Metrology)

Required Skills:

· PhD in Physics, Engineering (Chemical, Electrical, Mechanical, or related fields), Material Science or Master degree with at least 3 years professional experience.

· In-depth knowledge of low-pressure RF plasma systems, including ICP, CCP, and microwave plasma sources

· Strong understanding of plasma-surface interactions, and precursor/plasma chemistry. Familiarity with PECVD, PEALD, RIE process mechanisms.

· Excellent communication skills for technical documentation, cross-functional collaboration, and customer-facing discussions

Preferred Skills:

· Familiarity with epitaxial silicon growth and characterization

· Familiarity with EM and multi-physics simulation tools (e.g., COMSOL, High Frequency Simulation software such as Ansys HFSS, CST studio )

· Familiarity with plasma diagnostics (e.g., Langmuir probes, OES, VI probes)

· Familiarity with common thin-film & chemical characterization & metrology techniques including: SEM, TEM, XRD, Ellipsometry, XPS / AES as well as ICP-MS, particle analysis, sheet resistance probe analysis etc

As a Principal Engineer, Surface Technology (Surface Modification) reporting to Surface Technology Group, you will work with other ASM global technology team members including materials scientists, equipment engineers, process, quality and field service engineers as well as external customers to solve time critical or strategic technology challenges and develop unique advanced solutions in collaborative partnerships.

The position requires the individual to:

• Drive improvements in Thermal & Plasma Enhanced ALD system component longevity, emissivity, stability, refurbishment / service strategy and process performance to enable reliable and efficient deposition of a range of next generation advanced thin film materials exhibiting various electrical & physical properties.
• Work independently to develop new approaches to modify surfaces of internal ALD chamber components to improve performance, lifetime, defectivity and CoO for customers processing various materials for use as functional/active layers in semiconductor device stacks.
• Connect process conditions, physical characterization, and electrical response towards understanding of mechanisms.
• Specify, procure and develop state-of-the-art advanced process equipment.
• Formulate new surface texturing and dry coating strip methods.
• Leverage advanced knowledge of media blast, multi-axis automated control systems, e-beam and pulsed laser process technologies.
• Direct / manage projects & relationships with critical 3^rd party suppliers & supporting institutions.
• Have a passion for surface engineering processes, be inquisitive to drive projects & root-cause failure investigations whilst being systematic & entrepreneurial in mind-set.
• Demonstrate experience within a high-volume semiconductor clean room environment.
• Be based within the ASM Phoenix AZ campus but open to travel (<10%) to customer and supplier global sites when necessary.

Preferred Qualifications:

• Bachelor’s degree or advanced degree studying Materials Science, Physics, Chemical Engineering, Chemistry, Electrical Engineering or similar technical / scientific field.
• Minimum 1-5 years of industrial experience preferably using automated blast or industrial laser or e-beam systems.
• Expertise in high volume semiconductor cleaning  environments highly advantageous.
• Solid understanding of Design-of-Experiments execution and statistical data analysis.
• Familiarity with common surface characterization & metrology techniques including: Optical microscopy, SEM, TEM, XPS / AES, profilometry, CMM as well as ICP-MS, particle analysis etc.
• Ability to engage with customers both on a highly technical basis and personally.
• Self-motivated, results-oriented with high commitment to work quality in a fast-paced environment.
• Proven ability to solve complex analytical problems and provide robust solutions based on solid technical background.

In this role as a Senior Engineer, Surface Technology (Parts Coating) reporting within the Surface Technology Group, you will work with other ASM global technology team members including materials scientists, equipment engineers, process, quality and field service engineers as well as external customers to solve time critical or strategic technology challenges and develop unique advanced solutions in collaborative partnerships.

The position requires the individual to:

• Drive improvements in Thermal & Plasma Enhanced ALD system parts longevity, stability, refurbishment / service strategy and process performance to enable reliable and efficient deposition of a range of next generation advanced thin film materials exhibiting various electrical & physical properties.
• Work independently to develop new approaches to coat, protect and refurbish internal vacuum chamber components to improve performance, lifetime, defectivity and CoO for customers processing various materials for use as functional/active layers in semiconductor device stacks.
• Connect process conditions, physical characterization, and electrical response towards understanding of mechanisms.
• Specify, procure and develop state-of-the-art advanced process equipment.
• Formulate new protective and release coating formulations.
• Leverage advanced knowledge of various atmospheric & vacuum based etch & surface treatment approaches and utilize expertise in a range of surface / bulk characterization methods.
• Direct / manage projects & relationships with critical 3^rd party suppliers & supporting institutions.
• Have a passion for surface engineering processes, be inquisitive to drive projects & root-cause failure investigations whilst being systematic & entrepreneurial in mind-set.
• Demonstrate experience within a high volume semiconductor clean room environment.
• Be based within the ASM Phoenix AZ campus but open to occasional travel to additional global ASM, customer and supplier global sites when necessary.

Preferred Qualifications:

• Bachelors science degree ideally involving theory & practice of an appropriate thin film deposition technique whilst studying Materials Science, Physics, Chemical Engineering, Chemistry, Electrical Engineering or similar technical field.
• Minimum 1-5 years of experience in ALD (atomic layer deposition), PECVD (plasma enhanced chemical vapor deposition) or PVD (physical vapor deposition) technology,
• Expertise in coating equipment design and electro-mechanical development approaches highly advantageous.
• Experience using ASM EmerALD systems a plus.
• Solid understanding of Design-of-Experiments execution and statistical data analysis.
• Familiarity with common thin-film & chemical characterization & metrology techniques including: Optical microscopy, SEM, TEM, XRD, Ellipsometry, XPS / AES as well as ICP-MS, particle analysis, sheet resistance probe analysis etc.

• Ability to engage with customers both on a highly technical basis and personally.
• Ability to self-manage projects from conception to high volume production necessary
• Self-motivated, results-oriented with high commitment to work quality in a fast-paced environment.
• Proven ability to solve complex analytical problems and provide robust solutions based on solid technical background.