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Job Description:

Responsible for working with Broadcom substrate subcontractors to manage and resolve issue relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.

Responsible for NPI activities, risk assessment, process improvement and development and production engineering support of high volume IC substrate manufacturing.

Wok with Broadcom internal cross functional engineering team resolves issues with interactive nature, work on newly developed packaging technology and drive towards high volume manufacturing maturity.

Responsible for new product pre-production engineering activities and drive improvement in process and visual mechanical yields, cycle time\

Take on site standardization in Best Known Methods, and verification on compliance toward Broadcom requirement.

Drive capability enhancement and cost reduction projects

Qualification of new substrate suppliers and support for moving to HVM

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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