Develop and Communicate Technology Development Strategy 

• Develop and communicate Technology Development strategic objectives. 

• Understand the impact and implications of TD strategy to the overall company strategy and direction. 

Technical Leadership 

• Set strategic and long-term technical objectives and insure they are aligned with department objectives. 

• Demonstrate understanding of technology complexity and effective technology decision making. 

• Provide technical leadership that may influence company direction. 

Cross Functional Leadership 

• Represent Assembly team in providing cross team/department leadership in area of responsibility. 

• Work effectively with peers in other team/department to develop and drive cross functional initiatives. 

Impact and Execution 

• Apply knowledge to achieve quality improvements, cost control, and production efficiency. 

• Ensure accuracy, quality, and timeliness of results. 

• Guide best utilization of resources to achieve end results. 

• Ensure critical deliverables, milestones and goals are met by the team. 

• Provide input to achieve organization objectives and align group to support department objectives. 

• Make decisions that directly impact the achievement of work unit and sub-function objectives. 

People Leadership Development 

• Mentor, develop and motivate team members. 

• Champion AI-enabled ways of working and the responsible adoption of AI, automation, digital solutions, and advanced analytics to improve organizational performance.

Growth Mindset 

• Continue to build new skills through development goals and learning events. 

• Seek out opportunities to work cross functionally, build a network, and gain competency across domains. 

Qualifications and Skills include, but not limited to: 

• At least 10 years experience in packaging industry which should include at least 5years in advanced package field.   

• Degree/Major: MS or Ph.D in Electrical, Computer Engineering, Chemistry, Physic, Material or related field 

• Proven ability to lead small and large teams toward common goals. 

• Deep knowledge of advanced package process and material development. (2.5D, 3DIC, FO, hybrid bond...etc) 

• Excellent data extraction, analysis and reporting skills. (system data mining, JMP…etc) 

• Understanding of probe, parametric, backend and reliability testing. 

• In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability. 

• Strong understanding of electronic materials, processing, physical, chemical, and electrical properties, failure analysis, and characterization techniques. 

• Excellent data analysis and data interpretation skills. 

• Proven ability to troubleshoot problems and address root causes. 

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. 

• Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics. 

• Skill at effectively prioritizing multiple and complex tasks. 

• Good communication skill to align the perspective through cross functional teams 

• Tenacity to work effectively under tight timelines and limited resources 

• Demonstrated ability or willingness to leverage AI, automation, digital tools, and data analytics to improve decision making, problem solving, operational effectiveness, and workforce productivity.

• Ability to self-direct and measure with minimal supervision. 

• Outstanding communication and presentation skills, written and verbal to all levels of an organization 

• Fluent communication in English