Core Responsibilities

• Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.

• Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers.

• Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage.

• Monitor wafer thickness uniformity, cutting quality and production capacity, carry out continuous process optimization to improve product yield.

• Evaluate process compatibility between wafer grinding/stealth dicing and bumping & flip-chip processes, optimize process integration to avoid subsequent process failure attributed to front-end process variations.

• Compile process SOP, WI, failure reports and engineering change documents; support NPI new product introduction and process verification.

Key Requirements & Qualification

• Education: A Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline

• Experience: 3 to 6+ years of hands-on process engineering in wafer mounting, wafer dicing, wafer thinning or grinding, especially in handling advanced packaging wafers with more complex topology or stack

• Experience working with external equipment and material suppliers to develop equipment and materials needed to support new assembly requirements. Characterize, qualify and bring the process up for mass production

• Familiarity with SPC, JMP data analysis, and DOE matrix design for process development and problem identification and solving using meticulous fixing methods