As a Senior/Principal Dry Etch engineer, you will be part of a ground-breaking Advanced NAND Development team! The position promises ample opportunities for innovation, collaboration and testing new dimensions on state-of-the-art dry etch chambers. You will deliver Dry etch process and HW solutions to meet Micron’s program requirements while driving dry etch technology roadmaps to continue enabling Micron’s global leadership in semiconductor manufacturing.  You will be working in a highly collaborative atmosphere, interacting with various groups such as process integration, process areas such as CVD, Lithography, & CMP, yield enhancement, manufacturing, and equipment vendors, to ensure robust etch processes that meet the detailed physical and electrical requirements for Micron products. Your responsibilities include, but are not limited to: 

Leading Dry etch process development. 

• Innovate/explore/develop dry etch processes to meet structural and electrical specifications. 

• Work and innovate with process integration teams to influence integration flows and specs. 

• Collaborate and lead multi-functional teams to tackle sophisticated structural problems. 

• Ability to work independently, with minimal direction, and focus on meeting commitments. 

• Support root cause and outstanding defect analysis. 

• Produce and present process and technology roadmaps for current and future technology nodes. 

• Support process transfer to production facilities (some domestic and/or international travel may be required).  

Interaction with other Process Areas 

• Identify and drive towards a collaborative solution. Guide other area's technology roadmaps. 

• Lead or be a part of multi-functional task force groups driving towards a target. 

• Develop expertise in other areas process hardware, or technologies. 

Interaction with Dry Etch Peers 

• Be a resource and mentor for peers and/or project management. 

• Provide critical updates to upper management on project status and impacts. 

The ideal candidate for this position will have:  

• The skills and experience to excel in a research and development environment. 

• Understanding of different types of dry etch reactors (e.g., RF sources, chemistries) 

• Experience with both ICP and CCP tools.  

• Knowledge of plasma physics, transport or surface phenomena gained through experience and/or coursework. 

• High aspect ratio Dry Etch experience (preferred) 

• Experience in managing vendor relationships and driving vendors for solutions. 

• Experience in running technical projects or leading groups of other specialists. 

• Experience in or understanding of statistical process control and analysis. 

• Proven leadership in problem-solving. 

• Strong digital literacy, including MS Office.  

• Experience in programming or scripting is desirable. 

Education and Experience:  

• Ph. D. degree or equivalent experience in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields with +3 years’ proven experience 

• M.S. degree or equivalent experience with +5 years’ proven experience 

• BS degree or equivalent experience with +7 years’ proven experience