Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference.

Job Description:

Summary:

• The primary responsibilities will focus on Design for Manufacturability (DFM) for PCB and PCBA.
• Driving the engineering development process from concept to mass production and resolving complex engineering challenges.
• The candidate will possess deep expertise in substrate/board-level design rules, materials, assembly processes, and failure analysis to ensure robust, reliable, and cost-effective module packaging solutions.
• Lead the end-to-end packaging, structural design, and process development for 800VDC/400VDC to 48V/12V/6V Power Shelf and PDB products in high power-density applications.

RESPONSIBILITIES:

• Establish and enforce comprehensive DFM guidelines and constraints for PCB fabrication (trace/spacing, via design, impedance control) and PCBA assembly (component placement, solder mask, stencil design).
• Proactively identify and mitigate potential manufacturing, testability, and reliability risks during the design phase.
• Lead the end-to-end engineering development of chip-on-board (CoB), system-in-package (SiP), and other complex module packages.
• Own the process development and qualification for critical PCBA assembly steps, including SMT, die attach, wire bonding/FC, underfill, molding, and final coating.
• Lead the packaging R&D of 800VDC/400VDC to 48V/12V/6V Power Shelf and PDB (Power Distribution Board) products.
• Develop and optimize packaging processes (including soldering, potting, heatsink assembly, insulation treatment, etc.), addressing insulation, creepage, thermal, and reliability challenges in medium-to-high voltage environments.
• Participate in the full product development cycle from concept design to mass production validation, including prototype building, reliability testing, process verification, and issue resolution.
• Track industry-leading packaging technologies and materials to continuously improve product performance and cost efficiency.

REQUIREMENTS:

Education: Bachelor’s degree or above in Power Electronics, Mechanical Engineering, Materials Science, Microelectronics Packaging, or related fields.

Experience:

• Expert-level knowledge of PCB/PCBA design, materials, and fabrication/assembly processes. Familiarity with IPC standards is required.
• Deep understanding of SMT, flip-chip, wire-bond, underfill, and molding processes for advanced packages.

• Experience in structural design, packaging development, and process implementation for Power Shelf, PDB, or similar high-voltage power systems is highly preferred.
• Minimum of 5 years of hands-on experience, with a strong focus on module-level development, PCB/PCBA DFM, and process engineering.

Technical Skills:

• Proficient in mechanical design tools such as SolidWorks, AutoCAD;
• Familiar with power device packaging (SiC/GaN), potting materials, connector selection, and high power-density assembly processes;
• Strong process development capability with the ability to independently resolve issues in soldering, mechanical assembly, and reliability failure analysis.

Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.