Job Title:

Job Description:

The Role: 

Position Summary 

The Senior Field Applications Engineer (Sr. FAE) serves as the primary technical interface between APS and semiconductor customers, providing application expertise, technical support, and business development support for advanced fluid handling and process solutions. The role focuses on identifying customer challenges, recommending process improvement opportunities, and driving technical adoption of APS products across semiconductor manufacturing processes. 

The successful candidate will possess strong semiconductor process knowledge, excellent customer engagement skills, and the ability to work collaboratively with sales, engineering, and product management teams to accelerate business growth. 

Key Responsibilities 

Technical Customer Support 

• Provide technical consultation and application support for APS products and solutions. 

• Work directly with semiconductor customers to understand process requirements and identify opportunities for product implementation. 

• Lead product evaluations, qualification activities, troubleshooting, and root cause analysis. 

• Deliver technical presentations, product training, and application workshops to customers. 

Application Development 

• Support development and optimization of fluid management solutions for semiconductor manufacturing processes. 

• Collaborate with product engineering and R&D teams to translate customer requirements into product enhancements. 

• Generate application reports, qualification summaries, and technical recommendations. 

Business Development Support 

• Partner with Account Managers to develop strategic customer engagement plans. 

• Identify new opportunities within existing accounts and emerging semiconductor technologies. 

• Support product launches and market penetration activities. 

Cross-functional Collaboration 

• Coordinate with manufacturing, quality, engineering, and global application teams. 

• Share market intelligence and competitive information to support strategic planning. 

• Participate in customer visits, technical reviews, and industry conferences. 

In this role you will: 

Vendor Experience (Highly Preferred) 

Experience with semiconductor equipment, material, chemical, filtration, fluid handling, or subsystem suppliers such as: 

Wet Clean Experience (Preferred) 

Knowledge or hands-on experience with wafer carriers or EUV pod 

Advanced Packaging Experience (Preferred) 

Experience supporting: 

• Fan-Out Packaging (FOWLP) 

• 2.5D / 3D packaging 

• TSV processes 

• Hybrid bonding 

• Micro-bump applications 

• Wafer-level packaging 

• HBM-related manufacturing processes 

Desired Competencies 

• Strong technical communication and presentation skills. 

• Customer-oriented mindset with consultative selling capabilities. 

• Ability to influence cross-functional teams without direct authority. 

• Analytical problem-solving and root cause investigation skills. 

• Self-motivated with ability to manage multiple customer projects simultaneously. 

• Fluent in English and Mandarin (written and verbal). 

Travel Requirement 

• Approximately 25-40% travel within Taiwan and Asia as required to support customer activities, business development, and technical engagements.

Your success will be measured by: 

The ideal candidate combines semiconductor process expertise with customer-facing application experience. Candidates with backgrounds in wet clean processes, advanced packaging, backend manufacturing, and semiconductor equipment/material vendors will be strongly preferred. Experience supporting leading semiconductor manufacturers such as TSMC, ASE, SPIL, PTI, Powertech, Amkor, Intel, Samsung, or Micron is highly desirable.