ABOUT LUMILENS

At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.

We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. This isn’t incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in optics, systems, and scale. Every line of code, every design decision, every breakthrough you help deliver will shape the infrastructure of tomorrow.

If you're looking for mission, momentum, and the chance to make an outsized impact jump on the rocket ship. We’re just getting started.

POSITION OVERVIEW

We are seeking an experienced Die Attach & Wire Bond Process Technician to support semiconductor and photonics assembly processes in both NPI and production environments.

The technician will work closely with Process Engineers, Manufacturing, and Quality teams to support die attach, epoxy dispensing, curing, wire bonding, process setup, equipment operation, troubleshooting, process qualification, and production ramp activities.

The successful candidate should be hands-on, detail-oriented, and comfortable working with precision assembly equipment, process documentation, and controlled manufacturing environments.

What You'll Do:

• Support die attach and wire bonding operations, including machine setup, recipe loading, tooling change, and process monitoring.

• Perform epoxy dispensing, die placement, curing, wire bonding, and visual inspection according to approved procedures.

• Support NPI builds, process trials, DOE, qualification runs, and production ramp activities under engineering guidance.

• Perform equipment troubleshooting, preventive maintenance, and process parameter verification.

• Conduct or support die shear, wire pull, ball shear, and other process quality checks.

• Record process data, defects, equipment issues, and test results accurately.

• Support engineers in yield improvement, root-cause analysis, material evaluation, and process optimization.

• Willing to support shift work or production ramp activities when required.

Requirements & Qualifications

• Experience with semiconductor packaging, optical modules, silicon photonics, or optical transceiver manufacturing.

• Experience with Au wire bonding.

• Experience with conductive or non-conductive die attach epoxy.

• Experience with eutectic die bonding.

• Familiarity with die shear, wire pull, ball shear, and visual inspection criteria.

• Basic understanding of SPC, process capability, DOE, and manufacturing process control.

• Experience supporting NPI, engineering builds, qualification lots, or production ramp.

• Experience with equipment brands such as K&S, Besi, Palomar, Datacon, Nordson, or similar semiconductor assembly equipment is an advantage.

Why Join Us?

This is more than a job. It's a chance to get in on the ground floor of a well-funded company set to disrupt a multi-billion dollar market. You will have the autonomy to make a massive impact, the resources to execute your vision, and a significant stake in the company you help build.

What we offer

• Competitive salary commensurate with experience

• Comprehensive benefits package including health insurance

• Professional development opportunities and certification support

• Access to cutting-edge technology and cloud platforms

• Collaborative work environment with cross-functional teams

Lumilens is an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, gender, identity, orientation, veteran status, disability, or any other legally protected status.