À propos de ce poste ATE Hardware Design - Principal Engineer chez NXP Semiconductors
We are seeking a highly experienced and driven Principal Engineer to lead the end-to-end design, development, integration, and validation of advanced ATE test hardware. This senior technical role combines deep hands-on expertise with cross-functional influence to deliver robust, high-performance test solutions that enable successful new-product introduction and high-volume manufacturing.
Key Responsibilities
Own the complete ATE test hardware development lifecycle, from requirements definition and architecture through design, verification, validation, release, and production support.
Design and review complex test hardware, including load boards, probe cards, sockets, and related interfaces for wafer sort and final test applications.
Lead schematic, stack-up, component-placement, routing, and design reviews, with particular focus on signal integrity, power integrity, manufacturability, reliability, and first-time-right execution.
Perform or guide SI/PI analysis, design simulation, hardware bring-up, debugging, root-cause analysis, and corrective-action implementation.
Partner closely with Business Line Test Engineering, Product Engineering, Operations, Quality, Procurement, and external manufacturing partners to ensure technical alignment, quality, cost, and schedule performance.
Define and improve test hardware design methodologies, guidelines, validation strategies, and reusable best practices across projects and sites.
Coordinate multiple hardware initiatives, manage technical risks and priorities, and support test hardware technology and supplier lifecycle planning.
Provide technical leadership, mentoring, and design guidance to engineers, suppliers, and cross-functional project teams.
Develop and maintain strong technical partnerships with global test hardware suppliers; drive supplier capability, quality, responsiveness, and continuous improvement.
Required Technical Expertise
Deep understanding of the full hardware development process: design, verification, validation, release, and production support.
Strong knowledge of semiconductor back-end assembly and test operations, including industrial and high-volume manufacturing environments.
Hands-on experience with major ATE platforms such as Advantest V93000 and EXA Scale, Teradyne J750, UltraFLEX, and UltraFLEXplus, or comparable systems.
Expertise in high-speed digital design and signal integrity, power delivery and power integrity, including PMIC applications, and complex multilayer PCB design.
Advanced knowledge of PCB layout practices, stack-up definition, SI/PI analysis, design-for-manufacturability, and hardware validation.
Strong understanding of semiconductor test flows, ATE architecture, wafer sort, final test, and the interaction between silicon, package, test hardware, and tester resources.
Proficiency with relevant electronic design and simulation tools such as Cadence Allegro, Keysight ADS, Ansys HFSS, or equivalent tools.
Proven ability to troubleshoot complex electrical and hardware issues using structured problem-solving and data-driven analysis.
Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related technical discipline.
A minimum of 10 years of relevant experience in ATE test hardware design and development within the semiconductor industry.
Proven track record of delivering complex test hardware solutions in a fast-paced new-product-development and manufacturing environment.
Experience coordinating cross-functional projects, managing external suppliers, and balancing technical performance, quality, cost, risk, and schedule.
Effective written and verbal communication skills in English, with the ability to collaborate and influence across global and multicultural teams.
Ability to operate independently, make sound technical decisions with incomplete information, and provide leadership as a recognized subject-matter expert.
Preferred Qualifications
Experience across digital, mixed-signal, high-speed, RF, or power-management semiconductor products.
Experience developing technical roadmaps, design automation, reusable design checks, or standardized hardware development methodologies.
Established working relationships with global PCB, probe-card, socket, and test hardware suppliers.
