Overview: A chip isn't a product until it's a working system. These teams cover both ends of that: getting silicon to boot and validate correctly,building the board, power, mechanical, thermal, packaging and IO around it. You submit one application, you have one recruiter screen - then we match you to the specific team below and location that fits best.

• Systems & Silicon Validation: Post-silicon testing of physical chips and integrated systems to ensure they meet all functional, electrical, and performance specs.
• System Software: Development of foundational software, including firmware, drivers, and operating systems, that directly controls and interfaces with hardware.
• System Design: The process of defining, integrating, and mapping out hardware components such as PCBs, software modules, and interfaces into a complete product blueprint.
• System Architecture: Define the high-level structural framework, interfaces, and data-flow pathways between the CPU, memory, and peripherals.
• Packaging: A package is what is placed between the silicon and the board; and its design requires detailed electrical, electromagnetic, and mechanical simulations and analysis. 

This role is on-site based out of Toronto, Ontario or Vancouver, British Columbia.

Who You Are

• Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering
• Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).
• Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.
• Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).

What We Need

• Systems & Silicon Validation: Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications.
• System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware.
• System Design & Architecture: Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs.
• Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis

What You Will Learn

• Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips.
• Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal.
• Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages.
• Cross-functional collaboration working alongside world-class architects, mechanical designers, package engineers, and software teams to understand how complex, large-scale chip ecosystems are built from scratch.