Role Overview

We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers

Key Responsibilities

Technical Leadership & Execution

• Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements.
• Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams.
• Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.
• Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness.
• Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs.
• Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk.

Hands-On Design

• Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs.
• Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications.
• Build and correlate PDN and thermal models spanning die, package, and board.
• Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support.
• Author package design guidelines, review checklists, and reference collateral used across product programs.

Required Qualifications

Education & Experience

• Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume.
• Proven experience leading teams to successful execution, with multiple products delivered in advanced CMOS nodes.

Core Technical Skills

• Deep SI/PI expertise for multi-GHz serial links: 112G/224G PAM4 channel design, COM analysis, crosstalk and mode-conversion control, and connector/cable interfaces.
• Advanced packaging depth: FCBGA, RDL/fan-out, 2.5D interposers and silicon bridges, substrate design rules, and materials selection.
• Fluency with industry tools: HFSS, Q3D, SIwave/PowerSI, ADS channel simulation, Cadence APD/Allegro (or equivalent), and thermal tools such as Icepak or FloTHERM.
• Reliability and qualification: JEDEC standards, moisture sensitivity, thermo-mechanical stress, and warpage/coplanarity management for large-body packages.
• Working knowledge of optics packaging: VCSEL/PD or silicon-photonics co-packaging, fiber and lens coupling, and active alignment concepts.

Leadership & Program Skills

• Track record leading small internal teams and external partners (OSATs, substrate vendors, contract labs) through complete product cycles into volume production.
• Strong program discipline: schedule and risk management, structured design reviews, and clear documentation in a fast-moving environment.
• Excellent cross-functional communication with silicon, systems, and executive stakeholders; comfortable presenting technical trade-offs to customers and partners.

Preferred Qualifications

• Experience with co-packaged optics, linear-drive optics, or active copper/electrical cable (ACC/AEC) products.
• Micro-LED, VCSEL, or photonic device packaging experience.
• Familiarity with UCIe and chiplet/die-to-die interconnect packaging.
• Hands-on HVM ramp experience at leading OSATs (ASE, Amkor, JCET, or similar).
• Prior startup experience or comfort operating with broad scope under resource constraints.