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Sobre este puesto de Staff Advanced Packaging/Process Engineer of R&D en Lumentum

Lumentum · Presencial · USA - CA - San Jose (Ridder)

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!


About Lumentum

At Lumentum, we’re building the tech behind the world’s fastest networks and most advanced systems. Our optical and photonic solutions power everything from AI and cloud computing to data centers, telecom, and advanced manufacturing.

 

We’re a global team of innovators working where light meets technology, solving big challenges that keep the world connected and moving forward. If shaping the future of connectivity excites you, you’ll fit right in.


Why You’ll Love This Role


Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to drive the development of cutting-edge packaging solutions for optical and photonic devices. This role involves innovating and optimizing processes for high-performance, reliable, and cost-effective packaging.

What You’ll Be Doing

  • Lead the design, development, and optimization of advanced packaging processes for new optical and photonic products, from concept to high-volume manufacturing.
  • Conduct hands-on process development, characterization, and troubleshooting for various packaging technologies, including die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and advanced interconnection schemes.
  • Develop and implement robust process control strategies, statistical process control (SPC), and design of experiments (DOE) to improve yield, reliability, and manufacturability.
  • Collaborate closely with cross-functional teams including design, product engineering, reliability, and manufacturing to ensure seamless transfer of new packaging technologies into production.
  • Evaluate and select new materials, equipment, and manufacturing techniques to enhance packaging performance, reduce cost, and improve throughput.
  • Perform root cause analysis for packaging-related failures and implement corrective actions.
  • Document process specifications, manufacturing instructions, and test procedures.
  • Mentor junior engineers and provide technical leadership within the R&D team.
  • Stay abreast of industry trends, emerging technologies, and competitive landscapes in advanced packaging.

What We’re Looking For


Education:
Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.

Experience:
Core Requirements:


  • 8+ years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry, with a strong R&D focus.
  • Demonstrated expertise in multiple packaging technologies such as chip-on-board (COB), flip-chip, wafer-level packaging (WLP), system-in-package (SiP), hermetic sealing, and optical assembly.
  • Proficiency with various bonding techniques (e.g., wire bonding, thermocompression bonding, epoxy attach).
  • Strong understanding of materials science principles relevant to packaging, including adhesives, solders, encapsulants, and substrates.
  • Hands-on experience with packaging equipment, including pick-and-place, wire bonders, reflow ovens, and optical alignment systems.
  • Solid knowledge of statistical process control (SPC), design of experiments (DOE), and failure analysis techniques.
  • Experience with CAD tools for package design and simulation is a plus.
  • Excellent problem-solving, analytical, and communication skills.
  • Ability to work independently and collaboratively in a fast-paced R&D environment.

Perks You’ll Love

  • Flexible time off
  • Health and wellness benefits (physical and mental)
  • Tuition reimbursement and career growth support
  • A workplace built for you: free gym, games room, prayer room
  • Subsidized meals, free coffee/tea
  • Employee stock options and incentive plans
  • A collaborative, innovative, and inclusive culture

Join a Team That’s Shaping the Future

At Lumentum, we’re more than just a workplace—we’re a launchpad for creativity and innovation. We’re committed to celebrating your unique talents and helping you grow. Our guiding principles—Innovate, Engage, Deliver, Excel, and Win—aren’t just words; they’re the heart of what we do.

 

Let’s Build a Brighter Future Together!

 

 

We’re committed to building an inclusive workplace where everyone feels valued and empowered. We welcome applicants from all backgrounds and provide accommodations for individuals with disabilities throughout the hiring process. Your uniqueness makes us stronger, sparks creativity, and drives our success.

Please contact us at [email protected] to request accommodation.

Join us—your future starts here!

Pay Range:

P60-USA-1 :$112,050.00 - $160,050.00

Disclaimer:

Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.

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Sobre Lumentum

Lumentum is illuminating the networks of tomorrow with advanced photonic technologies that enable AI, data centers, telecom, industrial, and sensing applications. As AI accelerates the global demand for bandwidth and energy efficiency, we deliver the building blocks that keep data moving reliably, efficiently, and at massive scale. Our optical products support AI and compute infrastructure, cloud and DCI environments, metro and long-haul networks, while our lasers drive breakthroughs in precision manufacturing and sensing. For nearly five decades, Lumentum has been at the intersection of light and innovation. What began as a vision with JDS Uniphase to harness the power of photonics has evol

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