Sobre este puesto de Sr. Principal Plating Engineer en FormFactor
Forming Our Future together
FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.
Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.
Shift:
The regular hours for this position are day shift.Job Description:
The Sr. Principal Plating Engineer (MEMS R&D) serves as a recognized technical authority responsible for defining, developing, and implementing advanced electroplating technologies, metallurgical innovations, and process integration strategies for MEMS probe fabrication. This role combines deep expertise in electrochemistry, materials science, semiconductor processing, and advanced metallurgy with the ability to solve highly complex technical challenges that have significant impact on FormFactor's technology roadmap and competitive advantage.
As a senior technical leader, you will lead strategic R&D initiatives, drive innovation in electrodeposition and material development, influence product and process direction, and collaborate with cross-functional teams to enable next-generation probe card performance. This role requires the ability to balance long-term technology development with hands-on process characterization and problem solving.
Key Responsibilities:
Technical Leadership & Innovation
Define and execute long-range technology roadmaps for advanced electroplating processes, materials, and metallurgical innovations supporting future MEMS probe technologies.
Serve as the organization’s subject matter expert in electroplating, electroless deposition, electrochemistry, and metallurgical process development.
Lead research, evaluation, and implementation of novel materials and deposition technologies to improve electrical, thermal, mechanical, and reliability performance.
Assess emerging industry technologies and identify opportunities to create sustainable competitive advantages through advanced materials and plating processes.
Generate intellectual property through invention disclosures, patent development, and technical innovation initiatives.
Process Development & Characterization
Design and execute complex Design of Experiments (DOE) to develop and optimize advanced metallurgical solutions for MEMS probe fabrication.
Develop, characterize, document, and scale electrodeposition processes for next-generation vertical probe technologies.
Establish process windows, operating specifications, and control methodologies to ensure robust and repeatable manufacturing performance.
Lead process integration efforts across MEMS fabrication workflows.
Maintain expertise in plating bath chemistry, deposit morphology, stress management, grain structure control, and material performance optimization.
Materials Analysis & Failure Investigation
Perform advanced materials characterization using SEM, EDS/EDAX, FIB, microscopy, and other analytical techniques.
Analyze deposited metal structures to evaluate composition, microstructure, purity, and performance characteristics.
Lead root cause investigations involving plating defects, process excursions, reliability concerns, and manufacturing challenges.
Apply first-principles engineering and statistical methodologies to solve complex electrochemical and material-related issues.
Process Control & Operational Excellence
Develop advanced process monitoring, control, and qualification methodologies.
Establish analytical techniques for plating bath characterization and chemical management.
Drive improvements in yield, process capability, throughput, and manufacturing robustness.
Define best practices for electrochemical process control, safety, and materials handling.
Ensure compliance with environmental, health, and safety standards associated with chemical processing operations.
Cross-Functional Collaboration
Partner with R&D, Product Development, Process Integration, Manufacturing, Equipment Engineering, and Quality teams to support technology development and commercialization.
Review new product designs and provide guidance regarding manufacturability, materials selection, and plating process capabilities.
Influence technical decisions and provide expert recommendations for strategic development initiatives.
Present technical findings and recommendations to senior leadership and executive stakeholders.
Mentorship & Organizational Impact
Mentor engineers, scientists, and technicians in electrochemistry, plating technologies, and process development methodologies.
Establish technical standards, documentation practices, and engineering best practices across the organization.
Build organizational capabilities through coaching, training, and technical leadership.
Lead technical reviews and serve as a trusted advisor on critical technology and manufacturing decisions.
Skills:
Electrochemistry, Electroless Plating, Electron Microscopy, Electroplating, Materials Engineering, Semiconductor Development, Semiconductor Fabrication, SemiconductorsEducation & Experience:
Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience | RequiredPay Range:
$136,200.00 - $178,815.00Pay Range Explained:
This role in Livermore, California pays between $136,200.00 and $178,815.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You’ll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.Equal Employment Opportunity Statement
FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.
For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.
