Introduction to the Role 

• Lead end-to-end structural issue management for advanced lithography systems to ensure stable equipment performance, availability, and productivity. 

• Drive performance improvement by identifying recurring technical issues, leading root cause analysis, and implementing sustainable solutions. 

• Coordinate cross-functional teams across engineering, operations, and product organizations to accelerate problem resolution and enhance customer value. 

• Act as a key technical and project leader for complex system-level challenges in a fast-paced high-tech environment. 

Role and Responsibilities 

• Lead structural issue management activities, ensuring timely identification, prioritization, and resolution of complex equipment-related issues. 

• Analyze system performance data and major downtime events to identify root causes and prevent recurrence. 

• Develop and execute improvement strategies to enhance system stability, availability, reliability, and productivity. 

• Collaborate with cross-functional stakeholders, including engineering, operations, product development, and customer support organizations. 

• Drive end-to-end problem-solving activities from issue detection through corrective action implementation and validation. 

• Establish and maintain effective processes for issue tracking, reporting, escalation, and governance. 

• Coordinate with global engineering and development teams to accelerate solution deployment and reduce resolution lead times. 

• Monitor key performance indicators (KPIs) such as availability, MTBF(Mean Time Between Failure), downtime, and recovery performance to drive continuous improvement. 

• Provide technical leadership, coaching, and guidance to project teams and stakeholders. 

• Capture and share lessons learned, best practices, and operational knowledge to strengthen organizational capability. 

Education and Experience 

Required 

• Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related technical field. 

• Minimum 8 years of experience in semiconductor, manufacturing, high-tech equipment, automotive, aerospace, or other complex engineering industries. 

• Proven experience leading cross-functional projects involving technical issue resolution and performance improvement. 

• Experience performing root cause analysis and implementing corrective and preventive actions in operational environments. 

Preferred 

• Experience with semiconductor manufacturing equipment or advanced industrial systems. 

• Experience working with global and multicultural teams. 

• Project management or technical leadership experience in a customer-facing environment. 

Skills and Competencies 

• Strong leadership, ownership, and accountability in driving complex technical projects to successful completion. 

• Excellent stakeholder management skills with the ability to influence without direct authority. 

• Strong analytical and problem-solving capabilities, supported by a data-driven mindset. 

• Ability to manage multiple priorities and deliver results in a dynamic environment. 

• Strong communication and presentation skills for both technical and management audiences. 

• Collaborative team player with a systems-thinking approach and strong business awareness. 

• Self-motivated, proactive, and execution-oriented. 

• Continuous improvement mindset focused on operational excellence and customer impact. 

• Advanced proficiency in data analysis, reporting, and presentation tools (e.g., Excel, PowerPoint). 

Why This Role 

• Opportunity to lead resolution of high-impact technical challenges in one of the world's most advanced technology environments. 

• Work closely with global engineering experts and cross-functional stakeholders. 

• Make a direct contribution to system performance, customer success, and technology advancement. 

• Develop both technical leadership and project management capabilities through exposure to complex, high-visibility initiatives.