About the Role 

GlobalFoundries is hiring an Optical Packaging Technology (OPT) Development leader within the Integrated Optics (IO) organization and is seeking a Senior Director. A successful candidate will define an organizational structure, recruit and develop the leadership team, and set the technical and operational strategy across advanced packaging, optics, and product engineering for GF's Integrated Optics portfolio. The role is based in Burlington, VT and will partner within a matrixed global organization. 

Key Responsibilities 

• Own the technical strategy and roadmap for Optical Packaging Technology (OPT) Development, spanning advanced packaging, optics, and product engineering. 

• Lead Package Design & Assembly architecture decisions for optical/photonic modules, including substrate, interposer, and co-packaging approaches. 

• Drive Yield Enhancement programs, using statistical process control and root-cause analysis to close yield gaps in packaging and assembly. 

• Own Packaging Qualification & Reliability strategy, including qualification test plans, stress testing, and reliability modeling to meet customer and industry standards. 

• Direct the Optics function's technical roadmap, covering optics/laser solutions, optical alignment and fiber attach processes, and co-packaged/advanced optics integration architectures. 

• Guide Product Engineering technical investigations, including returns analysis and failure analysis (FA) methodology, to close the loop between field issues and process/design changes. 

• Partner with Test engineering to co-develop test strategy, coverage, and qualification requirements aligned to package and optical architecture. 

• Set technical requirements and provide engineering oversight for external assembly/test partners, reviewing process capability, yield, and quality data. 

• Evaluate and down-select advanced packaging and optical integration technologies (e.g., co-packaged optics, fiber attach methods, EIC/PIC integration schemes) for technology roadmaps. 

• Collaborate cross-functionally with Silicon Products Development on EIC/PIC and optical engine architecture to ensure package-silicon co-design alignment. 

Required Qualifications 

• Bachelor’s degree in engineering, Materials Science, Physics, or related field required; advanced degree (MS/PhD) strongly preferred. 

• 15+ years of progressive experience in semiconductor or photonics packaging, with significant time in advanced packaging and/or optical/photonic integration. 

• Proven track record building or scaling a technical organization, including hiring and developing senior technical leaders. 

• Deep technical expertise in advanced packaging (assembly, package design, yield, qualification/reliability) and/or optical packaging (fiber attach, co-packaged optics). 

• Experience managing outsourced assembly and test (OSAT) partner relationships. 

• Strong executive presence and experience partnering with senior leadership, customers, and cross-site global teams. 

• Demonstrated ability to operate in a matrixed, multi-site global organization (US, Egypt, India, Singapore, Vermont). 

• Excellent communication, organizational design, and change-leadership skills. 

Preferred Qualifications:

• Comfortable operating in a matrixed, multicultural environment.

• Strong alignment with values of integrity, innovation, and operational excellence.

• Ability to lead through influence and build trust across diverse teams.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs