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Sobre este puesto de Process Support Engineer (Advanced Packaging) en Applied Materials

Applied Materials · Presencial · Singapore,SGP

Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

 

 

As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.

 

 

A Process Support Engineer at Applied Materials helps ensure stable, high‑quality semiconductor processes by supporting tool performance, troubleshooting issues, and optimizing process conditions. You will be based at customer's site daily and works closely with customer and internal teams to resolve problems quickly, analyze process data, and improve tool uptime and yield in a fast‑paced cleanroom environment.


Role Responsibilities: 

  • Provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment 
  • Work closely with the customer to develop leading-edge processes used to manufacture the most advanced semiconductor chips, many of which are inside everyday electronic devices 
  • Create hypothesis experiments and design of experiments (DOE); analyze data with statistics; and compile reports with high-level conclusions on technically challenging process engineering experiments 
  • Troubleshoot complex problems; perform multiple root cause analysis; and resolve a variety of difficult process engineering and customer product issues  
  • Communicate with both internal stakeholders and the customer to achieve goals with a focus on building relationships and establishing trust 
  • Apply your growing knowledge of best practices to offer a new perspective using existing solutions  
  • Serve as a resource for junior colleagues and a liaison between the customer and business unit; you may also lead small projects with manageable risks and resource requirements 


Requirements:

  • Bachelor’s degree in chemistry/ physics, materials engineering, electrical engineering, optoelectronics or related field 
  • >2 years of experience in the semiconductor process (Hybrid Bonding/ Advanced Packaging is highly preferred)
  • Strong interpersonal and communication skills to explain sensitive information and work to build consensus among project stakeholders 
  • Ability to travel to various customer sites as required

Work Location:

  • Based at customer sites across Singapore

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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