Job Details:

Job Description: 

The Role and Impact
Intel leads the semiconductor industry by creating innovative technologies. This is openings to TEM metrology Engineer in Hillsboro, Oregon, focusing on transmission electron microscopy (TEM) metrology data generation and analysis. This is for day shift positions in TEM metrology group supporting manufacturing process development for next generation of Intel chip with Integration, Module, inline Defect metrology and Yield analysis group partners by providing critical dimension TEM data for manufacturing process control and yield improvement.

The successful candidates require strong analytical TEM background with massive metrology data collection and statistical TEM analysis experiences in nano-scale materials or semiconductor device. Experience on automated metrology method development, building infrastructure and interface, various dimensional data mining from images, image processing, and BE/FE development to streamline automated data processing and other skillsets related metrology will be required to perform the roles.

This is a cross-functional role position working closely with automated TEM tool operation team as well as working internally with TEM automated metrology development engineers that requires clear communication and strong collaboration as one team. Continuous upgrading of skillset with open attitude and ability to learn from colleague are needed.

Behavioral traits:
• Ability to communicate and collaborate effectively within cross-functional teams consisting of tool owner team, operation technicians, automated metrology engineering team and manufacturing process engineering organizations.
• Ability to communicate technical findings and reliability risks to stakeholders in a clear and concise manner.
• A proactive mindset for continuous learning, process improvement, and applying new technologies to solve challenges.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications will be considered plus factors in identifying top candidates. Relevant experience can be obtained through classes and research projects, internships, military training, or work experience. Successful applicant must be a good team player and able to work efficiently and independently.

Minimum Qualifications:
• Master's degree in Materials Science, Chemical engineering, Mechanical Engineering, Electrical Engineering, or related technical field.

At least 4+ years of industry and technical Experience in:
• Knowledge of semiconductor manufacturing processes or experience working in a high-volume manufacturing environment with statistical analysis, design of experiments (DOE), SPC, or structured problem-solving methodologies.
• Strong analytical and problem-solving skills, with the ability to leverage data to identify trends, investigate root causes, and support engineering decisions.
• Experience using programming languages and data analysis and visualization tools such as Python, SQL, Power BI, and Tableau to analyze manufacturing or engineering data

Preferred Qualifications
The following qualifications would be considered an advantage:
• Ph. D. in Materials Science, Chemical engineering, Mechanical Engineering, Electrical Engineering, or related technical field with 4+ years of industry experience.
• Hands-on TEM experience on semiconductor device using various analytical techniques including FIB sample preparation and chemical analysis.
• Experience with tools such as python and OpenCV to perform tasks related to all aspects of development, including data extraction, end-to-end automation pipeline design, and data filtering.
• Experience with machine learning, predictive analytics, computer vision, or AI-based engineering projects is considered a strong plus.
• Experience with software development practices, including version control (Git), REST APIs, front-end or back-end development, database design, or cloud-based applications.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.