Jobs Companies NXP Semiconductors Principal SoC Chip Lead

Sobre este puesto de Principal SoC Chip Lead en NXP Semiconductors

NXP Semiconductors · Presencial · Shanghai (Pudong)

Responsibilities:

  • End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
  • Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.
  • Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.
  • Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
  • Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
  • Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.

Requirements:

  • Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
  • 6+ years of semiconductor industry experience.
  • Proven experience in SoC development from architecture through tape-out.
  • Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
  • Experience leading large cross-functional engineering teams.
  • Strong project execution, planning, and risk management skills.
  • Excellent communication, leadership, and stakeholder management capabilities.
  • Ability to influence technical direction and drive execution in a matrix organization.

Preferred Qualifications:

  • Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader
  • Experience with automotive, industrial, or safety-critical semiconductor products.
  • Experience working with global development teams across multiple sites.
  • Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Core Competencies:

  • Technical Leadership
  • Cross-functional Collaboration
  • Project Execution Excellence
  • Risk Management
  • Strategic Thinking
  • Problem Solving & Decision Making
  • Stakeholder Management
  • Communication & Influence
  • Customer Focus
  • Results Orientation


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Sobre NXP Semiconductors

Thank you for your interest in supporting our recruitment efforts. Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.

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