Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. 

What We Offer

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You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Key Responsibilities

• Lead the development and scaling of next-generation advanced packaging technologies, leveraging expertise in thin film deposition processes including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and/or Atomic Layer Deposition (ALD) to enable customer roadmaps and address critical technology challenges.
• Drive process and technology roadmap development for advanced packaging, 3D integration, and related semiconductor applications through collaboration with customers, research organizations, and cross-functional engineering teams.
• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on extremely complex systems for entire range of products for division
• Interact with key customers to resolve extremely complex process engineering issues to address customers High Value Problems (HVP) for an entire range of products for the division
• Ensures effective product/technology demonstrations
• Leads collaboration efforts with executive managers and junior managers to ensure strategic execution
• Leads market share improvement efforts

Functional Knowledge

• Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families
• Possesses deep technical expertise in semiconductor thin-film deposition technologies, including PVD, CVD, and/or ALD, and a strong understanding of materials engineering, process integration, and advanced packaging applications.
• Demonstrates knowledge of advanced packaging technologies, TSV, hybrid bonding, wafer-level packaging, and related semiconductor manufacturing processes.
• Demonstrated experiences in supervisory or management capacity.
• Outstanding communication and interpersonal skills with the ability to influence internally and externally, including senior management
• Problem-solver attitude with determination and quality-mindset management

Work Location

• Science Park II (Moving to Tampines from Apr 2027)

Additional Information

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Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.