About GF

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

What We Offer

We offer full-time career opportunities that provide meaningful learning experiences, cross-functional collaboration, and professional development. Employees benefit from mentorship, networking, and leadership opportunities that support skill development, career progression, and long-term success.

Summary of Role:

We are seeking a motivated talent to join the Advanced Packaging Process Integration & Yield Enhancement team as a test engineer. The successful candidate will support electrical test, product characterization, and yield-learning activities for 2.5D and 3D heterogeneous integration technologies, including chiplet-based packages, interposer and through-silicon-via (TSV) structures, die-to-wafer & wafer-to-wafer hybrid bonding and multi-die stacking. This role offers hands-on exposure to advanced packaging development and close collaboration with integration, design, process, product, reliability, equipment, and manufacturing teams. Candidates without prior work experience are welcome to apply. Comprehensive training and development will be provided.

Essential Responsibilities include:

• Support Test Development: Assist in developing, validating, and releasing electrical test methods for wafers, dies, interposers, package-level structures, and advanced packaging test vehicles.
• Execute Characterization: Conduct electrical characterization, engineering experiments, and data collection across process and product development lots under guidance from senior engineers.
• Test Hardware Support: Help define, qualify, and troubleshoot probe cards, sockets, load boards, interface hardware, cables, and related fixtures used for wafer-level and package-level testing.
• Data Analysis and Yield Learning: Analyze test results using statistical and visualization tools to identify trends, outliers, failure signatures, and yield-loss mechanisms. Summarize findings clearly for technical reviews.
• Failure Isolation: Support electrical fault isolation and coordinate with failure-analysis, integration, process, and reliability teams to determine potential root causes and verify corrective actions.
• Test Coverage and Correlation: Assist with test coverage reviews, guardband evaluation, repeatability and reproducibility studies, and correlation between bench, wafer-sort, final-test, and reliability data.
• Process and Product Qualification: Support development builds, qualification activities, reliability readouts, engineering change evaluations, and manufacturing readiness for new advanced packaging solutions.
• Continuous Improvement: Contribute to cycle-time reduction, test-time optimization, automation, data-quality improvement, and standardization of test methods and reports.
• Documentation: Maintain test plans, specifications, procedures, experiment records, data summaries, validation reports, and lessons learned in accordance with the team's document-control practices.
• Process Integration Support: Assist in developing and maintaining integrated process flows for advanced packaging structures from incoming wafer or die through assembly, test, and qualification. 
• Module Coordination: Work with unit-process owners on lithography, deposition, plating, etch, CMP, wafer thinning, temporary bonding and debonding, dicing, die bonding, underfill, molding, and thermal processing, as applicable to the assigned technology. 
• Cross-Functional Collaboration: Work effectively with local and global engineering teams, suppliers, and manufacturing partners; communicate progress, risks, and technical observations in a timely manner.
• Safety, Quality, and Compliance: Follow applicable environmental, health, safety, cleanroom, laboratory, quality, document-control, and information-security requirements.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications:

• Education – Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Microelectronics, Applied Physics, Materials Science, Mechanical Engineering, or a related technical field.
• Basic understanding of semiconductor devices, electrical measurements, circuits, and data interpretation.
• Working knowledge of common laboratory instruments such as digital multimeters, oscilloscopes, source-measure units, power supplies, or parameter analyzers.
• Ability to analyze structured datasets using Excel or a technical analysis environment such as Python, JMP, or MATLAB.
• Strong problem-solving skills, attention to detail, and willingness to learn unfamiliar technologies and tools.
• Strong written and verbal communication skills and the ability to work effectively in a cross-functional team.

Preferred Qualifications:

• Prior related internship or co-op experience
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Exposure to automated test equipment (ATE), wafer probing, package final test, bench characterization, or test-program development.
• Understanding of statistics, design of experiments (DOE), measurement-system analysis, statistical process control, or semiconductor yield concepts.
• Awareness of advanced packaging technologies such as 2.5D/3D integration, TSVs, interposers, micro-bumps, hybrid bonding, high-bandwidth memory, or system-in-package.
• Exposure to signal integrity, power integrity, thermal effects, mechanical stress, or reliability considerations in package and test design.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency, and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations. 

No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices. Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at [email protected] or visit our official website. 

The Ethics & Compliance mailbox is not a recruitment channel. CVs/resumes submitted to this mailbox will not be reviewed, processed, or considered for employment opportunities. Please apply through the official GlobalFoundries careers site only.