Description -

Shape the Future of AI Infrastructure

As AI systems continue to scale, cooling has become one of the primary constraints to performance, power efficiency, and data center density.

Building on more than 40 years of leadership in thermal management, fluidics, silicon technologies, and high-volume precision manufacturing, HP is exploring advanced  microfluidics technologies to address the growing power and cooling challenges of future AI infrastructure. We are seeking a senior strategy and business leader to engage with industry partners, evaluate emerging opportunities, and help shape HP's direction at the intersection of semiconductors, liquid cooling, and data center technologies.

This is a unique opportunity to work on emerging technologies at the intersection of semiconductors, liquid cooling, and hyperscale computing. The role combines strategy, ecosystem development, and business creation in one of the fastest-growing segments of the technology industry.

Responsibilities

Develop Strategy and Business Opportunities:
Define market opportunities, customer segments, business models and growth strategy. Monitor competitive, technology, and ecosystem trends across AI infrastructure.

Build Strategic Partnership:
Develop and strengthen relationships with semiconductor companies, hyperscale cloud providers, server OEMs, contract manufacturers, and cooling solution providers. Identify opportunities to accelerate ecosystem adoption and create long-term strategic value.

Drive Product and Market strategy:
Translate customer requirements and market insights into product and portfolio recommendations. Align business, technology, and customer priorities to maximize market impact.

Lead Cross-Functional Execution:
Work across engineering, business development, finance, operations, legal and executive leadership teams. Drive alignment, communicate progress, risks and opportunities to executive leadership.

Represent HP externally:
Engage customers, partners, analysts, and industry leaders. Serve as a key representative for HP's AI infrastructure cooling initiatives. Help shape HP's long-term position within the evolving AI ecosystem.

Experience and Education

• 12+ years of experience in business development, product strategy, product management, technology commercialization, consulting, or related fields.
• Strong understanding of data center infrastructure, AI systems, semiconductors, liquid cooling, or adjacent hardware technologies.
• Demonstrated success bringing new technologies, products, or platforms to market. Proven ability to develop and execute growth strategies in complex technology markets.
• Exceptional communication and stakeholder management skills.
• Ability to influence senior leaders and drive alignment across organizations.
• Preferred: experience working at or with hyperscalers, semiconductor companies, server OEMs, AI infrastructure providers, and/or cooling technology suppliers.
• Four-year or Graduate Degree in Engineering, Business Administration, Finance, Economics, or any other related discipline

Complexity
•    Invents, develops and introduces new methods and techniques that impact multiple disciplines and work groups.
•    Must have strong business acumen and ability to build business cases, communicate effectively with executives. 
•    Must have business development / account management experience at senior level.
•    Must be passionate about data centers and associated technologies such as liquid cooling systems.
 

Impact & Scope

This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

The pay range for this role is $166,050.00 - $249,100.00 annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

Job -

Schedule -

Shift -

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"