Sobre este puesto de Circularity Innovation Engineer en HP
Description -
Job Summary
Leads the end-to-end engineering, innovation, and deployment of circularity solutions across HP products and packaging, with a primary focus on packaging transformation, recycled and renewable materials, electronics, reuse, repair, takeback, and circular economy systems.
Drives execution of HP’s circular economy strategy by integrating circularity into product design, supply chain operations, and digital data systems. This role contributes to HP’s long-term circularity ambition aligned to internal 2030 and 2040 management frameworks, enabling scalable, compliant, and high-impact sustainability outcomes.
Key Responsibilities
1. Circular Packaging Innovation
- Lead development and deployment of renewable and recyclable packaging solutions
- Replace single-use plastics with fiber-based, molded fiber, and bio-based materials
- Optimize packaging design for performance, cost, and lifecycle impact
- Ensure compliance with global requirements (e.g., EPR frameworks, California SB54, and EU Packaging and Packaging Waste Regulation (PPWR))
2. Recycled & Renewable Materials Engineering
- Increase integration of:
- Post-consumer recycled plastics (PCR)
- Recycled metals and critical materials
- Renewable materials (e.g., bio-based, fiber-based) that are responsibly sourced and certified
- Closed-loop and ocean-bound material
- Ensure renewable materials meet:
- Responsible sourcing standards (e.g., FSC, RSPO, or equivalent)
- Lifecycle performance, recyclability, and compliance requirements
- Support qualification and scaling of high recycled and renewable content materials
- Drive supplier engagement and certification for sustainable material sourcing
3. Design for Circularity (DfC)
- Embed circularity principles into product design:
- Durability, modularity, repairability, upgradeability
- Disassembly and recyclability
- Partner with R&D teams to influence product architecture and material choices
- Align product design with ecolabels and sustainability standards
4. Reuse, Repair, and Takeback
- Advance lifecycle extension strategies:
- Repair and refurbishment systems
- Device life extension and reuse programs
- Reverse supply chain optimization
- Scale reuse of products and components across HP portfolios
- Integrate reuse into sustainability metrics and operational models
5. Circularity Data & Digital Systems
- Partner with digital and data teams to advance:
- Enterprise data platform and system of record
- Packaging and product data source
- Personal Systems sustainability reporting and data integration
- Print sustainability reporting and data integration
- Near real-time part and BOM-level sustainability reporting
- Improve:
- Data accuracy, traceability, and auditability
- BOM-level material transparency
- Support compliance with:
- EU CSRD / ESRS circular economy reporting
- Enable data-driven decision-making, reporting, and audit readiness
6. Cross-Functional Leadership
- Lead collaboration across:
- Engineering (R&D), Procurement, Supply Chain, Sustainability
- Engage suppliers to drive circular and renewable material innovation
- Contribute to external partnerships and industry initiatives
- Drive end-to-end execution from material sourcing → design → product → reverse supply chain
Scope & Impact
- Influences global HP product portfolios (Personal Systems, Print, Supplies)
- Impacts product and packaging material decisions at scale
- Directly contributes to:
- Circular and renewable material adoption
- Packaging transformation
- Reuse and repair expansion
- Enables regulatory compliance, cost optimization, and product differentiation
Minimum Qualifications
- Bachelor’s degree in Engineering (Mechanical, Materials, Packaging, Environmental, or related)
- 8–12+ years of relevant experience
- Demonstrated expertise in:
- Circular economy and sustainable materials
- Packaging engineering and/or materials science
- Recycled and/or renewable materials integration
- Experience working across global supply chains
- Strong problem-solving and cross-functional collaboration skills
Preferred Qualifications
- Master’s degree in Engineering or related field
- Experience in electronics, manufacturing, or consumer hardware
- Knowledge of:
- EU CSRD / ESRS
- Ecolabels (EPEAT, TCO, Blue Angel)
- Experience with:
- Digital transformation and data systems
- Lifecycle assessment (LCA)
- Circular services (reuse, refurbishment, ITAD)
- Familiarity with:
- Sustainably sourced renewable materials and certifications
- Advanced recycling technologies and critical raw materials
Core Competencies (Workday)
Technical Competencies
- Circular Economy & Materials Innovation
- Packaging Engineering
- Recycled & Renewable Materials Strategy
- Product Lifecycle & Design for Circularity
- Sustainability Data & Digital Systems
Leadership Competencies
- Strategic Thinking
- Cross-Functional Influence
- Innovation Leadership
- Execution Excellence
- Stakeholder Collaboration
Key Performance Indicators (KPIs)
Materials
- % recycled and renewable content in products
- % circular materials across product & packaging
Packaging
- % of circular packaging and recyclability
- Adoption of renewable and recyclable packaging materials
Product Circularity
- Design for circularity adoption (repairability, modularity)
- Lifecycle extension improvements
Reuse & Reverse Supply Chain
- Devices and components reused
- Repair and refurbishment rates
Data & Compliance
- Data completeness and audit readiness
- Compliance with regulatory requirements (CSRD, EPR, PPWR)
Salary
The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
Job -
EngineeringSchedule -
Full timeShift -
No shift premium (Singapore)Travel -
25%Relocation -
NoEqual Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
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