Über diese CUF TD Module Engineer Stelle bei Intel
Job Details:
Job Description:
Note: This role requires regular onsite presence to fulfill essential job responsibilities.
Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.
Qualifications:
Minimum/Basic Qualifications:
Prefer an induvial who possess a MSc/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics with focus on thermal/fluid/packaging assembly process engineering or related engineering background, with at least 3 years of working experience. Bachelor's Degree with strong relevant experience can also be considered.
Fundamental understanding of semiconductor assembly equipment and processes.
Developing new processes through hardware /toolset development is a plus.
Job Type:
Experienced HireShift:
Shift 1 (Malaysia)Primary Location:
Malaysia, KulimAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/AWork Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.