Jobs Companies Black Semiconductor GmbH Technical Program Manager (f/m/d)

Sobre esta vaga de Technical Program Manager (f/m/d) na Black Semiconductor GmbH

Black Semiconductor GmbH · Presencial · Aachen, Germany

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude

In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a skilled Technical Program Manager at Black Semiconductor to lead the development and delivery of next-generation ASIC programs combining electronics and photonics in advanced chiplet packages. You will oversee complete silicon and chiplet product programs from concept through implementation, validation, qualification, and release to production, ensuring delivery against technical, schedule, cost, and quality objectives.

Working closely with engineering teams, product management, external IP partners, qualification providers, supply chain, and operations, you will drive cross-functional execution, identify integration risks early, and align teams around program priorities and milestones. This is a hands-on mid-level role where you will own defined programs end-to-end, combining strong program management skills with sufficient technical fluency to anticipate integration and schedule risks before they impact delivery.

To join our team, you should be excited to

  • Lead cross-functional ASIC and chiplet development programs, defining milestones, integration plans, schedules, critical paths, and risk mitigation strategies from concept through product release.

  • Coordinate the development and delivery of electronic and photonic integrated circuit programs, including multi-die/chiplet integration, known-good-die qualification, development builds, and production readiness.

  • Partner closely with Product Management to translate product requirements and priorities into executable technical program plans, managing scope, dependencies, and schedule trade-offs throughout execution.

  • Own relationships with external IP vendors, qualification providers, and suppliers by coordinating deliverables, review cadences, resource planning, and escalations to ensure alignment with program milestones.

  • Drive Program Core Team execution, resolve technical and cross-functional issues, and communicate progress, risks, and decisions effectively across engineering teams and leadership.

  • Maintain accurate program documentation, ensuring plans, decisions, risks, and deliverables remain current, complete, and accessible.

Your Qualification

  • Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.

  • 5–8 years of experience managing silicon, ASIC, IP, or photonics development programs, with proven ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release.

  • Experience managing complex semiconductor programs involving external IP vendors, qualification providers, or test houses, ideally within chiplet, multi-die, or advanced packaging environments.

  • Strong ability to translate product requirements into executable technical plans, manage priorities and trade-offs, and drive execution through defined milestones, metrics, schedules, risks, and dependencies.

  • Experience leading cross-functional engineering teams and collaborating effectively with Product Management, suppliers, manufacturing partners, and external stakeholders.

  • Hands-on experience with ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, PLM systems, risk management, change control, supplier coordination, and program tracking tools.

  • Strong communication, problem-solving, and stakeholder management skills, with the ability to work independently and within multidisciplinary teams.

  • Results-oriented, proactive, and self-motivated, with strong analytical, creative, and critical thinking skills.

  • Fluency in English is required; German language skills and Program Management certification are considered a plus.

  • Knowledge of semiconductor industry trends and disruptive technologies, including chiplet architectures and advanced packaging ecosystems, is considered a plus.

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development

Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future

We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward

We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry

If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.

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