• Perform AOI and CDWJ Process development activities (Parameters optimization, verification & Freeze) according to project requirements ie timeline, quality and cost
• Create or Update DFMEA ,PFMEA and process specifications with respect to AOI and CDWJ process
• Support engineering and qual builds in accordance to project timeline
• Work with material and equipment suppliers for continuous process improvement
• Participate in Design Rules, Design of Manufacturing (DFM), Gap Analysis and problem solving during development and pre-production stage
• Participate and contribute to generation of new ideas or new packaging technology (from AOI and CDWJ)
• Responsible for technical handshake and knowledge transfer from development to operation
• Participate in the training of other engineers or personnel within his/her area of expertise as and when required
• Performs any other duties as assigned by supervisor

Job Requirement

• At least 5 years in same/related field
• Degree/Masters preferably of in Mechanical or materials engineering
• Good Process/equipment knowledge in semiconductor packaging, assembly especially in AOI/CDWJ for Power packaging
• Statistical Analysis (JMP) & Computer skills, Statistical Stack Up Tolerance Analysis
• Good communication and presentation skills