SILICON PACKAGING TECHNICIAN, SILICON ASSEMBLY (STARLINK)

One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers and leadership.

The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES:

• Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals & dielectrics as well as stripping and etching equipment
• Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy
• Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
• Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or plasma-based singulation on wafers and large-format panels, following & monitoring recipes
• Load and unload materials into molding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs
• Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness
• Operate electrochemical plating tools, including copper electroplaters and seed layer systems, and stripping/etch equipment to process products according to recipes for uniform deposition and precise material removal rates.
• Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, & Strict Electrostatic Discharge (ESD) guidelines

BASIC QUALIFICATIONS:

• High school diploma or equivalency certificate
• 3+ years of professional experience in a hands-on manufacturing environment; OR associate's degree in an engineering, math or science discipline

PREFERRED SKILLS AND EXPERIENCE:

• Bachelor's degree in materials science, electrical engineering, or a related field
• 6+ years of practical experience in high volume semiconductor manufacturing operations
• Proficiency and experience in photolithography (e.g. align, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging
• Proficiency in data analysis and process control software for statistical process control (SPC)
• Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates
• Experience with metrology tools such as confocal scanning acoustic microscopy(C-SAM), 3D profilometers, stereoscopes, optical tensiometers (goniometer), X-Ray fluorescence (XRF)
• Excellent manual dexterity with the ability to work with both hands under a microscope

ADDITIONAL REQUIREMENTS:

• Must be able to work all shifts & be willing to work overtime and/or weekends as needed
• Must be able to dawn & wear (at all times) cleanroom attire (e.g. bouffant caps, gowns, masks, nitrile gloves, ESD footwear, bunny suits, hoods) for full shifts
• Standing for long periods, bending, grasping, sitting, pulling, pushing, stooping & stretching
• Must be able to lift up to 35lbs. unassisted