Lead the design and development of high-performance liquid cooling architectures for SCD-based semiconductor thermal management, including jet impingement, spray, and microjet-based concepts.

Model and optimize fluid flow and heat transfer to define jet/nozzle geometries, flow distribution, pressure, temperature, and operating conditions, including single- and two-phase heat transfer regimes.

Design cooling hardware for prototyping and manufacturing, incorporating fluid distribution, extraction/return paths, and micro-machined features while considering practical fabrication constraints.

Build and experimentally characterize prototypes, analyzing thermal and fluid performance and using test results to iterate and improve designs.

Drive the technical development from initial concept through prototype demonstration and integration with SCD-based semiconductor devices, collaborating with internal engineering and manufacturing teams and external research or fabrication partners as needed.

Degree in Mechanical Engineering, Thermal Engineering, Fluid Mechanics, or a related field; an MSc or PhD is highly valued, particularly when combined with applied R&D and prototype development experience.

Strong background in thermal engineering, fluid dynamics, and heat transfer, with experience developing high-performance liquid cooling systems or devices. Experience with Ansys or COMSOL is a plus

Hands-on experience designing and validating thermal-fluid hardware, with exposure to technologies such as jet impingement, spray cooling, microjets/microfluidics, or other high heat-flux cooling approaches.

Experience with computational and/or analytical thermal-fluid modeling, ideally including CFD, combined with experimental testing and validation.