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Sobre esta vaga de R&D Process Engineer (Hybrid Bonding) na Applied Materials

Applied Materials · Presencial · Singapore,SGP

Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

 

 

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.  

 

 

Role Responsibilities:  

  • Collect data, analyze, and compile reports on basic process engineering experiments
  • Perform hardware characterization on basic systems 
  • Troubleshoot problems, perform Root Cause Analysis, and resolve basic process engineering issues 
  • Measure film properties and organize data/reports for review 
  • Generate internal documentation for products, presentations, and technical reports 
  • Communicate and engage with customers to resolve basic process engineering issues or concerns, under direct supervision 
  • Work with vendor and suppliers, under direct supervision 
  • Become familiar with the process of implementing new technology, products, and analytical instrumentation 

Requirements:

  • PhD or Master Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field
  • Research focus in semiconductor field would be an added advantage
  • > 3 years of semiconductor process development experiences in Hybrid Bonding or other modules
  • Good communication and interpersonal skills
  • Problem-solver attitude with determination and quality-mindset
  • Ability to travel locally and regionally as required

Work Location:

  • Science Park II (Moving to Tampines starting from April 2027)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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