• Monitor process operations to assure conformance to quality standards and engineering specifications 

• Help troubleshoot complex process, quality & yield problems. Document new & revised specifications 

• Provide innovative, real time, quick response, and solutions to operational issues to help maintain manufacturing requirements while maintaining the highest level of quality. 

• Must be physically capable of standing for long periods of time (up to 12 hours) as well as lifting and carrying objects up to 20 pounds  

• Utilize logical and objective data analysis to establish and track metrics to meet objectives. 

• Ability to participate on task force teams across departments and divisions. 

• Ability to train, mentor, develop, and lead associates. 

• Ability to successfully plan, execute, analyze and deliver projects per schedule. 

• Strong data analysis, troubleshooting, teamwork, and communication skills. 

• Solid knowledge of SPC and FDC and its use in troubleshooting and making improvements. 

• Aptitude and desire to learn new skills. 

• Six Sigma certification and/or use of LEAN improvement tools. 

• Demonstrated verbal and written communication skills and be comfortable presenting issues and solutions. 

• Ability to work well in a diverse team environment and multitask. 

• Ability to work with minimal supervision and adjust to rapidly changing priorities. 

• Ability to produce results in a timely manner. 

• Must be self-motivated. 

Preferred Qualifications: 

Minimum of 3 years experience in a semiconductor manufacturing environment

Working knowledge of Excel, JMP, Word, and PowerPoint are preferred. 

A 2-year Technical degree or certificate from an accredited institution in a technical science field is preferred or a combination of education and experience will be accepted. 

Process / Manufacturing knowledge preferred. 

Demonstrate ability to follow written “Out Of Control Action Plan”(OCAP) recoveries. 

Possess ability to be proactive rather than reactive to tool downs by using and interpreting FDC and SPC signals.