Envision Employment Solutions is currently looking for a Physical Design SiP Architect for one of our partners, an IT Services and IT Consulting company.

THE ROLE

As chiplets and system in package designs take over, the architecture no longer stops at the die edge. You'll define the physical architecture of SiP solutions, bringing dies, packaging, power, thermal and signal integrity together into one design that works as a system.

WHAT YOU'LL DO

• Define and document the physical architecture for system in package and chiplet based designs
• Lead architecture decisions on partitioning, die to die interfaces and package integration
• Drive power analysis, power integrity, thermal analysis and EMI considerations at package and system level
• Guide place and route and physical implementation strategy across dies
• Use system modelling (such as SystemC) to evaluate architecture options, including RISC based subsystems
• Write and own architecture definition documents
• Work across design, packaging and system teams to close on performance, power and cost

WHAT WE'RE LOOKING FOR

• 10+ years of experience in physical design and/or SoC architecture
• Hands on experience with SiP, chiplet or advanced packaging projects
• Strong understanding of power integrity, thermal analysis and EMI
• Solid place and route and physical design background
• Experience with SystemC modelling and RISC based architectures
• Strong architecture documentation skills
• Ability to lead technical decisions across multiple teams

YOU'LL THRIVE HERE IF YOU

• You think about the whole package, not just the die
• You enjoy weighing power, thermal and signal trade offs together
• You write architecture documents that people actually follow
• You're excited about where chiplet technology is heading
• You can bring design and packaging teams to one decision