About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

This hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool process interactions for each assembly step in a SiPh Flip Chip assembly.  Focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal stress plan for chiplet and product module reliability qualifications.

A successful candidate would possess assembly expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions.  It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. 

Essential Responsibilities:

• Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.
• Establishment of manufacturing driven design rules.
• Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.
• Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Provides tools and complex analysis of quality issues and associated financial implications
• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
• Ensures standardization of site-based quality processes are executed appropriately
• Drives discipline and qualification robustness through a consistent global qualification process
• Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
  • Perform project management and data analysis
  • Identify and resolve process integration issues and related problems
  • Develop custom or derivative processes to meet customer needs
  • Support new designs with module characterization and design rule development 
  • Work with cross function teams to resolve technical & yield concerns
  • Develop and improve test structures that enable fast and rigorous characterization of process                                     
  • Drive CIP (Continuous improvement plans) to deliver organizational goals
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications:

• MS, or PhD + 4 or more years of experience
• Extensive experience with failure analysis, design of experiments, & packaging process integration.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills

Preferred Qualifications:

• Materials science, thermal, mechanical, simulation background.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.