Role Title: Electronics Assembly Quality Engineer

Role Type: Contractor

Location: Remote

micro1 is engaging Electronics Assembly Quality Engineers to contribute their expertise on a customer project focused on electronics manufacturing quality and reliability. In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters. This opportunity is suited to process and quality engineering professionals with hands-on experience in reviewing X-ray images of area-array solder joints (BGA, CGA, LGA), analyzing solder defects, optimizing reflow processes, and laboratory specialists skilled in counterfeit electronic component screening. Cases span voiding, head-in-pillow, bridging, open joints, reflow profile adjustments, Class 3 acceptance, and component authenticity detection. Contributors may have strengths on either process quality or counterfeit analysis—please indicate your focus.

Scope of Work

1. Analyze and interpret X-ray images of BGA, CGA, and LGA solder joints, identifying defects such as voiding, head-in-pillow, bridging, and opens.
2. Review and suggest improvements to reflow soldering profiles to address process-related solder defects.
3. Provide detailed root cause analysis and recommendations for solder joint anomalies and reliability concerns.
4. Assess real-world cases for IPC Class 3 acceptance, documenting critical observations and decision criteria.
5. Evaluate and outline test laboratory flows for counterfeit electronic component detection and screening.
6. Deliver comprehensive written and verbal summaries of findings, ensuring clarity and actionable guidance.
7. Contribute technical insights that enhance AI training data quality in the field of electronics assembly and component validation.

Preferred Qualifications

1. Extensive hands-on experience in electronics manufacturing process or quality engineering, particularly with area-array packages.
2. Advanced proficiency in interpreting X-ray images and diagnosing solder joint failures.
3. Strong expertise in reflow soldering process optimization and process troubleshooting.
4. Familiarity with IPC acceptance standards, especially Class 3 requirements for critical applications.
5. Experience with counterfeit component detection test methodologies and laboratory practices in component authentication.
6. Exceptional written and verbal communication skills for technical documentation and cross-functional knowledge sharing.
7. Background as either a process engineer, quality engineer, or laboratory analyst in electronics assembly or component screening (specify your strength area).