Anduril’s Manufacturing Engineering team is responsible for rapidly iterating, scaling, and sustaining cutting-edge defense hardware, including autonomous flight vehicles, intelligent ground systems, radar, and sensor payloads. We bridge the gap between complex electrical architecture and physical hardware production. 

As an Electrical Manufacturing Engineer, you will serve as the technical authority for Circuit Card Assemblies (CCA/PCBA), embedded electronics manufacturing, and production test definition across both New Product Introduction (NPI) and rate production. You will embed with hardware design teams to drive rigorous Electrical DFM/DFA/DFT, define manufacturing test coverage and strategies to guide dedicated test engineering teams, lead embedded hardware bring-up on the line, and partner with world-class Electronics Manufacturing Services (EMS) suppliers to achieve high-yield, mission-critical reliability. 

If you are a hands-on electrical problem-solver who understands hardware at the silicon, board, and systems level—and wants to build scalable manufacturing processes for next-generation defense systems—this role is for you. 

 WHAT YOU'LL DO 

• PCBA Design for Manufacturability & Assembly (DFM / DFA): 
  • Partner directly with Electrical Hardware Design Engineers during schematic capture and layout to optimize complex multilayer rigid and rigid-flex boards for automated SMT production. 
  • Review board layouts in Altium Designer, Cadence Allegro, or Mentor Graphics to verify pad geometries, solder mask dams, trace clearances, via-in-pad plating, and component spacing to maximize assembly yields. 
  • Review component footprint, connector section, and active IC packages to ensure manufacturability and functionality with production processes. 
     

• Production Test Strategy & Process Definition: 
  • Ensure the manufacturing test strategy across board and sub-assembly levels are executable. In-Circuit Testing (ICT bed-of-nails), flying probe, boundary scan (JTAG), and connectorized functional verification tests (FVT). Establish test limits, pass/fail criteria, and fault-coverage metrics to hand off to the Manufacturing Test Engineering team.
  • Design for Testability (DFT): Partner with Electrical Design Engineers during schematic capture and layout to drive strict DFT guidelines—ensuring adequate test point density, probe access, net observability, and connector accessibility required for production test fixtures.
  • Test Sequence & Process Integration: Define standard test processes, routing sequences, and flashing/calibration workflows for the factory floor. Work closely with the Manufacturing Test Engineering team to ensure their automated test fixtures, instrumentation racks, and software suites integrate seamlessly into production line routings and MES data tracking.
  • Test Failure Disposition & Testability Feedback: Analyze production test yield fallout and telemetry to identify whether failures stem from component defects, SMT process variation, or test fixture/coverage escapes, feeding actionable data back into the test and design loops. 

• Embedded Hardware Bring-Up, Firmware, & Automation:
  • Develop and utilize diagnostic scripts in Python and Bash to exercise board interfaces, log diagnostic telemetry, and support hardware verification during initial manufacturing bring-up.
  • Support initial board bring-up on the manufacturing line across modern embedded compute platforms, such as AMD/Xilinx Zynq UltraScale+ SoCs, ARM Cortex processors, and high-speed memory interfaces.
  • Define production flashing, secure-key provisioning, and interface validation procedures over embedded buses and protocols: MIL-STD-1553, PCIe, Ethernet, CAN, SPI, I2C, UART, and JTAG.
  • Collaborate with Embedded Software, FPGA, and Test Engineering teams to specify low-level test hooks, firmware images (C/C++), or register-level diagnostic routines needed to validate hardware health. 

• Mil-Spec Quality, Standards, & Failure Analysis:
  • Enforce high-reliability aerospace workmanship standards across internal integration lines and external EMS suppliers in accordance with IPC-A-610 and IPC/WHMA-J-STD-001 (Class 3 criteria).
  • Lead electrical failure analysis (FA) and root-cause investigations (8D) on production fallouts: evaluate microsections, X-ray (AXI) inspections, solder bridging, component counterfeit screening, and ESD damage down to the component level.
  • Support environmental stress screening (ESS), including manufacturing screening strategies aligned with MIL-STD-810 (vibration/shock/thermal), MIL-STD-461 (EMI/EMC), and MIL-STD-704 (power quality) guidelines. 

• EMS Partner Management & Production Line Integration:
  • Qualify and audit external PCBA contract manufacturers (EMS), reviewing SMT stencil designs, solder paste inspection (SPI), automated optical inspection (AOI), reflow thermal profiles, and conformal coating/potting applications.
  • Transition Engineering BOMs (eBOMs) into production-ready Manufacturing BOMs (mBOMs) within PLM (Teamcenter), ensuring electrical alternate components are qualified and traceable.
  • Author clear standard operating procedures (SOPs) and work instructions for electronics handling, ESD control, wire harness interconnects, and module-level box builds. 

 REQUIRED QUALIFICATIONS 

• B.S. in Electrical Engineering, Computer Engineering, or equivalent engineering field. 
• 3+ years of experience in an electrical manufacturing, PCBA industrialization, or hardware engineering role with heavy exposure to board-level manufacturing and integration (aerospace, defense, automotive, medical, or telecommunications).
• Proficiency with ECAD tools: Experience navigating, reviewing, and redlining schematics and layouts in Altium Designer, Cadence Allegro, or Mentor Graphics/PADS.
• Hands-on PCBA production experience: Deep understanding of SMT manufacturing, component placement, reflow profiling, wave/selective soldering, and DFM principles for rigid and rigid-flex boards.
• Test process & DFT background: Demonstrated experience defining test coverage, test point guidelines, and manufacturing test strategies (ICT bed-of-nails, functional verification, boundary scan) to inform dedicated test engineering teams.
• Scripting & automation skills: Proficiency with Python or Bash for automated hardware interaction, instrument control, or test log parsing.
• Embedded protocols: Hands-on experience debugging, flashing, or testing over standard interfaces: CAN, Ethernet, I2C, SPI, UART, and JTAG.
• Working knowledge of IPC-A-610 and IPC J-STD-001 electronic assembly standards.
• U.S. Person status is required as this position needs to access export-controlled data. 

 PREFERRED QUALIFICATIONS 

• 5+ years of experience taking complex electronic systems from NPI through full-rate production.
• Experience with AMD/Xilinx Zynq UltraScale+, FPGA architectures, or high-speed digital designs (PCIe, multi-gigabit Ethernet).
• Familiarity with military and aerospace compliance standards, including MIL-STD-461 (EMI/EMC), MIL-STD-810, MIL-STD-704, and DO-254 hardware development life cycles.
• Experience with complex board architectures: multilayer high-speed digital boards (12+ layers), rigid-flex circuits, HDI, and blind/buried microvias.
• Experience utilizing Siemens Teamcenter (PLM), modern ERP/MES platforms, and Jira for engineering workflow tracking.
• IPC-A-610 / J-STD-001 Application Specialist (CIS) or Trainer (CIT) certification.