Wire Bond Process Manager

Job Summary

This role is responsible for leading and managing sustaining engineering activities across Wire Bond, Molding, Plating, Singulation, and Trim & Form processes within a semiconductor assembly manufacturing environment.

What You Need to Do

• Lead and develop sustaining engineering teams supporting Wire Bond, Molding, Plating, Singulation, and Trim & Form processes.
• Drive process stability, robustness, and continuous improvement across all assigned manufacturing areas.
• Lead yield improvement and defect reduction initiatives using structured problem-solving methodologies.
• Resolve complex manufacturing issues through Root Cause Analysis, 8D, 5 Why, FMEA, DOE, and statistical analysis tools.
• Manage process qualifications, technology transfers, package conversions, and New Product Introduction (NPI) activities.
• Collaborate with Production, Quality, Equipment Engineering, Maintenance, Product Engineering, and customers to address technical challenges and improve manufacturing performance.
• Establish and monitor key process metrics to ensure achievement of factory goals and targets.
• Drive cost reduction, productivity improvement, equipment utilization, and cycle time optimization initiatives.
• Provide technical guidance, coaching, and career development to engineers and technicians.
• Support customer audits, reliability investigations, and quality improvement programs.

What You Need to Have

• Strong technical expertise in Wire Bond, Molding, Plating, Singulation, and Trim & Form semiconductor processes.
• Proven track record in yield improvement and defect reduction within a semiconductor manufacturing environment.
• Strong problem-solving skills using 8D, 5 Why, FMEA, DOE, SPC, and Root Cause Analysis methodologies.
• Experience leading and developing process engineering and technician teams.
• Experience managing new package qualifications, technology transfer projects, and NPI activities.
• Strong collaboration with Production, Quality, Maintenance, Equipment Engineering, Product Engineering, and Customers.
• Results-oriented leader capable of driving factory KPIs including Yield, Scrap Reduction, Cost Improvement, Productivity, and Customer Satisfaction.
• Strong stakeholder management, leadership, and communication skills.

• Bachelor's degree in Mechanical, Electrical, Mechatronics or equivalent.
• 10+ years semiconductor equipment experience.
• 5+ years leadership experience.
• Lean Six Sigma and TPM knowledge.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.