Key Responsibilities

• Maintain and support wire bond equipment to ensure high uptime and reliability.
• Troubleshoot equipment issues and implement effective corrective actions.
• Perform preventive maintenance and drive continuous equipment improvements.
• Support production operations and minimize equipment downtime.
• Work with Process, Production, and Quality teams to improve yield and product quality.
• Lead and drive equipment qualification, sustaining , upgrade and automation projects.
• Analyze equipment performance data and implement productivity improvements.
• Develop and maintain maintenance procedures, work instructions, and technical documentation.
• Train and mentor technicians on equipment operation and troubleshooting.

Requirements

• Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred).
• Minimum 3 years of semiconductor manufacturing experience.
• Strong troubleshooting and root cause analysis skills.
• Familiar with SPC, FMEA, 8D, and continuous improvement methodologies.
• Good communication and teamwork skills.
• Able to support a fast-paced manufacturing environment.

Preferred Qualifications

• TOEIC >600 or other English comprehensive certification
• Experience with wire bonder, eg K&S Rapid; ASM AERO...etc
• Knowledge of automation, SECS/GEM, and equipment data analysis.
• Six Sigma Green Belt or equivalent certification.

More information about NXP in Greater China...