HRL Laboratories pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers – ready for real-world application. For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other — often in unexpected, profound and far-reaching ways. As a private company owned jointly by Boeing and GM, HRL prioritizes purpose over profit, significantly advancing the state of the art.

HRL Laboratories develops radiofrequency, millimeter-wave and electro-optical sensors using state-of-the-art materials and device fabrication processes to deliver agile, mission-ready systems. Our high-performance solutions are highly integrated, architecturally low cost, and optimized for size, weight and power efficiency while leveraging commercial, custom and novel mixed-signal innovations.

The Mixed Signal Solutions department at HRL Laboratories is composed of a multidisciplinary team of scientists and engineers supporting quantum computing research. The team develops and integrates leading edge mixed signal systems involving novel architectures, advanced algorithms, custom integrated circuits (ICs), printed circuit boards (PCBs), and state of the art packaging and integration techniques. As a member of this group, you will contribute to designing electronic solutions that transition innovative concepts into prototype hardware.

Essential Duties:

•    Design and implement engineering solutions for electrical and electronic components, analog and digital subsystems, and associated algorithms, ensuring alignment with established engineering principles and development guidelines
•    Create board level design requirements, schematics, and test plans for existing designs, including tolerance verification, form/fit/function assessment, signal and power integrity analysis, thermal characterization, and system level power measurements for printed circuit assemblies
•    Collaborate closely with internal stakeholders and external vendors throughout hardware design and development cycles 
•    Analyze product requirements from both system and hardware perspectives to propose high performance, cost effective solutions

Required Qualifications:

•    BS, MS in Electrical Engineering, Physics, or related scientific discipline
•    Experience taking complex designs through the full hardware development cycle, including specification, schematic capture, layout, bring up, characterization, and testing 
•    Proficient in system bring up and debugging of complex embedded systems
•    Skilled in high speed digital design (e.g., PCIe, SERDES, HDMI) 
•    Proficient with CAD tools—preferably Allegro—for design, layout, and simulation

•    Proficiency in the use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues, and willingness to work in a fast-paced, deadline-driven environment. 
•    Ability to work well in a team and independently. 

Preferred Qualifications:

•    Possess a solid working knowledge of fundamental high speed electrical engineering and circuit design principles
•    Familiarity with power integrity concepts such as decoupling strategies, transient response, and PDN design
•    Understanding of signal integrity topics including crosstalk, insertion and return loss, termination techniques, BGA breakout strategies, and fabrication material selection 
•    Knowledge of test procedures and equipment, particularly RF measurement tools such as VNAs and TDRs
•    Proficient with Microsoft Office applications (Word, Excel, PowerPoint) and capable of producing technical documentation

Physical Requirements:

•    Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity  

Special Requirements: